US5678301A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming an interconnect for testing unpackaged semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1995-11-27
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Granted: 1997-10-21
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Expires: 2015-11-27
Abstract
Abstract A method for forming an interconnect for establishing electrical communication with a semiconductor die is provided. The method includes: providing a microbump tape and then mounting the tape to a substrate with a compliant layer therebetween. The microbump tape includes an insulating film having a pattern of microbump contact members corresponding to a pattern of bond pads on the die. The compliant layer can be formed of a curable adhesive such as a silicone elastomer. A coupon containing a plurality of microbump tapes can be mounted to a substrate wafer which can then be singulated to form a plurality of interconnects. The interconnects can be used with a testing apparatus for testing unpackaged semiconductor dice.
Inventors
- 👤 Derek Gochnour
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:20
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10P; H10P72/00; H10P72/70; H10P72/74; H10P74/00; H10P74/23; H10W70/67; H10W70/68; H10W90/00; H10W90/701; H10W99/00; G01R1/06; G01R1/067; G01R1/06711; G01R1/06755; G01R1/06761; G01R3/00; G01R31/282; G01R31/2831; G01R31/2855; G01R31/286; G01R31/2863; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0058; H05K3/0067; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W70/681; H10W72/00; H10W72/071; H10W72/075; H10W72/07502; H10W72/07504; H10W90/20; H10W90/24; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
61 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a contact member thereon in electrical communication with a conductor; providing a substrate for supporting the tape; and mounting the tape to the substrate by forming a cured elastomeric adhesive layer between the tape and substrate.
Claim 2
Independent Claim
61 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a contact member thereon in electrical communication with a conductor; providing a substrate for supporting the tape; and mounting the tape to the substrate by forming a cured elastomeric adhesive layer between the tape and substrate.
Claim 3
Dependent Claim
26 words
The method as claimed in claim 1 wherein the substrate comprises a material selected from the group consisting of silicon, silicon-on-sapphire, silicon-on-glass, germanium, metal and ceramic.
Claim 4
Dependent Claim
47 words
The method as claimed in claim 1 further comprising: providing a coupon comprising a plurality of tapes; providing a substrate wafer comprising a plurality of substrates; attaching the coupon to the substrate wafer; and cutting the coupon and the substrate wafer to form a plurality of interconnects.
Claim 5
Dependent Claim
17 words
The method as claimed in claim 1 wherein the cured elastomeric adhesive layer comprises a silicone elastomer.
Claim 6
Dependent Claim
21 words
The method as claimed in claim 1 further comprising placing a weight on the tape during curing of the adhesive layer.
Claim 7
Dependent Claim
15 words
The method as claimed in claim 1 further comprising testing the die using the interconnect.
Claim 8
Independent Claim
74 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a microbump contact member and a conductor in electrical communication with the microbump contact member; providing a substrate for supporting the tape; and forming a compliant layer between the tape and substrate by attaching the tape to the substrate with an adhesive, said adhesive comprising a curable elastomeric material.
Claim 9
Independent Claim
74 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a microbump contact member and a conductor in electrical communication with the microbump contact member; providing a substrate for supporting the tape; and forming a compliant layer between the tape and substrate by attaching the tape to the substrate with an adhesive, said adhesive comprising a curable elastomeric material.
Claim 10
Dependent Claim
25 words
The method as claimed in claim 7 wherein the microbump contact member comprises a metal bump formed on a metal filled via through the film.
Claim 11
Dependent Claim
33 words
The method as claimed in claim 7 wherein the microbump contact member is formed on a first side of the film and the conductor is formed on a second side of the film.
Claim 12
Dependent Claim
16 words
The method as claimed in claim 7 wherein the curable elastomeric material comprises a silicone elastomer.
Claim 13
Dependent Claim
14 words
The method as claimed in claim 7 wherein the curable elastomeric material comprises epoxy.
Claim 14
Dependent Claim
68 words
The method as claimed in claim 7 further comprising: providing the substrate on a wafer comprising a plurality of substrates; providing the tape on a coupon comprising a plurality of individual patterns of microbump contact members and conductors corresponding to a particular die bond pad configuration; mounting the coupon to the wafer with the adhesive therebetween; and singulating the wafer and coupon to form a plurality of interconnects.
Claim 15
Dependent Claim
20 words
The method as claimed in claim 12 further comprising applying the adhesive to the wafer prior to the mounting step.
Claim 16
Dependent Claim
20 words
The method as claimed in claim 12 further comprising applying the adhesive to the tape prior to the mounting step.
