JPS63152159A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture of semiconductor package
Assignee: Kyocera Corp
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Filing: 1986-12-17
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Granted: —
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Expires: 2006-12-17
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 Hirobumi Kinoshita
- 👤 博文 木下
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-04 22:04
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/117
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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