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US5987744A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for supporting one or more electronic components

Assignee: Prolinx Labs Corp
•
Filing: 1997-07-01
•
Granted: 1999-11-23
•
Expires: 2017-07-01
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Abstract

Abstract A structure includes a support layer formed of a conductive material, such as a sheet of copper. The support layer has a number of conductive islands isolated from other portions of the support layer by isolation gaps. The support layer is sandwiched between two compound layers each of which is formed of a dielectric layer having a number of via holes and conductive elements located in the via holes. The conductive elements are formed at predetermined locations such that a conductive element in each compound layer contacts a conductive island in the support layer. The structure also includes two conductive layers formed on the two respective compound layers such that a trace in a first conductive layer is coupled to a trace in a second conductive layer through two conductive elements in the respective two compound layers and an island in the support layer. Such a structure can be formed by a number of processes. For example, the support layer can be formed by etching a sheet of conductive material, the compound layers can be formed by placing a conductive paste in via holes in a dielectric layer, and the conductive layers can be formed by lamination followed by etching to form traces.

Inventors

  • 👤 James J. D. Lan
  • 👤 Steve S. Chiang
  • 👤 Paul Y. F. Wu
  • 👤 John Y. Xie

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 10:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05; H05K; H05K3/00; H05K3/44; H05K3/445; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/03; H05K2203/0323; H05K2203/07; H05K2203/0703; H05K2203/0733; H05K3/02; H05K3/06; H05K3/10; H05K3/20; H05K3/205; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/5366; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 197 words
A method of forming a structure for supporting one or more electronic components, said method of comprising: forming a first compound layer on a sheet of conductive material, said first compound layer comprising a first dielectric layer with a first via hole at a predetermined location, said first compound layer further comprising a first conductive element located in said first via hole; forming a first conductive layer on said first compound layer; etching said sheet to form a support layer comprising a conductive island and a conductive portion, wherein said conductive island is located at said predetermined location and further wherein said conductive portion is separated from said conductive island by an isolation gap; etching said first conductive layer to form a plurality of first traces a predetermined first trace being electrically coupled to said conductive island by said first conductive element; and forming a second compound layer on said second side of said support layer; forming a second conductive layer on said second compound layer; and etching said second conductive layer to form a plurality of second traces such that a predetermined second trace is electrically coupled to said predetermined first trace through said conductive island.
Claim 2
Independent Claim 197 words
A method of forming a structure for supporting one or more electronic components, said method of comprising: forming a first compound layer on a sheet of conductive material, said first compound layer comprising a first dielectric layer with a first via hole at a predetermined location, said first compound layer further comprising a first conductive element located in said first via hole; forming a first conductive layer on said first compound layer; etching said sheet to form a support layer comprising a conductive island and a conductive portion, wherein said conductive island is located at said predetermined location and further wherein said conductive portion is separated from said conductive island by an isolation gap; etching said first conductive layer to form a plurality of first traces a predetermined first trace being electrically coupled to said conductive island by said first conductive element; and forming a second compound layer on said second side of said support layer; forming a second conductive layer on said second compound layer; and etching said second conductive layer to form a plurality of second traces such that a predetermined second trace is electrically coupled to said predetermined first trace through said conductive island.
Claim 3
Dependent Claim 25 words
The method of claim 1 further comprising forming a plurality of annular gaps in said first dielectric layer during formation of said first compound layer.
Claim 4
Dependent Claim 22 words
The method of claim 2 wherein said sheet is etched after etching of said first conductive layer and said second conductive layer.
Claim 5
Independent Claim 156 words
