US6168970B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ultra high density integrated circuit packages
Assignee: Entorian Technologies Inc
•
Filing: 1999-11-05
•
Granted: 2001-01-02
•
Expires: 2019-11-05
Abstract
Abstract Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. These level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:27
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W74/00; H10W74/01; H10W74/016; H10W90/00; H10W70/00; H10W70/40; H10W70/60; H10W72/00; H10W72/801; H10W90/20; H10W90/288
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
67 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises an integrated circuit element surrounded by a casing, said package having a first and a second major surface, and a perimeter wall defining the package height; and (b) reducing the height of said package by uniformly removing material from one or both of said major surfaces.
Claim 2
Independent Claim
67 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises an integrated circuit element surrounded by a casing, said package having a first and a second major surface, and a perimeter wall defining the package height; and (b) reducing the height of said package by uniformly removing material from one or both of said major surfaces.
Claim 3
Independent Claim
90 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing which surrounds said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; and (b) uniformly removing material from said lower surface of said casing until said lower surface of said integrated circuit element is exposed.
Claim 4
Independent Claim
90 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing which surrounds said integrated circuit element, said casing having an upper surface, a lower surface and a perimeter wall; and (b) uniformly removing material from said lower surface of said casing until said lower surface of said integrated circuit element is exposed.
Claim 5
Dependent Claim
21 words
The method of claim 2 , further comprising the step of uniformly removing material from said upper surface of said casing.
Claim 6
Dependent Claim
23 words
The method of claim 2 , further comprising the step of uniformly removing material from said lower surface of said integrated circuit element.
Claim 7
Dependent Claim
21 words
The method of claim 4 , further comprising the step of uniformly removing material from said upper surface of said casing.
Claim 8
Independent Claim
85 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing covering said upper surface and said perimeter wall of said integrated circuit element, said casing having an upper surface, and a perimeter wall; and (b) uniformly removing material from said lower surface of said integrated circuit element.
Claim 9
Independent Claim
85 words
A method of forming a thin integrated circuit package, comprising the steps of: (a) providing an integrated circuit package which comprises, an integrated circuit element formed on a semiconductor substrate, said integrated circuit element having an upper surface, a lower surface, and a perimeter wall, and a casing covering said upper surface and said perimeter wall of said integrated circuit element, said casing having an upper surface, and a perimeter wall; and (b) uniformly removing material from said lower surface of said integrated circuit element.
Claim 10
Dependent Claim
21 words
The method of claim 6 , further comprising the step of uniformly removing material from said upper surface of said casing.
Claim 11
Independent Claim
91 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages each having a plurality of electrical interconnect leads extending therefrom; (b) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; (c) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and (d) thermally and electrically coupling said rails to some or all of said leads in said columns.
Claim 12
Independent Claim
91 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages each having a plurality of electrical interconnect leads extending therefrom; (b) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; (c) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and (d) thermally and electrically coupling said rails to some or all of said leads in said columns.
Claim 13
Independent Claim
125 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element; (b) rendering one or more select leads of the lead frame in each level-one package inactive; (c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; and (d) electrically coupling all of said leads which are aligned in said columns and extend externally from said level-one packages.
Claim 14
Independent Claim
125 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element; (b) rendering one or more select leads of the lead frame in each level-one package inactive; (c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; and (d) electrically coupling all of said leads which are aligned in said columns and extend externally from said level-one packages.
Claim 15
Dependent Claim
42 words
The method of claim 9 , wherein said leads have a section external to said package and a section internal to said package, and wherein said one or more select leads of each package are rendered inactive by disconnecting said external section.
Claim 16
Dependent Claim
47 words
The method of claim 9 , wherein said leads have a section external to said package and a section internal to said package, and wherein said one or more select leads are rendered inactive by disconnecting said electrical path of said internal section of said select leads.
Claim 17
Dependent Claim
25 words
The method of claim 9 , wherein said one or more select inactive leads of each level-one package provide a unique address for each package.
Claim 18
Dependent Claim
27 words
The method of claim 9 , wherein said one or more select inactive leads of each level-one package provide a unique data word bit-position for each package.
Claim 19
Independent Claim
145 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element; (b) rendering one or more select leads of the lead frame in each level-one package inactive; (c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; (d) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and (e) thermally and electrically coupling said rails to some or all of said leads in said columns and external to said level-one packages.
Claim 20
Independent Claim
145 words
A method of forming a modular integrated circuit package, comprising the steps of: (a) providing a plurality of level-one integrated circuit packages, each including an integrated circuit element formed on a semiconductor substrate, and a lead frame electrically coupled to said integrated circuit element and having a plurality of electrical interconnect leads extending therefrom which provide an electrical path to said integrated circuit element; (b) rendering one or more select leads of the lead frame in each level-one package inactive; (c) aligning said level-one packages in a stacked configuration so that said leads from said level-one packages are aligned in an array of columns; (d) mounting a plurality of thermally and electrically conductive rails adjacent to and oriented with said columns; and (e) thermally and electrically coupling said rails to some or all of said leads in said columns and external to said level-one packages.
Claim 21
Dependent Claim
42 words
The method of claim 14 , wherein said leads have a section external to said package and a section internal to said package, and wherein said one or more select leads of each package are rendered inactive by disconnecting said external section.
Claim 22
Dependent Claim
47 words
The method of claim 14 , wherein said leads have a section external to said package and a section internal to said package, and wherein said one or more select leads are rendered inactive by disconnecting said electrical path of said internal section of said select leads.
Claim 23
Dependent Claim
25 words
The method of claim 14 , wherein said one or more select inactive leads of each level-one package provide a unique address for each package.
Claim 24
Dependent Claim
27 words
The method of claim 14 , wherein said one or more select inactive leads of each level-one package provide a unique data word bit-position for each package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-02 | 2004-07-03 | 2005-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-02 | 2008-07-03 | 2009-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-02 | 2012-07-03 | 2013-01-02 | $7700.00 | Window Closed / Lapsed |