US5223739A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic molded semiconductor device having waterproof cap
Assignee: Toshiba Corp
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Filing: 1990-09-13
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Granted: 1993-06-29
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Expires: 2010-09-13
Abstract
Abstract A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture.
Inventors
- 👤 Akio Katsumata
- 👤 Seiichi Hirata
- 👤 Shinetsu Fujieda
- 👤 Hiroshi Shimozawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:53
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W42/00; H10W74/01; H10W74/016; H10W74/10; H10W74/131; H10W74/147; H10W76/00; H10W76/40; H10W90/00; H10W90/811; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
157 words
A plastic-encapsulated semiconductor device comprising: a die pad having a rectangular shape; a semiconductor chip mounted on said die pad and having a plurality of electrodes; a plurality of lead portions, each of which is electrically connected to one of said plurality of electrodes of said semiconductor chip via a bonding wire and having an inner lead; a mold plastic in which said semiconductor chip and each inner lead of said portions are encapsulated by molding; and a cap formed as a pair of moisture proof parts, each part of which is formed in a cap-shape, consisting of a flat portion and slant members and which are disposed at positions for surrounding upper and lower surfaces of said semiconductor chip, and are fixed to said mold plastic in a manner so that at least said slant portions are buried in said mold plastic, so that an inner portion between said parts is filled by said mold plastic.
Claim 2
Dependent Claim
157 words
A plastic-encapsulated semiconductor device comprising: a die pad having a rectangular shape; a semiconductor chip mounted on said die pad and having a plurality of electrodes; a plurality of lead portions, each of which is electrically connected to one of said plurality of electrodes of said semiconductor chip via a bonding wire and having an inner lead; a mold plastic in which said semiconductor chip and each inner lead of said portions are encapsulated by molding; and a cap formed as a pair of moisture proof parts, each part of which is formed in a cap-shape, consisting of a flat portion and slant members and which are disposed at positions for surrounding upper and lower surfaces of said semiconductor chip, and are fixed to said mold plastic in a manner so that at least said slant portions are buried in said mold plastic, so that an inner portion between said parts is filled by said mold plastic.
Claim 3
Dependent Claim
134 words
A plastic-encapsulated type of semiconductor device comprising: a die pad having a rectangular shape; a semiconductor chip mounted on said die pad and having a plurality of electrodes; `a plurality of lead portions, each of which is electrically connected to one of said electrodes of said semiconductor chip via a bonding wire and having an inner lead; a mold plastic in which said semiconductor chip and each inner lead of said lead portions are encapsulated by molding; a first metal layer having good adhesion to said mold plastic formed on the upper and lower surfaces of said mold plastic by means of non-electrolytic plating, so that said metal layer is not in contact with said lead portions; and a second metal layer laminated by electrolytic plating onto the surface of said first metal layer.
Claim 4
Dependent Claim
134 words
A plastic-encapsulated type of semiconductor device comprising: a die pad having a rectangular shape; a semiconductor chip mounted on said die pad and having a plurality of electrodes; `a plurality of lead portions, each of which is electrically connected to one of said electrodes of said semiconductor chip via a bonding wire and having an inner lead; a mold plastic in which said semiconductor chip and each inner lead of said lead portions are encapsulated by molding; a first metal layer having good adhesion to said mold plastic formed on the upper and lower surfaces of said mold plastic by means of non-electrolytic plating, so that said metal layer is not in contact with said lead portions; and a second metal layer laminated by electrolytic plating onto the surface of said first metal layer.
Claim 5
Dependent Claim
20 words
A plastic molded semiconductor device of claim 1, wherein a pair of aluminum caps are used as said moistureproof material.
Claim 6
Dependent Claim
23 words
The plastic molded semiconductor device of claim 3, wherein at least one surface of aid pair of caps is exposed to the outside.
Claim 7
Dependent Claim
28 words
The plastic molded semiconductor device of claim 4, wherein insulation coating is implemented for a surface of said cap, the surface of which is exposed to the outside.
Claim 8
Dependent Claim
17 words
The plastic molded semiconductor device of claim 1, wherein aluminum film is used as said moistureproof material.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-28 | 1996-12-28 | 1997-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-28 | 2000-12-28 | 2001-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-28 | 2004-12-28 | 2005-06-29 | $7700.00 | Window Closed / Lapsed |