Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To prevent the bonding of resin and a semiconductor element, and to exchange defective elements easily by sealing the element with resin while leaving a bump before joining. CONSTITUTION:When resin 3 (Si group resin) repelling the sealing resin 4 (an epoxy group) is applied at the noses of the bumps 2 of an LSI chip 1 and the bumps are dipped into the liquid of the resin 4 and pulled up, the resin 4 does not adhere on the nose sections. The resin 4 is thermally cured, the resin 3 is removed, and the wiring conductors 6 of a substrate 5 and the bumps 2 are joined. When the films of the resin 3 are thin, the conductors and the bumps can be joined even when the resin 3 is not removed particularly. According to this constitution, defective elements are easily exchanged, and the yield of the substrate is improved.

Inventors

• 👤 Yoshio Okajima
• 👤 良男 岡嶋

Bibliographic Details