US5569960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic component, electronic component assembly and electronic component unit
Assignee: Hitachi Ltd
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Filing: 1995-05-10
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Granted: 1996-10-29
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Expires: 2015-05-10
Abstract
Abstract An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.
Inventors
- 👤 Tetsuo Kumazawa
- 👤 Makoto Kitano
- 👤 Akihiro Yaguchi
- 👤 Ryuji Kohno
- 👤 Naotaka Tanaka
- 👤 Nae Yoneda
- 👤 Ichiro Anjoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:21
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/094; H05K2203/00; H05K2203/04; H05K2203/0465; H10W72/071; H10W72/072; H10W72/07251; H10W72/07253; H10W72/20; H10W72/231; H10W72/237; H10W72/251; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
326 words
An electronic component unit comprising: a first electronic component having an internal electric circuit therein; a second electronic component having an internal electric circuit therein and disposed in substantially parallel relationship to said first electronic component; at least five electrode pads provided on a surface of said first electronic component facing said second electronic component and electrically connected to the internal electric circuit of said first component, one of said at least five pads on said first electronic component being disposed adjacent a central portion of said first electronic component, two of said at least five pads on said first electronic component being disposed adjacent opposite outer peripheral edges of said first electronic component, and the remainder of said at least five pads on said first electronic component being successively disposed between said two of said at least five pads on said first electronic component; at least five electrode pads provided on a surface of said second electronic component facing said first electronic component, said at least five pads being respectively disposed substantially in alignment with the at least five pads of said first electronic component; and at least five discrete metallic bonding elements disposed between said first and second electronic components for electrically and mechanically connecting together the respective at least five pads of said first electronic component and the at least five pads of said second electronic component; wherein: the ratios of the surface areas of the at least five pads of at least one of said first and second electronic components to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said central portion toward at least one of said outer peripheral edges; and each of the pads of said first and second electronic components is bonded to an associated metallic bonding element over the substantially whole area of the pad, whereby the shapes of the metallic bonding elements connected to the successive pads are different.
Claim 2
Dependent Claim
326 words
An electronic component unit comprising: a first electronic component having an internal electric circuit therein; a second electronic component having an internal electric circuit therein and disposed in substantially parallel relationship to said first electronic component; at least five electrode pads provided on a surface of said first electronic component facing said second electronic component and electrically connected to the internal electric circuit of said first component, one of said at least five pads on said first electronic component being disposed adjacent a central portion of said first electronic component, two of said at least five pads on said first electronic component being disposed adjacent opposite outer peripheral edges of said first electronic component, and the remainder of said at least five pads on said first electronic component being successively disposed between said two of said at least five pads on said first electronic component; at least five electrode pads provided on a surface of said second electronic component facing said first electronic component, said at least five pads being respectively disposed substantially in alignment with the at least five pads of said first electronic component; and at least five discrete metallic bonding elements disposed between said first and second electronic components for electrically and mechanically connecting together the respective at least five pads of said first electronic component and the at least five pads of said second electronic component; wherein: the ratios of the surface areas of the at least five pads of at least one of said first and second electronic components to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said central portion toward at least one of said outer peripheral edges; and each of the pads of said first and second electronic components is bonded to an associated metallic bonding element over the substantially whole area of the pad, whereby the shapes of the metallic bonding elements connected to the successive pads are different.
Claim 3
Dependent Claim
45 words
An electronic component unit according to claim 1, wherein the surface areas of said successive pads of said at least one of said electronic components vary stepwise in said at least one direction, and the volumes of the metallic bonding elements are substantially the same.
Claim 4
Dependent Claim
23 words
An electronic component unit according to claim 2, wherein the areas of said successive pads increase stepwise in said at least one direction.
Claim 5
Dependent Claim
23 words
An electronic component unit according to claim 2, wherein the areas of said successive pads decrease stepwise in said at least one direction.
Claim 6
Dependent Claim
72 words
An electronic component unit according to claim 1, wherein the surface areas of said successive pads of said at least one of said electronic components are substantially the same, and the volumes of the metallic bonding elements connected to said at least one of said electronic components is different from the volume of the metallic bonding element connected to said other pad successive pads vary stepwise in said at least one direction.
Claim 7
Dependent Claim
62 words
An electronic component unit according to claim 1, wherein said first electronic component is a semiconductor package comprising a substrate and a semiconductor chip, said substrate having first and second surfaces, with said at least five pads being provided on said first surface, and said semiconductor chip being mounted on said second surface; and said second electronic component is a circuit substrate.
