US5915755A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming an interconnect for testing unpackaged semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1997-10-17
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Granted: 1999-06-29
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Expires: 2017-10-17
Abstract
Abstract A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
Inventors
- 👤 Derek Gochnour
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:24
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10P; H10P72/00; H10P72/70; H10P72/74; H10P74/00; H10P74/23; H10W70/67; H10W70/68; H10W90/00; H10W90/701; H10W99/00; G01R1/06; G01R1/067; G01R1/06711; G01R1/06755; G01R1/06761; G01R3/00; G01R31/282; G01R31/2831; G01R31/2855; G01R31/286; G01R31/2863; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0058; H05K3/0067; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W70/681; H10W72/00; H10W72/071; H10W72/075; H10W72/07502; H10W72/07504; H10W90/20; H10W90/24; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
114 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising an electrically insulating film having a first side and an opposing second side, a contact on the first side configured to electrically contact a contact location on the die to form a temporary electrical connection, a conductor on the second side in electrical communication with the contact, and a conductive via in the tape electrically connecting the contact and the conductor; and forming a compliant layer between the second side and the substrate configured to attach the tape to the substrate and to allow the contact to move during forming of the temporary electrical connection.
Claim 2
Independent Claim
114 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising an electrically insulating film having a first side and an opposing second side, a contact on the first side configured to electrically contact a contact location on the die to form a temporary electrical connection, a conductor on the second side in electrical communication with the contact, and a conductive via in the tape electrically connecting the contact and the conductor; and forming a compliant layer between the second side and the substrate configured to attach the tape to the substrate and to allow the contact to move during forming of the temporary electrical connection.
Claim 3
Dependent Claim
27 words
The method of claim 1 wherein the tape comprises a plurality of patterns of contacts corresponding to a plurality of patterns of contact locations on the die.
Claim 4
Dependent Claim
24 words
The method of claim 1 further comprising forming a pad on the conductor configured to make a second electrical connection with a testing apparatus.
Claim 5
Dependent Claim
13 words
The method of claim 1 wherein the compliant layer comprises a silicone elastomer.
Claim 6
Independent Claim
122 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising: a film having a first side and an opposing second side, a plurality of first contacts on the first side configured to form temporary electrical connections with a plurality of second contacts on the die, a plurality of conductors on the second side configured for electrical communication with a test apparatus, and a plurality of conductive vias through the film electrically connecting the first contacts to the conductors; and forming an elastomeric layer between the second side and the substrate configured to attach the tape to the substrate, and to allow the first contacts to move during forming of the temporary electrical connections.
Claim 7
Independent Claim
122 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising: a film having a first side and an opposing second side, a plurality of first contacts on the first side configured to form temporary electrical connections with a plurality of second contacts on the die, a plurality of conductors on the second side configured for electrical communication with a test apparatus, and a plurality of conductive vias through the film electrically connecting the first contacts to the conductors; and forming an elastomeric layer between the second side and the substrate configured to attach the tape to the substrate, and to allow the first contacts to move during forming of the temporary electrical connections.
Claim 8
Dependent Claim
12 words
The method of claim 5 wherein the first contacts comprise metal bumps.
Claim 9
Dependent Claim
22 words
The method of claim 5 further comprising placing the interconnect in a test apparatus configured to press the die against the interconnect.
Claim 10
Dependent Claim
34 words
The method of claim 5 further comprising placing the interconnect in a test apparatus configured to press the die against the interconnect while the first contacts move in a z-direction to accommodate dimensional variations.
Claim 11
Dependent Claim
21 words
The method of claim 5 further comprising forming pads on the conductors for making second electrical connections with a testing apparatus.
Claim 12
Dependent Claim
27 words
The method of claim 5 wherein the first contacts comprise metal bumps and the conductive vias comprise holes in the tape at least partially filled with metal.
Claim 13
Independent Claim
109 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising a film having a first side and an opposing second side, a plurality of metal bumps on the first side and a plurality of conductors on the second side in electrical communication with the metal bumps, the bumps configured to electrically contact pads on the die to form temporary electrical connections therewith; and forming an elastomeric layer between the second side and the substrate configured to attach the tape to the substrate and to allow the metal bumps to move in a z-direction during forming of the temporary electrical connections.
Claim 14
Independent Claim
109 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising a film having a first side and an opposing second side, a plurality of metal bumps on the first side and a plurality of conductors on the second side in electrical communication with the metal bumps, the bumps configured to electrically contact pads on the die to form temporary electrical connections therewith; and forming an elastomeric layer between the second side and the substrate configured to attach the tape to the substrate and to allow the metal bumps to move in a z-direction during forming of the temporary electrical connections.
Claim 15
Dependent Claim
20 words
The method of claim 11 wherein the film comprises metal filled vias electrically connecting the metal bumps and the conductors.
Claim 16
Dependent Claim
37 words
The method of claim 11 further comprising providing a plurality of patterns of metal bumps on the film and cutting the tape and the substrate following forming of the elastomeric layer to form a plurality of interconnects.
Claim 17
Dependent Claim
25 words
The method of claim 11, wherein the film comprises a material selected from the group consisting of polyimide, polyester, epoxy, urethane, polystrene, silicone and polycarbonate.
Claim 18
Dependent Claim
20 words
The method of claim 11 wherein the adhesive material comprises a curable elastomer that is cured during the forming step.
Claim 19
Dependent Claim
25 words
The method of claim 11 wherein the metal bumps comprise a metal selected from the group consisting of Ni, Au, Cu, solder, and alloys thereof.
Claim 20
Independent Claim
131 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising a film having a first side and an opposing second side, a plurality of patterns of first contacts on the first side configured to electrically engage second contacts on the die to form temporary electrical connections therewith, and a plurality of patterns of conductors on the second side in electrical communication with the first contacts; attaching the tape to the substrate by forming an elastomeric layer between the second side and the substrate; and placing the tape in a testing apparatus configured to press the first contacts and the second contacts together as the elastomeric layer allows the first contacts to move in a z-direction during forming of the temporary electrical connections.
Claim 21
Independent Claim
131 words
A method for forming an interconnect for testing a semiconductor die comprising: providing a substrate; providing a tape comprising a film having a first side and an opposing second side, a plurality of patterns of first contacts on the first side configured to electrically engage second contacts on the die to form temporary electrical connections therewith, and a plurality of patterns of conductors on the second side in electrical communication with the first contacts; attaching the tape to the substrate by forming an elastomeric layer between the second side and the substrate; and placing the tape in a testing apparatus configured to press the first contacts and the second contacts together as the elastomeric layer allows the first contacts to move in a z-direction during forming of the temporary electrical connections.
Claim 22
Dependent Claim
24 words
The method of claim 17 further comprising providing the substrate as a silicon wafer and cutting the wafer to form a plurality of interconnects.
Claim 23
Dependent Claim
21 words
The method of claim 17 further comprising applying a stencil to the substrate to form an opening for receiving the tape.
Claim 24
Dependent Claim
17 words
The method of claim 17 further comprising placing a weight on the tape during the attaching step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-06-28 | 2002-12-28 | 2003-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-06-28 | 2006-12-28 | 2007-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-06-28 | 2010-12-28 | 2011-06-29 | $7700.00 | Window Closed / Lapsed |