Three dimensional packaging arrangement for computer systems and the like

Claim 1

In an arrangement for packaging planar arrays of circuit components, said arrangement including a substrate having circuit board means therein, with at least one layer of insulating material covering the circuit board means, and electrical connection means providing electrical connections on the upper surface of the layer of insulating material and around its periphery, and a plurality of conductors running through the substrate to bottom electrical connection means on the substrate and electrically joined to selected ones of the electrical connection means through the layer of insulating material to the circuit board means; an improvement comprising: shell means of insulating material housing the substrate, the shell means having a lower surface with at least one slot cut into the lower surface allowing the circulation of cooling agent, and an upper surface with a hollow indentation in the upper surface which receives the substrate; the shell further including rails, said rails including vertical conductors from the bottom to the top of the shell means, said rails further including means electrically joining the electrical connection means from the bottom surface of the substrate to the electrical connections on the upper surface of a next adjoining layer.