A method of forming a structure for supporting one or more electronic components, said method of comprising: forming a first compound layer on a sheet of conductive material, said first compound layer comprising a first dielectric layer with a first via hole at a predetermined location, said first compound layer further comprising a first conductive element located in said first via hole; forming a first conductive layer on said first compound layer; etching said sheet to form a support layer comprising a conductive island and a conductive portion, wherein said conductive island is located at said predetermined location and further wherein said conductive portion is separated from said conductive island by an isolation gap; etching said first conductive layer to form a plurality of first traces, a predetermined first trace being electrically coupled to said conductive island by said first conductive element; and applying an adhesive layer on said sheet prior to forming said compound layer.
Claim 6
Independent Claim 156 words
A method of forming a structure for supporting one or more electronic components, said method of comprising: forming a first compound layer on a sheet of conductive material, said first compound layer comprising a first dielectric layer with a first via hole at a predetermined location, said first compound layer further comprising a first conductive element located in said first via hole; forming a first conductive layer on said first compound layer; etching said sheet to form a support layer comprising a conductive island and a conductive portion, wherein said conductive island is located at said predetermined location and further wherein said conductive portion is separated from said conductive island by an isolation gap; etching said first conductive layer to form a plurality of first traces, a predetermined first trace being electrically coupled to said conductive island by said first conductive element; and applying an adhesive layer on said sheet prior to forming said compound layer.
Claim 7
Independent Claim 133 words
A method of forming a structure for supporting one or more electronic components, said method comprising: forming two compound layers simultaneously on two sides of a sheet of conductive material, each of said compound layers comprising a dielectric layer with a plurality of via holes at predetermined locations, one of said dielectric layers having a plurality of gaps, with each gap exposing a portion of said sheet; placing a conductive paste in each of said via holes; forming a conductive layer on each of said compound layers; etching said conductive layers simultaneously to form traces and to expose gaps in said compound layers; etching said sheet through said gaps to form a number of isolation gaps in said sheet; and filling in said isolation gaps with a dielectric material to form isolation rings.
Claim 8
Independent Claim 133 words
A method of forming a structure for supporting one or more electronic components, said method comprising: forming two compound layers simultaneously on two sides of a sheet of conductive material, each of said compound layers comprising a dielectric layer with a plurality of via holes at predetermined locations, one of said dielectric layers having a plurality of gaps, with each gap exposing a portion of said sheet; placing a conductive paste in each of said via holes; forming a conductive layer on each of said compound layers; etching said conductive layers simultaneously to form traces and to expose gaps in said compound layers; etching said sheet through said gaps to form a number of isolation gaps in said sheet; and filling in said isolation gaps with a dielectric material to form isolation rings.
Claim 9
Dependent Claim 23 words
The method of claim 5 wherein during said step of filling, protective layers are formed on said compound layers and said conductive layers.
Claim 10
Dependent Claim 12 words
The method of claim 5 wherein said gaps are annular in shape.
Claim 11
Independent Claim 113 words
A method of forming a structure for supporting one or more electronic components, said method comprising: etching a plurality of through holes in a sheet of conductive material; applying a dielectric material to exposed surfaces of the through holes in said sheet and applying said dielectric material to both sides of said sheet: forming via holes in each of said dielectric layers at predetermined locations; forming a conductive element in each of said through holes and in each of said via holes, wherein said forming a conductive element comprises filling said through holes with conductive paste; forming conductive layers on each of the dielectric layers; and etching the conductive layers to form traces.
Claim 12
Independent Claim 113 words
A method of forming a structure for supporting one or more electronic components, said method comprising: etching a plurality of through holes in a sheet of conductive material; applying a dielectric material to exposed surfaces of the through holes in said sheet and applying said dielectric material to both sides of said sheet: forming via holes in each of said dielectric layers at predetermined locations; forming a conductive element in each of said through holes and in each of said via holes, wherein said forming a conductive element comprises filling said through holes with conductive paste; forming conductive layers on each of the dielectric layers; and etching the conductive layers to form traces.

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-11-22 2003-05-24 2003-11-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-11-22 2007-05-24 2007-11-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-11-22 2011-05-24 2011-11-23 $7700.00 Window Closed / Lapsed

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