Claim 8
Dependent Claim
25 words
An electronic component unit according to claim 1, wherein said first electronic component is a semiconductor chip, and said second electronic component is a substrate.
Claim 9
Dependent Claim
21 words
An electronic component unit according to claim 1, wherein the intervals between said pads vary in said at least one direction.
Claim 10
Dependent Claim
36 words
An electronic component unit according to claim 1, wherein each of said metallic bonding elements comprises a solder material containing at least one metal selected from the group consisting of PB, Sn, Au, In and Sb.
Claim 11
Dependent Claim
43 words
An electronic component unit according to claim 9, wherein the metallic bonding element connected to said one pad comprises a solder material having a melting point different from that of the solder material of the metallic bonding elements connected to said successive pads.
Claim 12
Dependent Claim
25 words
An electronic component unit according to claim 1, wherein each of said pads comprises at least one of a Ni layer and an Au layer.
Claim 13
Dependent Claim
30 words
An electronic component unit according to claim 1, wherein said at least five pads are respectively arranged at intersections of phantom longitudinal and lateral lines which form a lattice pattern.
Claim 14
Dependent Claim
36 words
An electronic component unit according to claim 12, wherein the ratios of the surface areas of said successive pads to the volumes of said respective metallic bonding elements increase stepwise in said at least one direction.
Claim 15
Dependent Claim
36 words
An electronic component unit according to claim 12, wherein the ratios of the surface areas of said successive pads to the volumes of said respective metallic bonding elements decrease stepwise in said at least one direction.
Claim 16
Dependent Claim
21 words
An electronic component unit according to claim 12, wherein the intervals between said pads vary in said at least one direction.
Claim 17
Dependent Claim
45 words
An electronic component unit according to claim 1, wherein the surface areas of each of said at least five electrode pads on said first electronic component are substantially the same as the surface areas of the respective electrode pads disposed on said second electronic component.
Claim 18
Dependent Claim
210 words
An electronic component comprising a first electronic component member having an internal electric circuit therein and adapted to be electrically and mechanically connected to another electronic component member through metallic bonding elements, said first electronic component member having a surface adapted to be connected to said another electronic component member, and at least five electrode pads disposed on said surface and electrically connected to said internal electric circuit; wherein: each of said at least five electrode pads has a surface having a property of being wetted with a molten metal of said metallic bonding elements; said at least five electrode pads are adapted to be electrically and mechanically connected to said another electronic component through said metallic bonding elements; one of said at least five pads is disposed adjacent a center of said surface, two of said at least five pads are disposed adjacent opposite outer edges of said surface, and the remainder of said at least five pads are successively disposed between said two of said at least five pads; and the ratios of the surface areas of the successive pads to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said central portion toward at least one of said outer edges.
Claim 19
Dependent Claim
210 words
An electronic component comprising a first electronic component member having an internal electric circuit therein and adapted to be electrically and mechanically connected to another electronic component member through metallic bonding elements, said first electronic component member having a surface adapted to be connected to said another electronic component member, and at least five electrode pads disposed on said surface and electrically connected to said internal electric circuit; wherein: each of said at least five electrode pads has a surface having a property of being wetted with a molten metal of said metallic bonding elements; said at least five electrode pads are adapted to be electrically and mechanically connected to said another electronic component through said metallic bonding elements; one of said at least five pads is disposed adjacent a center of said surface, two of said at least five pads are disposed adjacent opposite outer edges of said surface, and the remainder of said at least five pads are successively disposed between said two of said at least five pads; and the ratios of the surface areas of the successive pads to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said central portion toward at least one of said outer edges.
Claim 20
Dependent Claim
23 words
An electronic component according to claim 17, wherein the surface areas of said successive pads vary stepwise in said at least one direction.
Claim 21
Dependent Claim
23 words
An electronic component according to claim 18, wherein the surface areas of said successive pads increase stepwise in said at least one direction.
Claim 22
Dependent Claim
23 words
An electronic component according to claim 18, wherein the surface areas of said successive pads decrease stepwise in said at least one direction.
Claim 23
Dependent Claim
24 words
An electronic component according to claim 17, wherein each of said pads has at least one of a Ni layer and an Au layer.
Claim 24
Dependent Claim
43 words
An electronic component according to claim 17, wherein said at least five pads are respectively disposed on intersections of phantom longitudinal and lateral lines which form a lattice pattern, and the intervals between said successive pads change in said at least one direction.
