Patent US3215861A successfully refreshed from Google Patents.
US4821148A
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Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound
Assignee: Hitachi Ltd
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Filing: 1986-06-04
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Granted: 1989-04-11
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Expires: 2006-06-04
Abstract
Abstract A silver electrode (4) on a lead frame (2) is bonded to an aluminum electrode (5) on a silicon chip (1) with a copper wire (3). The resulting semiconductor device was immersed in a solution of benzotriazole in ethyl alcohol. An Ag-benzotriazole film (6) was formed on the surface of the silver electrode (4) and a Cu-benzotriazole film (7) was formed on the surface of the copper wire (3), while an Al-benzotriazole film (8) was formed on the surface of the aluminum electrode (5). Even if water penetrates into the semiconductor device, the silver electrode (4), the aluminum electrode (5) and the copper wire (3) are effectively protected by the anti-corrosive Ag-benzotriazole film (6), Cu-benzotriazole film (7) and Al-benzotriazole film (8) to exhibit excellent damp-proof.
Inventors
- 👤 Shiro Kobayashi
- 👤 Masahiko Itoh
- 👤 Akira Minato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 21:07
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W72/00; H10W72/50; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W90/811; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
204 words
A resin packaged semiconductor device having at least one protective layer formed on a semiconductor element mounted on a lead frame and metal surfaces of electric connecting metal parts and a resin package covering said at least one protective layer and said semiconductor element, said at least one protective layer being made of a metal-organic matter compound which is a reaction product between an organic matter and the metal surfaces of said electric connecting metal parts; said organic matter being a substance which reacts with said metal surfaces to give a compound which is difficultly soluble in water and being selected from the group consisting of a triazole, a sodium benzoate, an azelaic acid, a quinaldic acid, a rubeanic acid and a cupferron; said reaction product being formed by contact of the metal surfaces with a solution of the organic matter in a non-aqueous solvent; and said at least one protective layer acting to protect said electric connecting parts from moisture and to prevent the penetration of moisture into said semiconductor element by adhesion between said electric connecting parts and said resin; said semiconductor device being immersed in a solution of said organic matter in alcohol to form said at least one protective layer.
Claim 2
Dependent Claim
204 words
A resin packaged semiconductor device having at least one protective layer formed on a semiconductor element mounted on a lead frame and metal surfaces of electric connecting metal parts and a resin package covering said at least one protective layer and said semiconductor element, said at least one protective layer being made of a metal-organic matter compound which is a reaction product between an organic matter and the metal surfaces of said electric connecting metal parts; said organic matter being a substance which reacts with said metal surfaces to give a compound which is difficultly soluble in water and being selected from the group consisting of a triazole, a sodium benzoate, an azelaic acid, a quinaldic acid, a rubeanic acid and a cupferron; said reaction product being formed by contact of the metal surfaces with a solution of the organic matter in a non-aqueous solvent; and said at least one protective layer acting to protect said electric connecting parts from moisture and to prevent the penetration of moisture into said semiconductor element by adhesion between said electric connecting parts and said resin; said semiconductor device being immersed in a solution of said organic matter in alcohol to form said at least one protective layer.
Claim 3
Dependent Claim
16 words
A resin packaged semiconductor device set forth in claim 1 wherein said alcohol is ethyl alcohol.
Claim 4
Dependent Claim
18 words
A resin packaged semiconductor device as set forth in claim 2 wherein said organic matter is a triazole.
Claim 5
Dependent Claim
226 words
A resin packaged semiconductor device having protective layers formed on a silicon chip mounted on a lead frame and on metal surfaces of a silver electrode on the lead frame, an aluminum electrode on the silicon chip, and a copper wire connecting the silver electrode and the aluminum electrode, and an epoxy resin package covering the silicon chip, lead frame and metal surfaces; said protective layers on said silver electrode, said aluminum electrode and said copper wire being, respectively, made of a silver-organic matter compound, an aluminum-organic matter compound and a copper organic matter compound; said organic matter being a substance which reacts with silver, aluminum and copper to give compounds which are difficultly soluble in water and which is selected from the group consisting of a triazole, a sodium benzoate, an azelaic acid, a quinaldic acid, a rubeanic acid and a cupferron; said protective layers being formed by contact of the metal surfaces with a solution of said organic matter in a non-aqueous solvent and said protective layers acting to protect said silver electrodes, said aluminum electrodes and said copper wire from moisture and to prevent the penetration of moisture into said semiconductor element by adhesion between said silver electrode, said aluminum electrode and said copper wire and said resin; said semiconductor device being immersed in a solution of said organic matter in an alcohol.
Claim 6
Dependent Claim
226 words
A resin packaged semiconductor device having protective layers formed on a silicon chip mounted on a lead frame and on metal surfaces of a silver electrode on the lead frame, an aluminum electrode on the silicon chip, and a copper wire connecting the silver electrode and the aluminum electrode, and an epoxy resin package covering the silicon chip, lead frame and metal surfaces; said protective layers on said silver electrode, said aluminum electrode and said copper wire being, respectively, made of a silver-organic matter compound, an aluminum-organic matter compound and a copper organic matter compound; said organic matter being a substance which reacts with silver, aluminum and copper to give compounds which are difficultly soluble in water and which is selected from the group consisting of a triazole, a sodium benzoate, an azelaic acid, a quinaldic acid, a rubeanic acid and a cupferron; said protective layers being formed by contact of the metal surfaces with a solution of said organic matter in a non-aqueous solvent and said protective layers acting to protect said silver electrodes, said aluminum electrodes and said copper wire from moisture and to prevent the penetration of moisture into said semiconductor element by adhesion between said silver electrode, said aluminum electrode and said copper wire and said resin; said semiconductor device being immersed in a solution of said organic matter in an alcohol.
Claim 7
Dependent Claim
17 words
A resin packaged semiconductor device set forth in claim 4 wherein said alcohol is an ethyl alcohol.
Claim 8
Dependent Claim
18 words
A resin packaged semiconductor device as set forth in claim 4 wherein said organic matter is a triazole.
Claim 9
Dependent Claim
17 words
A resin packaged semiconductor device as set forth in claim 6 wherein said triazole is a benzotriazole.
Claim 10
Dependent Claim
26 words
A resin packaged semiconductor device as set forth in claim 7 wherein the semiconductor device is immersed in a solution of a benzotriazole in ethyl alcohol.
Claim 11
Dependent Claim
27 words
A resin packaged semiconductor device as set forth in claim 8 wherein said protective layers are respectively, a silver-benzotriazole film, an aluminum-benzotriazole film, and a copper benzotriazole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-04-10 | 1992-10-10 | 1993-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-04-10 | 1996-10-10 | 1997-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-04-10 | 2000-10-10 | 2001-04-11 | $7700.00 | Window Closed / Lapsed |