US5397245A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-destructive interconnect system for semiconductor devices
Assignee: Texas Instruments Inc
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Filing: 1993-10-29
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Granted: 1995-03-14
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Expires: 2013-10-29
Abstract
Abstract An interconnect system (8') for providing electrical connection to bond pads on a semiconductor device (21) includes a socket (12) having a plurality of conductors (46) and a carrier assembly (40) mounted on the socket (12) for carrying a semiconductor device (21). The carrier assembly (40) includes a substrate (17) having a compliant membrane (20b) and a plurality of contact bumps (24) on a top surface of the compliant membrane (20b) for contacting bond pads on the semiconductor device (21) and a force applying mechanism (63). Compliant membrane (20b) is part of a thin film interconnect (20). Contact bumps (24) are connected electrically with conductors (46) by conductive traces (19) and contact pads (18) formed on the thin film interconnect (20). The force applying mechanism (63') applies pressure in making temporary electrical connection between contact bumps (24) and the bond pads of semiconductor device (21). The interconnection system ( 8') provides non-destructive interconnection to semiconductor device (21).
Inventors
- 👤 Randal D. Roebuck
- 👤 Salvatore P. Rizzo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 22:33
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1007; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; H05K7/1015; H05K7/1023
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
104 words
An interconnect system for providing electrical connection to contact pads on a semiconductor device, comprising: a socket having a plurality of conductors, said conductors including retractable contact portions; a carrier assembly mounted on said socket for carrying a semiconductor device, said carrier assembly including a substrate having a compliant membrane, a plurality of contact bumps on a top surface of said compliant membrane for contacting bond pads on the semiconductor device, said substrate also including a plurality of conductive pads electrically connected to said contact bumps, said retractable contact portions selectively contacting said conductive pads to electrically connect the semiconductor device to said conductors.
Claim 2
Dependent Claim
104 words
An interconnect system for providing electrical connection to contact pads on a semiconductor device, comprising: a socket having a plurality of conductors, said conductors including retractable contact portions; a carrier assembly mounted on said socket for carrying a semiconductor device, said carrier assembly including a substrate having a compliant membrane, a plurality of contact bumps on a top surface of said compliant membrane for contacting bond pads on the semiconductor device, said substrate also including a plurality of conductive pads electrically connected to said contact bumps, said retractable contact portions selectively contacting said conductive pads to electrically connect the semiconductor device to said conductors.
Claim 3
Dependent Claim
23 words
The interconnect system of claim 1 in which said conductors terminate in pins for insertion into plated through-holes in a printed wire board.
Claim 4
Dependent Claim
15 words
The interconnect system of claim 1 in which said semiconductor device is a semiconductor die.
Claim 5
Dependent Claim
21 words
The interconnect system of claim 1 in which said semiconductor device is a semiconductor wafer having a plurality of semiconductor die.
Claim 6
Dependent Claim
37 words
The interconnect system of claim 1 in which said substrate includes a base and a thin film interconnect extending over a top surface of said base, said compliant membrane being a portion of said thin film interconnect.
Claim 7
Dependent Claim
20 words
The interconnect system of claim 5 in which said base has an opening, said compliant membrane extending over said opening.
Claim 8
Dependent Claim
32 words
The interconnect system of claim 1 in which said carrier assembly includes support means for contacting a bottom surface of said compliant membrane to keep said contact bumps in a common plane.
Claim 9
Dependent Claim
24 words
The interconnect system of claim 7 in which said support means for contacting a bottom surface of said compliant membrane includes a flexible member.
Claim 10
Dependent Claim
14 words
The interconnect system of claim 8 in which said flexible member is an elastomer.
Claim 11
Dependent Claim
22 words
The interconnect system of claim 6 in which said carrier assembly includes a backplate attached to a bottom surface of said base.
Claim 12
Dependent Claim
56 words
The interconnect system of claim 10 in which said carrier assembly includes an insert mounted on said backplate and a flexible member on said insert for contacting a bottom surface of said compliant membrane to keep said contact bumps in a common plane, said insert and said flexible member extending into said opening in said base.
Claim 13
Dependent Claim
32 words
The interconnect system of claim 5 in which a plurality of conductive traces are formed on said thin film interconnect, said conductive traces electrically connecting said contact bumps and said conductive pads.
Claim 14
Dependent Claim
35 words
The interconnect system of claim 1 in which said carrier assembly includes means for contacting a top surface of the semiconductor device to force the bond pads of the semiconductor device against said contact bumps.
Claim 15
Dependent Claim
24 words
The interconnect system of claim 13 in which said means for contacting a top surface of the semiconductor device includes a spring biased lid.
Claim 16
Dependent Claim
52 words
The interconnect system of claim 14 in which said means for contacting a top surface of the semiconductor device includes a conductive biasing clip between the top surface of the semiconductor device and said spring biased lid for contacting a top surface of the semiconductor device to electrically bias the semiconductor device.
Claim 17
Dependent Claim
31 words
The interconnect system of claim 1 in which said carrier assembly includes a conductive biasing clip for contacting a top surface of the semiconductor device to electrically bias the semiconductor device.
Claim 18
Dependent Claim
167 words
The interconnect system of claim 5 in which said carrier assembly includes: a pair of posts extending from said base, each of said posts having a shaft having a first diameter and a head having a second diameter greater than said first diameter; a lid having a pair of openings through which said posts extend; a latch having a pair of openings, each of said openings in said latch having a first portion larger than a head of an associated one of said posts and a second portion smaller than a head of an associated one of said posts; a pressure screw extending from said latch and having a spring biased tip for contacting said lid to apply force to the top surface of the semiconductor device to force the contact pads of the semiconductor device against said contact bumps, said pressure screw forcing said latch against said heads of said posts when said shafts are aligned with said second portions of said openings in said latch.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-03-13 | 1998-09-12 | 1999-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-03-13 | 2002-09-12 | 2003-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-03-13 | 2006-09-12 | 2007-03-14 | $7700.00 | Window Closed / Lapsed |