US6300782B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for testing semiconductor components having flexible interconnect
Assignee: Micron Technology Inc
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Filing: 2001-06-04
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Granted: 2001-10-09
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Expires: 2021-06-04
Abstract
Abstract A system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an interconnect for electrically engaging the components. The interconnect includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The thinned substrate has a thickness that is substantially less than a thickness of the components being tested. The thinned substrate can flex upon application of a biasing force by the testing apparatus, permitting the first contacts to move in the z-direction to accommodate variations in the planarity of the second contacts.
Inventors
- 👤 David R. Hembree
- 👤 Derek Gochnour
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:15
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; H; H01; H01R; H01R13/00; H01R13/02; H01R13/22; H01R13/24; G01R1/06711; G01R1/06733; G01R1/06738; G01R1/06755; G01R1/06761; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49204; Y10T29/49208; Y10T29/49224
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
137 words
A system for testing a semiconductor component comprising: a testing apparatus comprising a base and a force applying mechanism attached to the base for applying a biasing force to the component; an interconnect on the base comprising a thinned substrate having a thickness substantially less than that of the component, and a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component; and a compliant polymer layer attaching the thinned substrate to the base such that the thinned substrate can flex and the first contacts can move with the thinned substrate in a z-direction upon application of the biasing force to accommodate variations in a planarity of the second contacts, the compliant polymer layer comprising a conductive polymer configured to provide electrical paths to the first contacts.
Claim 2
Independent Claim
137 words
A system for testing a semiconductor component comprising: a testing apparatus comprising a base and a force applying mechanism attached to the base for applying a biasing force to the component; an interconnect on the base comprising a thinned substrate having a thickness substantially less than that of the component, and a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component; and a compliant polymer layer attaching the thinned substrate to the base such that the thinned substrate can flex and the first contacts can move with the thinned substrate in a z-direction upon application of the biasing force to accommodate variations in a planarity of the second contacts, the compliant polymer layer comprising a conductive polymer configured to provide electrical paths to the first contacts.
Claim 3
Dependent Claim
24 words
The system of claim 1 wherein the second contacts comprise planar pads and the first contacts comprise penetrating projections configured to penetrate the pads.
Claim 4
Dependent Claim
27 words
The system of claim 1 wherein the second contacts comprise bumps or balls and the first contacts comprise projections configured to penetrate the bumps or the balls.
Claim 5
Dependent Claim
27 words
The system of claim 1 wherein the second contacts comprise bumps or balls and the first contacts comprise recesses configured to retain the bumps or the balls.
Claim 6
Dependent Claim
13 words
The system of claim 1 wherein the conductive polymer comprises an anisotropic adhesive.
Claim 7
Independent Claim
133 words
A system for testing a semiconductor component comprising: a testing apparatus comprising a wafer probe handler for applying a biasing force and testing circuitry for applying test signals to the component; an interconnect on the wafer probe handler comprising a thinned substrate having a thickness of from about 0.002 inches to 0.014 inches, and a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component for establishing electrical communication with the testing circuitry; and a compliant polymer layer attaching the thinned substrate to the wafer probe handler such that the thinned substrate can flex and the first contacts can move with the thinned substrate in a z-direction upon application of the biasing force to accommodate variations in a planarity of the second contacts.
Claim 8
Independent Claim
133 words
A system for testing a semiconductor component comprising: a testing apparatus comprising a wafer probe handler for applying a biasing force and testing circuitry for applying test signals to the component; an interconnect on the wafer probe handler comprising a thinned substrate having a thickness of from about 0.002 inches to 0.014 inches, and a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component for establishing electrical communication with the testing circuitry; and a compliant polymer layer attaching the thinned substrate to the wafer probe handler such that the thinned substrate can flex and the first contacts can move with the thinned substrate in a z-direction upon application of the biasing force to accommodate variations in a planarity of the second contacts.
Claim 9
Dependent Claim
20 words
The system of claim 6 wherein the component comprises a semiconductor wafer comprising a plurality of semiconductor dice or packages.
Claim 10
Dependent Claim
16 words
The system of claim 6 wherein the component comprises a panel comprising a plurality of packages.
Claim 11
Dependent Claim
23 words
The system of claim 6 wherein the compliant polymer layer comprises a conductive polymer configured to provide electrical paths to the first contacts.
