Z-axis interconnect for discrete die burn-in for nonpackaged die

Claim 2

Discrete testing apparatus for testing a semiconductor integrated circuit device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate mating with the first plate; d) one of the first and second plates having a plurality of ohmic contacts formed thereon; e) the plurality of ohmic contacts formed so that, when the die is positioned in the die-receiving cavity, the ohmic contacts are in alignment with contact locations on the die; f) an elastically resilient pad which is electrically conductive in a z-axis, normal to a plane of the pad, and which provides electrical isolation cross the plane of the pad, the pad adapted for positioning in contact with the die between the die and the plurality of ohmic contacts; g) electrical connector terminals in electrical communication with the ohmic contacts, the electrical connector terminals being mounted to the one of said plates; and h) biasing means comprising a second pad mounted between the second plate and die for biasing the die against the pad to etablish an electrical connection between the ohmic contacts and the contact locations on the die.

Claim 3

Discrete testing apparatus as described in claim 1, wherein: the biasing means comprises a second elastomeric pad mounted within the die receiving cavity and formed of a material that exerts an electrostatic attraction on the die.

Claim 4

Discrete testing apparatus as described in claim 1, wherein: the contacts include flexible rods which extend into the die receiving cavity after the first and second plates have been mated.

Claim 5

Discrete testing apparatus as described in claim 1, wherein: the contacts include flexible rods which extend into the die receiving cavity after the first and second plates have been mated.

Claim 6

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a ) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate; d) means to secure the first and second plates together; e) an intermediate member including a substrate formed of insulative material, said intermediate member dimensioned so as to fit between-the first and second plate adjacent to the die when the die is in the die receiving cavity; f) a pad which is electrically conductive in a z-axis normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the substrate; g) a plurality of ohmic contacts formed on the intermediate member the ohmic contacts being positioned so that, when the first plate and the second plate are aligned and the die and said substrate are positioned in the die-receiving cavity, the ohmic contacts are in alignment with contact locations on the die, for establishing an electrical connection with the die at the contact locations; h) electrical connector terminals in an electrical communication with the plurality of ohmic contacts; and i) a clamp to hold the die, the pad, and said intermediate member together when the first plate and the second plate are secured together, thereby causing the ohmic contacts to be maintained in electrical communication with said contact locations, when the first and second plates are secured together with the die in the die receiving cavity.

Claim 7

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a ) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate; d) means to secure the first and second plates together; e) an intermediate member including a substrate formed of insulative material, said intermediate member dimensioned so as to fit between-the first and second plate adjacent to the die when the die is in the die receiving cavity; f) a pad which is electrically conductive in a z-axis normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the substrate; g) a plurality of ohmic contacts formed on the intermediate member the ohmic contacts being positioned so that, when the first plate and the second plate are aligned and the die and said substrate are positioned in the die-receiving cavity, the ohmic contacts are in alignment with contact locations on the die, for establishing an electrical connection with the die at the contact locations; h) electrical connector terminals in an electrical communication with the plurality of ohmic contacts; and i) a clamp to hold the die, the pad, and said intermediate member together when the first plate and the second plate are secured together, thereby causing the ohmic contacts to be maintained in electrical communication with said contact locations, when the first and second plates are secured together with the die in the die receiving cavity.

Claim 8

Discrete testing apparatus as described in claim 5, wherein: said electrical connector terminals are positioned on the second plate.

Claim 9

Discrete testing apparatus as described in claim 6, wherein: said intermediate member is formed as tape automated bonding (TAB) tape.

Claim 10

Discrete testing apparatus as described in claim 7, wherein: the TAB tape extends beyond the confines of a fixture formed by the first and second plates and terminating in an external connector, the external connector including said connector terminals.

Claim 11

Discrete testing apparatus as described in claim 5, wherein: said pad is elastically resilient, thereby biasing against the die received in the die receiving cavity with the ohmic contacts after the first and second plates have been mated.

Claim 12

Discrete testing apparatus as described in claim 5, wherein: means are provided, separate from said pad, to bias die received in the die receiving cavity with the ohmic contacts after the first and second plates have been mated, the means to bias cooperating with said pad to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die.

Claim 13

Discrete testing apparatus as described in claim 5, wherein: the die receiving cavity has an elastomeric pad therein, the elastomeric pad exerting a biasing force against the die, the biasing force cooperating with said pad in order to establish an electrical connection, through said pad, between the contact locations on the die and said plurality of ohmic contacts.

Claim 14

Discrete testing apparatus as described in claim 11, wherein: the elastomeric pad comprises an elastomeric polymer.

Claim 15

Discrete testing apparatus as described in claim 5, wherein: said ohmic contacts include ohmic contacts which are in alignment with the die receiving cavity after the first and second plates have been mated and cooperating with said pad to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die.

