Test board for semiconductor packages

Claim 1

A burn-in device for resting leadless semiconductor packages, comprising: a printed circuit board having a planar outer board surface and having terminal and electrical circuits thereon and through holes therein, said terminals having outer terminal surfaces formed in planes parallel to said board surface; a frame plate on said board having a plurality of through openings over said terminals and of a size for receiving and for positioning respective semiconductor packages therein; a plurality of elastic connectors mounted in said openings, said connectors having lower surfaces opposing and contacting said terminal surfaces and upper surfaces opposite said lower surfaces, said upper surfaces being disposed so as to receive the semiconductor packages thereon when the packages are positioned in said openings, said connectors being formed of an elastic material and each having embedded therein a plurality of thin metal wires electrically insulated from each other extending from said lower surfaces to said upper surfaces for providing electrical connection between semiconductor packages on said upper surfaces and said terminal surfaces opposing said lower surfaces; and a cover plate over said board, having a back side opposing said openings and a plurality of elastic bodies attached to said back side and aligned with said openings, said cover plate being movable toward said board such that said elastic bodies press downwardly on the semiconductor packages positioned in said openings so as to elastically press the semiconductor packages against said elastic connectors so as to insure electrical connection of the semiconductor packages with said terminals through said metal wires.