US5139969A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making resin molded semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1991-07-01
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Granted: 1992-08-18
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Expires: 2011-07-01
Abstract
Abstract A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encapsulating the semiconductor element in a sealing resin in a mold and then dissolving the coating resin. Then, a metal is disposed in the holes formed in the sealing resin to provide external electrodes. Since the external electrodes are provided on the electrodes of the semiconductor element, the packaging area has the same dimensions as the resin package, and the packaging area of the semiconductor device can be reduced.
Inventors
- 👤 Ryuichiro Mori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:23
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
80 words
A method of producing a resin molded semiconductor device comprising: applying a coating resin to the electrodes of a semiconductor element; placing said semiconductor element on a die pad of a lead frame; encapsulating said semiconductor element and lead frame in a sealing resin in a mold with said mold contacting the coated resin; selectively dissolving said coating resin to form holes in said sealing resin extending to said electrodes; and disposing metal in said holes to form external electrodes.
Claim 2
Independent Claim
80 words
A method of producing a resin molded semiconductor device comprising: applying a coating resin to the electrodes of a semiconductor element; placing said semiconductor element on a die pad of a lead frame; encapsulating said semiconductor element and lead frame in a sealing resin in a mold with said mold contacting the coated resin; selectively dissolving said coating resin to form holes in said sealing resin extending to said electrodes; and disposing metal in said holes to form external electrodes.
Claim 3
Dependent Claim
13 words
A method according to claim 1 including forming said external electrodes by plating.
Claim 4
Dependent Claim
14 words
A method according to claim 1 wherein said coating resin is a vinyl resin.
Claim 5
Dependent Claim
14 words
A method according to claim 1 wherein said coating resin is an acrylic resin.
Claim 6
Dependent Claim
14 words
A method according to claim 1 including selectively dissolving said coating resin with acetone.
References Cited (Backward Citations)
NL7606781A
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JPS5310272A
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JPS55121662A
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JPS5848947A
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JPS61220346A
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US4704369A
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JPS6355963A
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JPS63258050A
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JPS63308329A
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JPS646449A
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JPH0249460A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-08-18 | 1996-02-17 | 1996-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-08-18 | 2000-02-17 | 2000-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-08-18 | 2004-02-17 | 2004-08-18 | $7700.00 | Window Closed / Lapsed |