US5519332A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier for testing an unpackaged semiconductor die
Assignee: Micron Technology Inc
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Filing: 1995-03-01
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Granted: 1996-05-21
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Expires: 2015-03-01
Abstract
Abstract A carrier for testing an unpackaged semiconductor die is provided. The carrier includes a carrier base for supporting the die; an interconnect for establishing a temporary electrical connection with the die; and a force distribution mechanism for biasing the die and interconnect together. In an illustrative embodiment the carrier is formed with a laminated ceramic base. The ceramic base includes internal conductive lines that are wire bonded to the interconnect and metal plated external contacts that are connected to external test circuitry. In an alternate embodiment the carrier is formed with an injection molded plastic base and includes 3-D circuitry formed by a metallization and photolithographic process. In either case, the carrier is adapted for testing different die configurations by interchanging different interconnects.
Inventors
- 👤 Alan G. Wood
- 👤 Warren M. Farnworth
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 14:16
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P74/00; H10P74/23; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/68; H10W90/00; H10W90/701; H10W99/00; G01R3/00; G01R31/2855; G01R31/286; G01R31/2863; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0058; H05K3/0067; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W70/681; H10W72/00; H10W72/071; H10W72/0711; H10W72/07178; H10W72/075; H10W72/07502; H10W72/07504; H10W72/07551; H10W72/50; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/20; H10W90/24; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49158; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
150 words
A carrier for testing an unpackaged semiconductor die, comprising: a laminated carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base including an opening; an external contact formed on the carrier base and adapted for electrical connection to external test circuitry; an electrically conductive line formed within the carrier base said conductive line in electrical communication with a metal filled via formed in the base and in electrical communication with the external contact; an interconnect mountable to the base, said interconnect comprising a substrate having a contact member adapted to contact a contact location on the die; means for establishing electrical communication between the conductive line within the carrier base and the contact member on the interconnect; and a force distribution mechanism removably secured to said opening on said carrier base for biasing the interconnect and die together.
Claim 2
Dependent Claim
150 words
A carrier for testing an unpackaged semiconductor die, comprising: a laminated carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base including an opening; an external contact formed on the carrier base and adapted for electrical connection to external test circuitry; an electrically conductive line formed within the carrier base said conductive line in electrical communication with a metal filled via formed in the base and in electrical communication with the external contact; an interconnect mountable to the base, said interconnect comprising a substrate having a contact member adapted to contact a contact location on the die; means for establishing electrical communication between the conductive line within the carrier base and the contact member on the interconnect; and a force distribution mechanism removably secured to said opening on said carrier base for biasing the interconnect and die together.
Claim 3
Dependent Claim
31 words
The carrier as claimed in claim 1 and further comprising a second interconnect interchangeable with the interconnect to permit testing of another semiconductor die having a different configuration than the die.
Claim 4
Dependent Claim
31 words
The carrier as claimed in claim 1 and wherein the interconnect is formed of silicon and the contact member is formed as a topographically elevated pillar having a raised self-limiting projection.
Claim 5
Dependent Claim
18 words
The carrier as claimed in claim 1 and further comprising a sealing member for sealing around the die.
Claim 6
Dependent Claim
40 words
The carrier as claimed in claim 1 and wherein the means for establishing electrical communication comprises wire bonding the conductive line within the carrier base to a conductive trace formed on the interconnect in electrical communication with the contact location.
Claim 7
Dependent Claim
51 words
The carrier as claimed in claim 1 and wherein the force distribution mechanism includes a pressure plate for contacting the die, a spring for exerting a force on the pressure plate and a bridge clamp attachable to the opening in the carrier base for holding the pressure plate over the die.
Claim 8
Dependent Claim
225 words
A carrier for testing an unpackaged semiconductor die, comprising: a laminated carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base formed with an opening; a plurality of external contacts formed on the carrier base and adapted for electrical connection to external test circuitry; a pattern of electrically conductive lines formed within the carrier base in electrical communication with the external contacts, said conductive lines terminating in a plurality of exposed metal plated pads; a plurality of metal filled vias for interconnecting the electrically conductive lines to the external contacts; an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to contact a corresponding pattern of contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with the raised contact members; means for establishing electrical communication between the metal plated pads on the conductive lines and the conductive traces on the interconnect; and a force distribution mechanism for biasing the interconnect and die together, said force distribution mechanism including a pressure plate for abutting the die, a bridge clamp clipped to the opening in the base and a spring sandwiched between the pressure plate and bridge clamp for exerting a biasing force on the pressure plate.
