US5363038A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for testing an unpopulated chip carrier using a module test card
Assignee: Fujitsu Ltd
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Filing: 1992-08-12
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Granted: 1994-11-08
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Expires: 2012-08-12
Abstract
Abstract Manufacturing of semiconductor devices is facilitated when the device chip carriers of the devices are tested, prior to population of chips thereon, by a module test card. The module test card is formed by a test substrate and a plurality of test chips mounted on the test substrate. Connections are provided on the test substrate for connecting to a tester. Through the module test card, the device chip carriers are tested under simulation of their operating conditions.
Inventors
- 👤 David G. Love
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 22:53
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/0735; G01R1/07314; G01R31/00; G01R31/28; G01R31/282; G01R31/2831
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
184 words
In manufacturing semiconductor devices formed respectively by a plurality of semiconductor chips and a carrier of the chips, a method for increasing production yield through more refined testing methods, comprising the steps of: coupling, prior to population of the semiconductor chips thereon, the carrier to a module test card, said module test card having a test substrate and a plurality of test chips on the test substrate, the substrate being adapted for successively coupling to a plurality of carriers and for communicating electrical signals between a connector of one of the test chips and a respective connector on the carrier such that the connector on the test chip correlates to a connector on one of the plurality of semiconductor chip that communicates with the respective connector on the carrier after the carrier is populated with the semiconductor chips, the test chips being operable to simulate a portion of the chips; coupling said module test card to a tester; testing said carrier utilizing said module test card to generate test results; and comparing the test results with expected results to accept or reject the carrier.
Claim 2
Dependent Claim
184 words
In manufacturing semiconductor devices formed respectively by a plurality of semiconductor chips and a carrier of the chips, a method for increasing production yield through more refined testing methods, comprising the steps of: coupling, prior to population of the semiconductor chips thereon, the carrier to a module test card, said module test card having a test substrate and a plurality of test chips on the test substrate, the substrate being adapted for successively coupling to a plurality of carriers and for communicating electrical signals between a connector of one of the test chips and a respective connector on the carrier such that the connector on the test chip correlates to a connector on one of the plurality of semiconductor chip that communicates with the respective connector on the carrier after the carrier is populated with the semiconductor chips, the test chips being operable to simulate a portion of the chips; coupling said module test card to a tester; testing said carrier utilizing said module test card to generate test results; and comparing the test results with expected results to accept or reject the carrier.
Claim 3
Dependent Claim
24 words
A method as claimed in claim 1 wherein said testing step comprises a step of simulating one or more operations of the semiconductor devices.
Claim 4
Dependent Claim
28 words
A method as claimed in claim 1 wherein said coupling step comprises a step of connecting said carrier to said module test card using reusable electrical conductive material.
Claim 5
Dependent Claim
29 words
A method as claimed in claim 3 wherein said coupling step comprises a step of connecting said carrier to said module test card using a layer of z-axis elastomer.
Claim 6
Dependent Claim
29 words
A method as claimed in claim 3 wherein said coupling step comprises a step of connecting said carrier to said module test card using a set of contact bumps.
Claim 7
Dependent Claim
15 words
A method as claimed in claim 5 wherein said contact bumps being formed with gold.
Claim 8
Dependent Claim
13 words
A method as claimed in claim 6 wherein said contact bumps are solder.
Claim 9
Dependent Claim
29 words
A method as claimed in claim 3 wherein said coupling step comprises a step of connecting said carrier to said module test card using a tape automated bonding process.
Claim 10
Independent Claim
223 words
An apparatus for testing a carrier of semiconductor chips prior to population of the chips thereon to form a semiconductor device, the carrier having a first plurality of connectors, the semiconductor chips each having a plurality of connectors, the apparatus comprising: a test substrate having a second and third plurality of connectors, the second plurality of connectors being arranged in a pattern corresponding to the pattern of the plurality of connectors on the semiconductor chips; a plurality of test chips coupled to the test substrate, each test chip having a plurality of connectors, each such plurality of connectors being arranged in a pattern corresponding to the pattern of a respective portion of the second plurality of connectors of the test substrate, the plurality of test chips being operable to simulate the semiconductor chips, the test substrate being adapted to communicate electrical signals from a connector on a test chip to a respective connector of the second plurality of connectors and to communicate the electrical signals from such a connector of the second plurality of connectors to a respective connector of the third plurality of connectors for communication with the carrier; means for electrically coupling the third plurality of connectors of the test substrate to the first plurality of connectors of the carrier; and means for electrically coupling the test substrate to a tester.
Claim 11
Independent Claim
223 words
An apparatus for testing a carrier of semiconductor chips prior to population of the chips thereon to form a semiconductor device, the carrier having a first plurality of connectors, the semiconductor chips each having a plurality of connectors, the apparatus comprising: a test substrate having a second and third plurality of connectors, the second plurality of connectors being arranged in a pattern corresponding to the pattern of the plurality of connectors on the semiconductor chips; a plurality of test chips coupled to the test substrate, each test chip having a plurality of connectors, each such plurality of connectors being arranged in a pattern corresponding to the pattern of a respective portion of the second plurality of connectors of the test substrate, the plurality of test chips being operable to simulate the semiconductor chips, the test substrate being adapted to communicate electrical signals from a connector on a test chip to a respective connector of the second plurality of connectors and to communicate the electrical signals from such a connector of the second plurality of connectors to a respective connector of the third plurality of connectors for communication with the carrier; means for electrically coupling the third plurality of connectors of the test substrate to the first plurality of connectors of the carrier; and means for electrically coupling the test substrate to a tester.
Claim 12
Dependent Claim
20 words
An apparatus as claimed in claim 9 wherein said test chips comprise a set of chips having a gate array.
Claim 13
Dependent Claim
19 words
An apparatus as claimed in claim 9 wherein said test chips comprise a set of chips forming a memory.
Claim 14
Dependent Claim
27 words
An apparatus as claimed in claim 9 wherein said test chips comprise a set of chips forming logic circuits for performing functions of a data processing unit.
Claim 15
Dependent Claim
20 words
An apparatus as claimed in claim 12 wherein said test chips further comprise a set of chips forming a memory.
Claim 16
Dependent Claim
25 words
An apparatus as claimed in claim 9 wherein said means for coupling said test substrate to said carrier comprises a layer of electrically conductive material.
Claim 17
Dependent Claim
16 words
An apparatus as claimed in claim 14 wherein said layer of electrically conductive material is reusable.
Claim 18
Dependent Claim
24 words
An apparatus as claimed in claim 14 wherein the means for coupling said test substrate to said carrier comprises a layer of z-axis elastomer.
Claim 19
Dependent Claim
24 words
An apparatus as claimed in claim 9 wherein said means for coupling said test substrate to said carrier comprises a set of contact bumps.
Claim 20
Dependent Claim
15 words
An apparatus as claimed in claim 17 wherein said contact bumps are formed with gold.
Claim 21
Dependent Claim
15 words
An apparatus as claimed in claim 17 wherein said contact bumps are formed with solder.
Claim 22
Dependent Claim
34 words
An apparatus as claimed in claim 9 wherein said means for coupling said test substrate to said carrier comprises means for coupling said test substrate and said carrier by a tape automated bonding process.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-11-07 | 1998-05-09 | 1998-11-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-11-07 | 2002-05-09 | 2002-11-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-11-07 | 2006-05-09 | 2006-11-08 | $7700.00 | Window Closed / Lapsed |