US5844418A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier having interchangeable substrate used for testing of semiconductor dies
Assignee: Micron Technology Inc
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Filing: 1996-02-26
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Granted: 1998-12-01
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Expires: 2016-02-26
Abstract
Abstract A carrier for testing a singularized semiconductor die prior to packaging the die utilizes a removable die supporting substrate. The die is placed in the carrier and is electrically connected to the substrate, thereby allowing for the packaging or other use of only known good die. A bridge clamp presses against a rigid cover which, in turn, bias the die against a plurality of die contacting members located on the die supporting substrate. The use of the removable die supporting substrate permits a single carrier design to accommodate different die types and further permits handling equipment to mechanically handle the one carrier design. This facilitates the handling of the carrier so that the carrier can be conveniently used during burn-in and test procedures.
Inventors
- 👤 Alan G. Wood
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:10
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; B; B25; B25G; B25G3/00; B25G3/02; B25G3/12; B25G3/28; E; E02; E02F; E02F9/00; E02F9/28; E02F9/2808; E02F9/2816; E02F9/2833; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/0483; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P74/00; H10P74/23; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/68; H10W90/00; H10W90/701; H10W99/00; G01R3/00; G01R31/2855; G01R31/286; G01R31/2863; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0058; H05K3/0067; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W70/681; H10W72/00; H10W72/071; H10W72/0711; H10W72/07178; H10W72/072; H10W72/20; H10W72/241; H10W90/20; H10W90/24; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
115 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically engage a second contact on the substrate and a second portion configured for electrical connection to test circuitry, the third contacts releasable from the second contacts for replacing the substrate with a second substrate for testing a second die.
Claim 2
Independent Claim
115 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically engage a second contact on the substrate and a second portion configured for electrical connection to test circuitry, the third contacts releasable from the second contacts for replacing the substrate with a second substrate for testing a second die.
Claim 3
Dependent Claim
23 words
The apparatus of claim 1 further comprising a release mechanism on the base operable to release the third contacts from the second contacts.
Claim 4
Dependent Claim
17 words
The apparatus of claim 1 wherein the base is configured to mount a plurality of substrates thereon.
Claim 5
Independent Claim
128 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically contact a second contact on the substrate and a second portion configured for electrical connection to test circuitry; and a release mechanism on the base configured to release the third contacts from the substrate to permit mounting of a second substrate to the base for testing a second die using the base.
Claim 6
Independent Claim
128 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically contact a second contact on the substrate and a second portion configured for electrical connection to test circuitry; and a release mechanism on the base configured to release the third contacts from the substrate to permit mounting of a second substrate to the base for testing a second die using the base.
Claim 7
Dependent Claim
19 words
The apparatus of claim 4 wherein the base comprises a tray configured to mount a plurality of substrates thereon.
Claim 8
Dependent Claim
18 words
The apparatus of claim 4 wherein each third contact comprises a lever portion engageable by the release mechanism.
Claim 9
Dependent Claim
18 words
The apparatus of claim 4 wherein each third contact comprises a pin portion connectable to an electrical socket.
Claim 10
Independent Claim
121 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; and a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically engage a second contact on the substrate, a second portion configured for electrical connection to test circuitry, and a lever portion engageable to release the third contacts from the second contacts for replacing the substrate with a second substrate for testing a second die.
Claim 11
Independent Claim
121 words
An apparatus for testing semiconductor dice, comprising: a base; a substrate mounted to the base comprising a plurality of first contacts configured to electrically engage a plurality of contact locations on a die, and a plurality of second contacts in electrical communication with the first contacts; and a plurality of third contacts formed on the base as a latching mechanism for retaining the substrate on the base, each third contact comprising a first portion configured to electrically engage a second contact on the substrate, a second portion configured for electrical connection to test circuitry, and a lever portion engageable to release the third contacts from the second contacts for replacing the substrate with a second substrate for testing a second die.
Claim 12
Dependent Claim
22 words
The apparatus of claim 8 further comprising a release mechanism on the base configured to engage lever portions of the third contacts.
Claim 13
Dependent Claim
19 words
The apparatus of claim 8 wherein the base comprises a tray configured to mount a plurality of substrates thereon.
Claim 14
Dependent Claim
18 words
The apparatus of claim 8 wherein each third contact comprises a pin portion connectable to an electrical socket.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-30 | 2002-06-01 | 2002-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-30 | 2006-06-01 | 2006-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-30 | 2010-06-01 | 2010-12-01 | $7700.00 | Window Closed / Lapsed |