Claim 16

Discrete testing apparatus as described in claim 5, wherein: a) an elastomeric strip is provided, separate from said pad, cooperating with said pad to bias die received in the die receiving cavity with the ohmic contacts after the first and second plates have been mated, and to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die; and b) the elastomeric strip further secures the die in a position within the die receiving cavity by means of electrostatic attraction and frictional forces, thereby permitting the die to be maintained in a positional alignment with respect to the die receiving cavity after being placed into the die receiving cavity and prior to mating the second plate with the first plate.

Claim 17

Discrete testing apparatus as described in claim 5, wherein: the contacts include flexible rods which extend into the die receiving cavity after the first and second plates have been mated.

Claim 18

Discrete testing apparatus as described in claim 5, wherein: said ohmic contacts each include a contact pad which is in alignment with the die receiving cavity after the first and second plates have been mated.

Claim 19

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate; d) means to secure the first and second plates together; e) an intermediate member formed of insulative material, and having a plurality of conductors formed thereon and dimensioned so as to fit within the testing apparatus between the first and second plate and adjacent to the die when the die is in the die receiving cavity, the plurality of conductors including ohmic contacts for establishing an electrical connection with the die at the contact locations; f) a pad which is electrically conductive in a Z-axis, normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the plurality of conductors; g) electrical connector terminals in electrical communication with the plurality of conductors; and i) a clamp to hold the die, the pad, and, said intermediate member together when the first plate and the second plate are secured together, thereby causing the plurality of conductors to be maintained in electrical communication with said contact locations.

Claim 20

Discrete testing apparatus for testing a semiconductor device in die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate; d) means to secure the first and second plates together; e) an intermediate member formed of insulative material, and having a plurality of conductors formed thereon and dimensioned so as to fit within the testing apparatus between the first and second plate and adjacent to the die when the die is in the die receiving cavity, the plurality of conductors including ohmic contacts for establishing an electrical connection with the die at the contact locations; f) a pad which is electrically conductive in a Z-axis, normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the plurality of conductors; g) electrical connector terminals in electrical communication with the plurality of conductors; and i) a clamp to hold the die, the pad, and, said intermediate member together when the first plate and the second plate are secured together, thereby causing the plurality of conductors to be maintained in electrical communication with said contact locations.

Claim 21

Discrete testing apparatus for testing a semiconductor integrated circuit in device die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate mating with the first plate; d) one of the first and second plates having a plurality of ohmic contacts thereon; e) the plurality of ohmic contacts being positioned so that when the die is positioned in the die-receiving cavity, the ohmic contacts are in alignment with contact locations on the die, the ohmic contacts thereby establishing an electrical connection with the die at the contact locations; f) a pad which is electrically conductive in a z-axis, normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the plurality of ohmic contacts; g) electrical connector terminals in electrical communication with the ohmic contacts, the electrical connector terminals being mounted to the one of said plates; h) an elastomeric strip, mounted within the die receiving cavity cooperating with said pad to bias the die in the die receiving cavity with the ohmic contacts after the first and second plates have been mated, and to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die said elastomeric strip formed of a material that exerts an electrostatic attraction on the die.

Claim 22

Discrete testing apparatus for testing a semiconductor integrated circuit in device die form, comprising: a) a first plate; b) a die-receiving cavity in the first plate for receiving a semiconductor die; c) a second plate mating with the first plate; d) one of the first and second plates having a plurality of ohmic contacts thereon; e) the plurality of ohmic contacts being positioned so that when the die is positioned in the die-receiving cavity, the ohmic contacts are in alignment with contact locations on the die, the ohmic contacts thereby establishing an electrical connection with the die at the contact locations; f) a pad which is electrically conductive in a z-axis, normal to a plane of the pad, and which provides electrical isolation across the plane of the pad, the pad being positioned over the die between the die and the plurality of ohmic contacts; g) electrical connector terminals in electrical communication with the ohmic contacts, the electrical connector terminals being mounted to the one of said plates; h) an elastomeric strip, mounted within the die receiving cavity cooperating with said pad to bias the die in the die receiving cavity with the ohmic contacts after the first and second plates have been mated, and to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die said elastomeric strip formed of a material that exerts an electrostatic attraction on the die.

Claim 23

Discrete testing apparatus as described in claim 18, wherein: said pad is elastically resilient, thereby biasing against the die received in the die receiving cavity with the ohmic contacts after the first and second plates have been mated.

Claim 24

Discrete testing apparatus as described in claim 18, wherein: the ohmic contacts include ohmic contacts which are in alignment with the die receiving cavity after the first and second plates have been mated, said ohmic contacts cooperating with said pad to apply sufficient pressure between said pad and said contact locations on the die to establish ohmic contact between said pad and said contact locations on the die.