Claim 25
Dependent Claim
179 words
An electronic component assembly comprising: an electronic component having an internal electric circuit therein: at least five electrode pads electrically connected to said internal electric circuit and provided on a surface of said electronic component so as to be connected to another electronic component, one of said at least five pads being disposed adjacent a center of said surface, two of said at least five pads being disposed adjacent opposite outer edges of said surface, and the remainder of said at least five pads being successively disposed between said two of said at least five pads; and at least five metallic bonding elements respectively disposed on said at least five pads to form bumps; wherein: said at least five pads have surfaces having a property of being wetted with a molten metal of the metallic bonding elements; the ratios of the surface areas of the at least five pads to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said center of said surface toward at least one of said outer edges.
Claim 26
Dependent Claim
179 words
An electronic component assembly comprising: an electronic component having an internal electric circuit therein: at least five electrode pads electrically connected to said internal electric circuit and provided on a surface of said electronic component so as to be connected to another electronic component, one of said at least five pads being disposed adjacent a center of said surface, two of said at least five pads being disposed adjacent opposite outer edges of said surface, and the remainder of said at least five pads being successively disposed between said two of said at least five pads; and at least five metallic bonding elements respectively disposed on said at least five pads to form bumps; wherein: said at least five pads have surfaces having a property of being wetted with a molten metal of the metallic bonding elements; the ratios of the surface areas of the at least five pads to the volumes of the respective metallic bonding elements vary stepwise in at least one direction from said center of said surface toward at least one of said outer edges.
Claim 27
Dependent Claim
51 words
An electronic component assembly according to claim 23, wherein said electronic component is a semiconductor package comprising a substrate and a semiconductor chip, said substrate having first and second surfaces, said at least five pads being provided on said first surface, and said semiconductor chip being provided on said second surface.
Claim 28
Dependent Claim
30 words
An electronic component assembly according to claim 23, wherein said electronic component is a semiconductor chip, and said at least five pads are provided on a surface of said chip.
Claim 29
Dependent Claim
29 words
An electronic component assembly according to claim 23, wherein said electronic component is a substrate, and said at least five pads are provided on a surface of said substrate.
Claim 30
Dependent Claim
24 words
An electronic component assembly according to claim 23, wherein the surface areas of said successive pads vary stepwise in said at least one direction.
Claim 31
Dependent Claim
25 words
An electronic component assembly according to claim 27, wherein the volumes of the metallic bonding elements connected to said successive pads are substantially the same.
Claim 32
Dependent Claim
24 words
An electronic component assembly according to claim 28, wherein the surface areas of said successive pads increase stepwise in said at least one direction.
Claim 33
Dependent Claim
24 words
An electronic component assembly according to claim 28, wherein the surface areas of said successive pads decrease stepwise in said at least one direction.
Claim 34
Dependent Claim
15 words
An electronic component assembly according to claim 23, wherein the intervals between said pads vary.
Claim 35
Dependent Claim
36 words
An electronic component assembly according to claim 23, wherein each of said metallic bonding elements comprises a solder material containing at least one metal selected from the group consisting of Pb, Sn, Au, In and Sb.
Claim 36
Dependent Claim
43 words
An electronic component assembly according to claim 32, wherein the metallic bonding material connected to said one pad comprises a solder material having a melting point different from that of the solder material of the metallic bonding elements connected to said other pads.
Claim 37
Dependent Claim
26 words
An electronic component assembly according to claim 23, wherein each of said electrode pads has at least one of a Ni layer and a Au layer.
Claim 38
Dependent Claim
30 words
An electronic component assembly according to claim 23, wherein said at least five pads are respectively disposed at intersections of phantom longitudinal and lateral lines which form a lattice form.
Claim 39
Dependent Claim
36 words
An electronic component assembly according to claim 35, wherein the ratios of the surface areas of said successive pads to the volumes of said respective metallic bonding elements increase stepwise in said at least one direction.
Claim 40
Dependent Claim
36 words
An electronic component assembly according to claim 35, wherein the ratios of the surface areas of said successive pads to the volumes of said respective metallic bonding elements decrease stepwise in said at least one direction.
Claim 41
Dependent Claim
22 words
An electronic component assembly according to claim 35, wherein the intervals between said successive pads change in said at least one direction.
References Cited (Backward Citations)
US3871015A
Cited
US5216278A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-29 | 2000-04-29 | 2000-10-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-29 | 2004-04-29 | 2004-10-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-29 | 2008-04-29 | 2008-10-29 | $7700.00 | Window Closed / Lapsed |