Printed circuit devices using thermoplastic resin cover plate

Claim 2

A printed circuit device comprising: (a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material; (b) a plurality of semiconductor integrated circuit chips each adhesively mounted on a respective one of said mounting regions with a conductive adhesive paste material; (c) metal wires electrically connecting electrodes of said chips with said conductive wiring layers; (d) a protective layer formed over said wiring layers for protecting said wiring layers from damage, said protective layer being of a plastic resin material; (e) a layer of a thermoplastic resin material formed on the surface of said protective layer; and (f) a sealing cover plate of a thermoplastic resin material adhesively mounted on the surface of said board through a heat bonding process, said plate having a plurality of recessed portions, each of which hermetically accommodates one of said chips, said recessed portions of said sealing cover plate being separated from said chips by an empty space.

Claim 3

A printed circuit device according to claim 1, wherein said printed circuit board has positioning holes located near a periphery of said board and wherein said sealing cover plate has a plurality of projections respectively inserted into said holes for providing easy alignment of said sealing cover plate with said board.

Claim 4

A printed circuit device according to claim 1, wherein said thermoplastic resin material comprises a material selected from the group consisting of polyethylene, polypropylene and polymethylpentene.

Claim 5

A printed circuit device according to claim 3, further comprising a plurality of frame means of a resin impregnated material each mounted on said protective layer and surrounding one of said semiconductor integrated circuit chips and said metal wires; and a sealing material layer filled in said frame means to protect each of said chips from moisture.

Claim 6

A printed circuit device according to claim 3, further comprising a metal layer next to said cover of a thermoplastic resin material to mechanically strengthen said cover.

Claim 7

A printed circuit device comprising: (a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material; (b) a plurality of semiconductor integrated circuit chips each adhesively mounted on a respective one of said mounting regions with a conductive adhesive paste material; (c) metal wires electrically connecting electrodes of said chips with said conductive wiring layers; (d) a protective layer formed over said wiring layers for protecting said wiring layers from damage, said protective layer being of a plastic resin material; (e) a layer of a thermoplastic resin material formed on the surface of said protective layer; and (f) a sealing cover plate of a thermoplastic resin material adhesively mounted on the surface of said board through a heat bonding process, said plate having a plurality of recessed portions, each of which hermetically accommodates one of said chips, said sealing cover plate including a flat portion thereof surrounding each of said recessed portions, said flat portion being adhered to said layer of thermoplastic resin on the surface of said protective layer.

Claim 8

A printed circuit device comprising: (a) a printed circuit board having on the surface thereof a plurality of semiconductor element mounting regions and a plurality of conductive wiring layers, said printed circuit board being of an electrically insulating material; (b) a plurality of semiconductor integrated circuit chips each adhesively mounted on a respective one of said mounting regions with a conductive adhesive paste material; (c) metal wires electrically connecting electrodes of said chips with said conductive wiring layers; (d) a protective layer formed over said wiring layers for protecting said wiring layers from damage, said protective layer being of a plastic resin material; (e) a layer of a thermoplastic resin material formed on the surface of said protective layer; and (f) a sealing cover plate of a thermoplastic resin material adhesively mounted on the surface of said board through a heat bonding process, said plate having a plurality of recessed portions, each of which hermetically accommodates one of said chips, said sealing cover plate including a flat portion thereof surrounding each of said recessed portions, said flat portion being adhered to said layer of thermoplastic resin on the surface of said protective layer.