US6091252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method, apparatus and system for testing bumped semiconductor components
Assignee: Micron Technology Inc
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Filing: 1999-05-14
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Granted: 2000-07-18
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Expires: 2019-05-14
Abstract
Abstract A method, apparatus and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The apparatus includes an interconnect having patterns of contact members adapted to electrically contact the contact bumps. Each contact member includes an array of one or more electrically conductive projections in electrical communication with an associated conductor. The projections form contact members for retaining individual contact bumps on the semiconductor components. The projections can be pillars having angled faces covered with a conductive layer. Alternately the projections can be a material deposited on the substrate, or can be microbumps formed on multi layered tape bonded to the substrate. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare bumped dice or bumped chip scale packages.
Inventors
- 👤 Salman Akram
- 👤 Warren M. Farnworth
- 👤 Alan G. Wood
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:07
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
121 words
A system for testing a semiconductor component having a plurality of contact bumps comprising: an interconnect comprising a substrate, and a plurality of contact members on the substrate configured to electrically engage the contact bumps, each contact member comprising a plurality of electrically conductive projections on the substrate configured to electrically contact a contact bump, each projection having a height relative to a surface of the substrate and a spacing relative to an adjacent projection, the height and the spacing selected to accommodate variations in a diameter and a pitch of the contact bump such that at least one projection of at least one contact member penetrates each contact bump; and a testing circuitry in electrical communication with the contact members.
Claim 2
Independent Claim
121 words
A system for testing a semiconductor component having a plurality of contact bumps comprising: an interconnect comprising a substrate, and a plurality of contact members on the substrate configured to electrically engage the contact bumps, each contact member comprising a plurality of electrically conductive projections on the substrate configured to electrically contact a contact bump, each projection having a height relative to a surface of the substrate and a spacing relative to an adjacent projection, the height and the spacing selected to accommodate variations in a diameter and a pitch of the contact bump such that at least one projection of at least one contact member penetrates each contact bump; and a testing circuitry in electrical communication with the contact members.
Claim 3
Dependent Claim
18 words
The system of claim 1 wherein each projection comprise a plurality of edges for penetrating the contact bumps.
Claim 4
Independent Claim
144 words
A system for testing a semiconductor component having a plurality of contact bumps comprising: an interconnect comprising a substrate and a plurality of contact members on the substrate, each contact member comprising a plurality of electrically conductive projections configured to electrically engage a contact bump, each projection having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to an adjacent projection, with the height and the spacing selected to accommodate variations in a diameter and a pitch of the contact bump such that at least one edge of at least one projection penetrates each contact bump; a force applying mechanism configured to electrically bias the component against the interconnect; and a testing circuitry in electrical communication with the contact members configured to apply test signals through the contact members and the contact bumps to the component.
Claim 5
Independent Claim
144 words
A system for testing a semiconductor component having a plurality of contact bumps comprising: an interconnect comprising a substrate and a plurality of contact members on the substrate, each contact member comprising a plurality of electrically conductive projections configured to electrically engage a contact bump, each projection having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to an adjacent projection, with the height and the spacing selected to accommodate variations in a diameter and a pitch of the contact bump such that at least one edge of at least one projection penetrates each contact bump; a force applying mechanism configured to electrically bias the component against the interconnect; and a testing circuitry in electrical communication with the contact members configured to apply test signals through the contact members and the contact bumps to the component.
Claim 6
Dependent Claim
21 words
The system of claim 3 wherein the substrate comprises silicon and the projections are at least partially covered by conductive layers.
Claim 7
Dependent Claim
34 words
The system of claim 3 wherein the contact bumps have a range of diameters and the height and the spacing are selected such that the contact members penetrate each contact bump in the range.
Claim 8
Dependent Claim
49 words
The system of claim 3 wherein the contact bumps include a first bump with a minimum diameter and a second bump with a maximum diameter and the height and the spacing are selected such that both the first bump and the second bump are penetrated by the contact members.
Claim 9
Dependent Claim
17 words
The system of claim 3 wherein each projection has a plurality faces for scrubbing the contact bumps.
