Method for encapsulating discrete semiconductor chips

Abstract

Abstract Disclosed is a method for encapsulating one or more discrete semiconductor chips to expose one surface thereof for metallization. The method includes forming a layer of a soft metal to overlie a relatively large substrate, pressing a surface of each discrete semiconductor chip into the soft metal and then encapsulating the semiconductor chip with suitable encapsulating material. The substrate and soft metal layer attached thereto are then removed from the encapsulated semiconductor chip exposing a surface of the chip. In one embodiment a heat sink is electroplated to the chip and the encapsulating material is removed, leaving a discrete semiconductor chip. In a different embodiment, the encapsulated semiconductor chip is utilized as a part of an integrated circuit.

Inventors

• 👤 T Hasty

Bibliographic Details