Claim 12
Independent Claim
109 words
A system for testing semiconductor components contained on a wafer or a panel comprising: a testing apparatus configured to apply test signals to the components; and an interconnect on the testing apparatus comprising a thinned substrate having a thickness of from about 0.002 inches to 0.014 inches, and a plurality of first contacts on the thinned substrate configured to make temporary electrical connections with a plurality of second contacts on the components; the thinned substrate configured to flex, and the first contacts configured to move with the thinned substrate in a z-direction during making of the temporary electrical connections to accommodate variations in a planarity of the second contacts.
Claim 13
Independent Claim
109 words
A system for testing semiconductor components contained on a wafer or a panel comprising: a testing apparatus configured to apply test signals to the components; and an interconnect on the testing apparatus comprising a thinned substrate having a thickness of from about 0.002 inches to 0.014 inches, and a plurality of first contacts on the thinned substrate configured to make temporary electrical connections with a plurality of second contacts on the components; the thinned substrate configured to flex, and the first contacts configured to move with the thinned substrate in a z-direction during making of the temporary electrical connections to accommodate variations in a planarity of the second contacts.
Claim 14
Dependent Claim
13 words
The system of claim 10 wherein the testing apparatus comprises a wafer prober.
Claim 15
Dependent Claim
13 words
The system of claim 10 wherein the components comprise dice on the wafer.
Claim 16
Dependent Claim
13 words
The system of claim 10 wherein the components comprise packages on the panel.
Claim 17
Independent Claim
108 words
A system for testing a semiconductor component comprising: a testing apparatus configured to apply test signals to the component; an interconnect on the testing apparatus comprising a rigid substrate and a thinned substrate having a thickness substantially less than that of the component configured to flex upon contact with the component, a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component to apply the test signals, and to move in a z-direction with the thinned substrate to accommodate dimensional variations in the second contacts; and a compliant polymer layer between the rigid substrate and the thinned substrate.
Claim 18
Independent Claim
108 words
A system for testing a semiconductor component comprising: a testing apparatus configured to apply test signals to the component; an interconnect on the testing apparatus comprising a rigid substrate and a thinned substrate having a thickness substantially less than that of the component configured to flex upon contact with the component, a plurality of first contacts on the thinned substrate configured to electrically engage a plurality of second contacts on the component to apply the test signals, and to move in a z-direction with the thinned substrate to accommodate dimensional variations in the second contacts; and a compliant polymer layer between the rigid substrate and the thinned substrate.
Claim 19
Dependent Claim
22 words
The system of claim 14 wherein the component comprises a die or a package and the testing apparatus comprises a test carrier.
Claim 20
Dependent Claim
29 words
The system of claim 14 wherein the component is contained on a wafer or a panel containing a plurality of components and the testing apparatus comprises a wafer prober.
References Cited (Backward Citations)
US5002901A
Cited
US4812191A
Cited
US5072289A
Cited
US5172050A
Cited
US5815000A
Cited
US5946553A
Cited
US5607818A
Cited
US5634267A
Cited
US5844418A
Cited
US5878485A
Cited
US5678301A
Cited
US5686317A
Cited
US5691649A
Cited
US5716218A
Cited
US6020624A
Cited
US6068669A
Cited
US5739579A
Cited
US5817572A
Cited
US5483741A
Cited
US5592736A
Cited
US5841197A
Cited
US5849435A
Cited
US5851845A
Cited
US5756370A
Cited
US5789271A
Cited
US6127736A
Cited
US5726075A
Cited
US6072321A
Cited
US5869974A
Cited
US5639692A
Cited
US5838161A
Cited
US5808360A
Cited
US5834366A
Cited
US5656552A
Cited
US5783461A
Cited
US5763310A
Cited
US6077723A
Cited
US6188232B1
Cited
US5834945A
Cited
US6060891A
Cited
US6016060A
Cited
US6091252A
Cited
US5962921A
Cited
USD401567S
Cited
US5931685A
Cited
US6107122A
Cited
US6040239A
Cited
US6130148A
Cited
US6140827A
Cited
US6114240A
Cited
US6078186A
Cited
US6103613A
Cited
US6015749A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-08 | 2005-04-09 | 2005-10-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-08 | 2009-04-09 | 2009-10-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-08 | 2013-04-09 | 2013-10-09 | $7700.00 | Window Closed / Lapsed |