Claim 17
Independent Claim
96 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a plurality of patterns of contacts corresponding to contact locations on the die and a plurality of patterns of conductors in electrical communication with the contacts; providing a substrate wafer; mounting the tape to the substrate wafer by placing an adhesive between the tape and substrate to form a compliant layer; and singulating the wafer and tape to separate the patterns of contacts and conductors to form a plurality of interconnects.
Claim 18
Independent Claim
96 words
A method for forming an interconnect for establishing an electrical connection with a semiconductor die, comprising: providing a tape comprising an electrically insulating film having a plurality of patterns of contacts corresponding to contact locations on the die and a plurality of patterns of conductors in electrical communication with the contacts; providing a substrate wafer; mounting the tape to the substrate wafer by placing an adhesive between the tape and substrate to form a compliant layer; and singulating the wafer and tape to separate the patterns of contacts and conductors to form a plurality of interconnects.
Claim 19
Dependent Claim
19 words
The method as claimed in claim 15 wherein the tape comprises a coupon having an adhesive layer attached thereto.
Claim 20
Dependent Claim
24 words
The method as claimed in claim 15 wherein the adhesive is applied to the substrate wafer and the tape is placed on the adhesive.
Claim 21
Dependent Claim
28 words
The method as claimed in claim 15 wherein the adhesive comprises a curable material and a weight is placed on the tape during curing of the curable material.
Claim 22
Dependent Claim
22 words
The method as claimed in claim 18 wherein the weight includes grooves configured to prevent direct contact of the weight and contacts.
Claim 23
Dependent Claim
29 words
The method as claimed in claim 15 further comprising forming a protective film on the tape and then rolling a weight over the protective film to compress the adhesive.
Claim 24
Dependent Claim
12 words
The method as claimed in claim 15 wherein the wafer comprises silicon.
Claim 25
Dependent Claim
16 words
The method as claimed in claim 15 wherein singulation the wafer and tape comprises saw cutting.
Claim 26
Dependent Claim
21 words
The method as claimed in claim 15 wherein the wafer is held on a wafer film frame during the singulation step.
Claim 27
Independent Claim
111 words
A method for forming an interconnect for establishing electrical connections with a semiconductor die, comprising: providing a coupon comprising an electrically insulating film including a plurality of patterns of microbump contacts configured to electrically connect to contact locations on the die, and a plurality of patterns of conductors in electrical communication with the microbump contacts; providing a substrate wafer; forming a stencil with an opening on the wafer; applying an adhesive to the wafer; placing the coupon within the opening on the adhesive; compressing the coupon against the adhesive; curing the adhesive; and cutting the wafer to separate the patterns of microbump contacts and conductors to form a plurality of interconnects.
Claim 28
Independent Claim
111 words
A method for forming an interconnect for establishing electrical connections with a semiconductor die, comprising: providing a coupon comprising an electrically insulating film including a plurality of patterns of microbump contacts configured to electrically connect to contact locations on the die, and a plurality of patterns of conductors in electrical communication with the microbump contacts; providing a substrate wafer; forming a stencil with an opening on the wafer; applying an adhesive to the wafer; placing the coupon within the opening on the adhesive; compressing the coupon against the adhesive; curing the adhesive; and cutting the wafer to separate the patterns of microbump contacts and conductors to form a plurality of interconnects.
Claim 29
Dependent Claim
19 words
The method as claimed in claim 24 further comprising placing a weight on the coupon during the curing step.
Claim 30
Dependent Claim
18 words
The method as claimed in claim 24 further comprising compressing the coupon against the adhesive using a bladder.
Claim 31
Dependent Claim
27 words
The method as claimed in claim 24 wherein the substrate wafer comprises a material selected from the group consisting of silicon, silicon-on-sapphire, silicon-on-glass, germanium, metal and ceramic.
Claim 32
Dependent Claim
25 words
The method as claimed in claim 24 wherein cutting the wafer and coupon comprises placing the wafer on a wafer film frame and saw cutting.
Claim 33
Dependent Claim
19 words
The method as claimed in claim 24 wherein compressing the coupon against the adhesive comprises applying a rolling weight.
Claim 34
Dependent Claim
19 words
The method as claimed in claim 29 further comprising placing a protective film between the coupon and rolling weight.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-20 | 2001-04-21 | 2001-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-20 | 2005-04-21 | 2005-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-20 | 2009-04-21 | 2009-10-21 | $7700.00 | Window Closed / Lapsed |