Claim 10
Independent Claim
113 words
A system for testing a semiconductor component having a plurality of contact bumps in a range of diameters comprising: a testing apparatus configured for electrical communication with a testing circuitry; and an interconnect on the testing apparatus comprising a substrate and a plurality of contact members on the substrate configured to electrically engage the contact bumps, each contact member comprising a plurality of electrically conductive projections; the projections having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to one another, the height and the spacing selected such that at least one edge of at least one projection penetrates each contact bump within the range.
Claim 11
Independent Claim
113 words
A system for testing a semiconductor component having a plurality of contact bumps in a range of diameters comprising: a testing apparatus configured for electrical communication with a testing circuitry; and an interconnect on the testing apparatus comprising a substrate and a plurality of contact members on the substrate configured to electrically engage the contact bumps, each contact member comprising a plurality of electrically conductive projections; the projections having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to one another, the height and the spacing selected such that at least one edge of at least one projection penetrates each contact bump within the range.
Claim 12
Dependent Claim
18 words
The system of claim 8 wherein each projection comprises a plurality of faces for scrubbing the contact bumps.
Claim 13
Independent Claim
148 words
A method for testing a semiconductor component having a plurality of contact bumps comprising: providing a testing apparatus; providing an interconnect comprising a substrate and a plurality of contact members on the substrate for electrically engaging the contact bumps, each contact member comprising a plurality of electrically conductive projections on the substrate configured to electrically engage a contact bump, each projection having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to one another, the height and the spacing selected to accommodate variations in a diameter and a Ditch of the contact bump such that at least one edge of at least one projection penetrates each contact bump; placing the component on the interconnect with the contact bumps in electrical communication with the contact members; and applying test signals through the contact members and the contact bumps to the component.
Claim 14
Independent Claim
148 words
A method for testing a semiconductor component having a plurality of contact bumps comprising: providing a testing apparatus; providing an interconnect comprising a substrate and a plurality of contact members on the substrate for electrically engaging the contact bumps, each contact member comprising a plurality of electrically conductive projections on the substrate configured to electrically engage a contact bump, each projection having a plurality of edges, a height relative to a surface of the substrate, and a spacing relative to one another, the height and the spacing selected to accommodate variations in a diameter and a Ditch of the contact bump such that at least one edge of at least one projection penetrates each contact bump; placing the component on the interconnect with the contact bumps in electrical communication with the contact members; and applying test signals through the contact members and the contact bumps to the component.
Claim 15
Dependent Claim
13 words
The method of claim 10 wherein the testing apparatus comprises a wafer handler.
Claim 16
Dependent Claim
13 words
The method of claim 10 wherein the testing apparatus comprises a burn-in board.
Claim 17
Independent Claim
133 words
A method for testing a semiconductor component having a plurality of contact bumps comprising: determining a diameter and a pitch of the contact bumps; providing an interconnect comprising a substrate and a plurality of contact members on the substrate for electrically engaging the contact bumps, each contact member comprising a plurality of projections for electrically engaging a contact bump, each projection having a plurality of edges for penetrating the contact bump; selecting a height of the projections relative to a surface of the substrate and a spacing of the projections relative to one another to accommodate variations in the diameter and the pitch, such that at least one edge of at least one projection electrically engages the contact bump; and applying test signals through the contact members and the projections to the component.
Claim 18
Independent Claim
133 words
A method for testing a semiconductor component having a plurality of contact bumps comprising: determining a diameter and a pitch of the contact bumps; providing an interconnect comprising a substrate and a plurality of contact members on the substrate for electrically engaging the contact bumps, each contact member comprising a plurality of projections for electrically engaging a contact bump, each projection having a plurality of edges for penetrating the contact bump; selecting a height of the projections relative to a surface of the substrate and a spacing of the projections relative to one another to accommodate variations in the diameter and the pitch, such that at least one edge of at least one projection electrically engages the contact bump; and applying test signals through the contact members and the projections to the component.
Claim 19
Dependent Claim
16 words
The method of claim 13, wherein each projection comprises four edges for penetrating the contact bumps.
Claim 20
Dependent Claim
19 words
The method of claim 13, wherein each projection comprises a plurality of faces for electrically contacting the contact bumps.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-18 | 2004-01-17 | 2004-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-18 | 2008-01-17 | 2008-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-18 | 2012-01-17 | 2012-07-18 | $7700.00 | Window Closed / Lapsed |