US5808360A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microbump interconnect for bore semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1996-05-15
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Granted: 1998-09-15
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Expires: 2016-05-15
Abstract
Abstract A method for forming an interconnect for making a temporary or permanent electrical connection to a semiconductor dice is provided. The method includes forming a substrate with an insulating layer and a pattern of conductors thereon. The conductors are formed as a bi-metal stack including a barrier layer formed of an inert metal and a conductive layer formed of a highly conductive metal. Microbumps are formed on the conductors by deposition through a mask using an electroplating, electroless plating, screen printing or evaporation process. The interconnect can be used to provide a temporary electrical connection for testing bare semiconductor dice. Alternately the interconnect can be used for flip chip mounting dice for fabricating multi chip modules and other electronic devices.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H10W72/019; H10W72/20; H10W78/00; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/0271; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10848; H05K3/30; H05K3/32; H05K3/325; H05K3/326; H10W72/251; H10W72/252; H10W72/261; H10W72/29; H10W72/851; H10W72/874; H10W72/90; H10W72/941; H10W72/9415; H10W72/951
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
96 words
An interconnect for making electrical connections with a semiconductor die comprising: a substrate; a compliant layer on the substrate, the compliant layer comprising a polymeric material; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors having a pattern matching pads on the die, each microbump comprising a first portion bonded to a conductor and a convex tip portion configured to electrically contact a pad on the die, with the conductors and microbumps configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or the pads.
Claim 2
Dependent Claim
96 words
An interconnect for making electrical connections with a semiconductor die comprising: a substrate; a compliant layer on the substrate, the compliant layer comprising a polymeric material; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors having a pattern matching pads on the die, each microbump comprising a first portion bonded to a conductor and a convex tip portion configured to electrically contact a pad on the die, with the conductors and microbumps configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or the pads.
Claim 3
Dependent Claim
23 words
The interconnect of claim 1 wherein each microbump comprises a material selected from the group consisting of copper, gold, nickel, palladium and solder.
Claim 4
Dependent Claim
19 words
The interconnect of claim 31 wherein each microbump comprises solder and includes a solder wettable contact on the conductor.
Claim 5
Dependent Claim
11 words
The interconnect of claim 1 wherein the polymeric material comprises polyimide.
Claim 6
Dependent Claim
16 words
The interconnect of claim 1 wherein the interconnect and the die comprise a multi chip module.
Claim 7
Dependent Claim
14 words
The interconnect of claim 1 further comprising a cap layer formed on each microbump.
Claim 8
Dependent Claim
28 words
The interconnect of claim 1 wherein the conductive layers comprise a material selected from the group consisting of copper, aluminum, titanium, tantalum, molybdenum and alloys of these metals.
Claim 9
Dependent Claim
22 words
The interconnect of claim 6 wherein the cap layer comprises a material selected from the group consisting of palladium, gold and platinum.
Claim 10
Dependent Claim
89 words
An interconnect for making electrical connections with a semiconductor die comprising: a substrate; a polyimide compliant layer on the substrate; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors in a pattern matching pads on the die, each microbump including a first portion attached to a conductor and a second portion configured to electrically contact a pad on the die, with the microbumps and the conductors configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or pads.
Claim 11
Dependent Claim
89 words
An interconnect for making electrical connections with a semiconductor die comprising: a substrate; a polyimide compliant layer on the substrate; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors in a pattern matching pads on the die, each microbump including a first portion attached to a conductor and a second portion configured to electrically contact a pad on the die, with the microbumps and the conductors configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or pads.
Claim 12
Dependent Claim
26 words
The interconnect of claim 9 further comprising a cap layer on each microbump comprising a metal selected from the group consisting of palladium, gold and platinum.
Claim 13
Dependent Claim
24 words
The interconnect of claim 9 wherein each microbump comprises a material selected from the group consisting of alloys of tin, silver, copper and indium.
Claim 14
Dependent Claim
92 words
A multi chip module comprising: a substrate; a polymeric compliant layer on the substrate; a pattern of conductors on the compliant layer; a plurality of microbumps bonded to the conductors in a first pattern; at least one semiconductor die flip chip mounted to the substrate, the die including a plurality of pads formed in a second pattern matching the first pattern, with each pad in electrical communication with a microbump, and with the microbumps and conductors configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or pads.
Claim 15
Dependent Claim
92 words
A multi chip module comprising: a substrate; a polymeric compliant layer on the substrate; a pattern of conductors on the compliant layer; a plurality of microbumps bonded to the conductors in a first pattern; at least one semiconductor die flip chip mounted to the substrate, the die including a plurality of pads formed in a second pattern matching the first pattern, with each pad in electrical communication with a microbump, and with the microbumps and conductors configured to flex with the compliant layer to accommodate dimensional variations in the microbumps or pads.
Claim 16
Dependent Claim
19 words
The multi chip module of claim 12 wherein the microbumps comprise solder and solder wettable contacts on the conductors.
Claim 17
Dependent Claim
27 words
The multi chip module of claim 12 wherein the microbumps comprise a solder material selected from the group consisting of alloys of tin, silver, copper and indium.
Claim 18
Dependent Claim
102 words
A test assembly for a semiconductor die comprising: a base; an interconnect mounted to the base and comprising: a substrate; a polymeric compliant layer on the substrate; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors having a first pattern matching a second pattern of pads on the die, each microbump including a first portion bonded to a conductor, and a second portion configured to electrically contact a pad on the die, the microbumps configured to flex with the conductors and with the compliant layer, to accommodate dimensional variations in the microbumps or the pads.
Claim 19
Dependent Claim
102 words
A test assembly for a semiconductor die comprising: a base; an interconnect mounted to the base and comprising: a substrate; a polymeric compliant layer on the substrate; a plurality of conductors on the compliant layer; and a plurality of microbumps on the conductors having a first pattern matching a second pattern of pads on the die, each microbump including a first portion bonded to a conductor, and a second portion configured to electrically contact a pad on the die, the microbumps configured to flex with the conductors and with the compliant layer, to accommodate dimensional variations in the microbumps or the pads.
Claim 20
Dependent Claim
12 words
The assembly of claim 15 wherein each conductor comprises a bi-metal stack.
Claim 21
Dependent Claim
25 words
The assembly of claim 15 wherein each microbump includes a cap layer comprising a metal selected from the group consisting of palladium, gold and platinum.
Claim 22
Dependent Claim
11 words
The assembly of claim 15 wherein the polymeric material comprises polyimide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-14 | 2002-03-16 | 2002-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-14 | 2006-03-16 | 2006-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-14 | 2010-03-16 | 2010-09-15 | $7700.00 | Window Closed / Lapsed |