Claim 9
Dependent Claim
225 words
A carrier for testing an unpackaged semiconductor die, comprising: a laminated carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base formed with an opening; a plurality of external contacts formed on the carrier base and adapted for electrical connection to external test circuitry; a pattern of electrically conductive lines formed within the carrier base in electrical communication with the external contacts, said conductive lines terminating in a plurality of exposed metal plated pads; a plurality of metal filled vias for interconnecting the electrically conductive lines to the external contacts; an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to contact a corresponding pattern of contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with the raised contact members; means for establishing electrical communication between the metal plated pads on the conductive lines and the conductive traces on the interconnect; and a force distribution mechanism for biasing the interconnect and die together, said force distribution mechanism including a pressure plate for abutting the die, a bridge clamp clipped to the opening in the base and a spring sandwiched between the pressure plate and bridge clamp for exerting a biasing force on the pressure plate.
Claim 10
Dependent Claim
23 words
The carrier as claimed in claim 7 and wherein the conductive lines within the carrier base are formed by a screen printing process.
Claim 11
Dependent Claim
22 words
The carrier as claimed in claim 8 and wherein the external contacts are formed on the conductive lines by a plating process.
Claim 12
Dependent Claim
18 words
The carrier as claimed in claim 9 and further comprising a bar code placed on the carrier base.
Claim 13
Dependent Claim
19 words
The carrier as claimed in claim 10 and wherein the carrier base includes a cavity for retaining the die.
Claim 14
Dependent Claim
27 words
The carrier as claimed in claim 11 and wherein the metal plated pads are formed on a shelf formed in the carrier base adjacent to the cavity.
Claim 15
Dependent Claim
20 words
The carrier as claimed in claim 12 and further comprising a gasket placed between the pressure plate and carrier base.
Claim 16
Dependent Claim
27 words
The carrier as claimed in claim 13 and wherein the means for establishing electrical communication is by wire bonding the metal plated pads to the conductive traces.
Claim 17
Dependent Claim
212 words
A carrier for testing an unpackaged semiconductor die, comprising: a carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base including a pair of openings; a plurality of external contacts formed on an upper surface and a lower surface of the carrier base in matched pairs, said external contacts adapted for electrical connection to external test circuitry; a plurality of metal plated pads formed around a periphery of the recess and in electrical communication with electrically conductive lines formed on a layer of the carrier base; a plurality of metal filled vias formed through adjacent layers of the carrier base for interconnecting the electrically conductive lines to the external contacts; an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to form an ohmic contact with contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with said raised contact members; means for establishing electrical communication between the metal plated pads on the carrier base and the conductive traces on the interconnect; and a force distribution mechanism clipped to the pair of openings in the base for biasing the interconnect and die together.
Claim 18
Dependent Claim
212 words
A carrier for testing an unpackaged semiconductor die, comprising: a carrier base adapted to retain the die, said carrier base formed of layers of a ceramic material bonded together, said carrier base including a pair of openings; a plurality of external contacts formed on an upper surface and a lower surface of the carrier base in matched pairs, said external contacts adapted for electrical connection to external test circuitry; a plurality of metal plated pads formed around a periphery of the recess and in electrical communication with electrically conductive lines formed on a layer of the carrier base; a plurality of metal filled vias formed through adjacent layers of the carrier base for interconnecting the electrically conductive lines to the external contacts; an interconnect mountable to the base, said interconnect comprising a substrate having a pattern of raised contact members adapted to form an ohmic contact with contact locations on the die, said interconnect further comprising a pattern of electrically conductive traces in electrical communication with said raised contact members; means for establishing electrical communication between the metal plated pads on the carrier base and the conductive traces on the interconnect; and a force distribution mechanism clipped to the pair of openings in the base for biasing the interconnect and die together.
Claim 19
Dependent Claim
48 words
The carrier as recited in claim 15 and wherein said force distribution mechanism includes a pressure plate for abutting the die, a bridge clamp clipped to the base and a spring sandwiched between the pressure plate and bridge clamp for exerting a biasing force on the pressure plate.
Claim 20
Dependent Claim
32 words
The carrier as recited in claim 16 and further comprising a sealing member mounted on the carrier base in contact with the pressure plate for sealing the die during a test procedure.
Claim 21
Dependent Claim
35 words
The carrier as recited in claim 17 and wherein the interconnect is formed with a silicon substrate and raised contact members adapted to penetrate the contact locations on the die to a limited penetration depth.
Claim 22
Dependent Claim
22 words
The carrier as claimed in claim 18 and wherein the carrier base is formed with a third opening for removing the interconnect.
Claim 23
Dependent Claim
24 words
The carrier as claimed in claim 19 and wherein the metal plated pads are formed on a bond shelf formed in the carrier base.
Claim 24
Dependent Claim
18 words
The carrier as claimed in claim 15 and further comprising a bar code attached to the carrier base.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-21 | 1999-11-20 | 2000-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-21 | 2003-11-20 | 2004-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-21 | 2007-11-20 | 2008-05-21 | $7700.00 | Window Closed / Lapsed |