TiW2 N Fusible links in semiconductor integrated circuits

Claim 2

A semiconductor integrated circuit, comprising: (a) a semiconductor body having a surface and a layer of insulating material over said surface; and (b) a plurality of memory elements, each memory element including a semiconductive device within said body and a fusible link carried by said layer of insulating material and coupled in series with said semiconductive device, said fusible link being formed from titanium-tungsten-nitride.

Claim 3

The invention according to claim 1, wherein said fusible link comprises a film of titanium-tungsten-nitride about 600 angstroms thick.

Claim 4

The invention according to claim 1 wherein the resistivity of said film is about 270 micro-ohm-centimeters.

Claim 5

The invention according to claim 1 wherein said semiconductive device is a diode.

Claim 6

The invention according to claim 1, wherein said semiconductive device is a Schottky diode.

Claim 7

A semiconductor integrated circuit, comprising: (a) a semiconductor body having a surface and a layer of insulating material over said surface; (b) a matrix of rows and columns of conductors; (c) an array of memory elements, each memory element including a semiconductive device within said body and a fusible link carried by said layer of insulating material and connected in series with said semiconductive device between a row conductor and a column conductor; (d) at least one additional semiconductive device within said body not forming a part of said memory array, said additional semiconductor device including a region of said semiconductor body lying along said surface and extending below said surface; and (e) a plural metal layer structure in electrical contact with said region at said surface, one of said metal layers serving as a barrier layer between another of said metal layers superposed thereon and said region, both said one metal layer and said fusible link being formed from titanium-tungsten-nitride.

Claim 8

A semiconductor integrated circuit, comprising: (a) a semiconductor body having a surface and a layer of insulating material over said surface; (b) a matrix of rows and columns of conductors; (c) an array of memory elements, each memory element including a semiconductive device within said body and a fusible link carried by said layer of insulating material and connected in series with said semiconductive device between a row conductor and a column conductor; (d) at least one additional semiconductive device within said body not forming a part of said memory array, said additional semiconductor device including a region of said semiconductor body lying along said surface and extending below said surface; and (e) a plural metal layer structure in electrical contact with said region at said surface, one of said metal layers serving as a barrier layer between another of said metal layers superposed thereon and said region, both said one metal layer and said fusible link being formed from titanium-tungsten-nitride.

Claim 9

The invention according to claim 6 wherein said fusible link and barrier layer comprise a film of titanium-tungsten-nitride about 600 angstroms thick.

Claim 10

The invention according to claim 6 wherein the resistivity of said film is about 270 micro-ohm-centimeters.

Claim 11

The invention according to claim 6 wherein said semiconductive device is a Schottky diode.

Claim 12

The invention according to claim 6 wherein said additional semiconductive device is a bipolar transistor, and said one metal layer serves as the electrical contact to an emitter region of the bipolar transistor.

Claim 13

The invention according to claim 10 wherein said bipolar transistor has collector contact region and there is an additional plural metal layer structure in which the titanium-tungsten-nitride forms a barrier layer at said collector contact region.