Multi-refractory films for gallium arsenide devices

Claim 1

A method for constructing systems of sealed refractory layers, in a vacuum, for GaAs semiconductor devices having gold as a conducting electrode, said method requiring no annealing of said systems, comprising the steps of: forming a refractory layer of a material selected from the group consisting of tantalum, tungsten, and titanium tungsten alloy on a surface of a GaAs substrate for providing a Schottky barrier therebetween, said substrate being maintained at an elevated temperature of approximately 90° C. for said tantalum and said tungsten and approximately 110° C. for said titanium tungsten alloy, said temperatures being sufficient for desorbing interfacial oxides and surface impurities and for providing adhesion between said refractory layer and GaAs; sealing said refractory layer by depositing a layer of platinum at a substrate temperature in the range of appproximately 90° C. to 175° C. for the tantalum and the tungsten and approximately 90° C. for the titanium tungsten alloy, said temperature being sufficient for doping said refractory layer with the platinum, causing said platinum to migrate to the refractory grain boundaries and seal said boundaries, and preventing grain boundary migration of said GaAs and gold; and sealing said layer of platinum from said gold by depositing a layer of tantalum at a substrate temperature in the range of approximately 50° C. to 90° C. if said refractory layer is tantalum, or by depositing a layer of tungsten at a substrate temperature in the range of approximately 50° C. to 90° C. if said refractory layer is tungsten, said temperature being sufficient for interdiffusing said tantalum or said tungsten into said platinum and preventing interdiffusion between the platinum and the gold, said steps providing controlled heat in the range of about 50° C. to 175° C. to the substrate for individual depositions of said layers and providing thermal stabilization of the Schottky barrier and forming the entire refractory systems within a vacuum and without annealing the refractory systems, said systems forming a barrier layer of tantalum, tungsten, and titanium tungsten alloy doped with platinum at the tantalum, tungsten, and titanium tungsten alloy grain boundaries for preventing migration of said GaAs and gold across said grain boundaries.

Claim 2

A method for constructing systems of sealed refractory layers, in a vacuum, for GaAs semiconductor devices having gold as a conducting electrode, said method requiring no annealing of said systems, comprising the steps of: forming a refractory layer of a material selected from the group consisting of tantalum, tungsten, and titanium tungsten alloy on a surface of a GaAs substrate for providing a Schottky barrier therebetween, said substrate being maintained at an elevated temperature of approximately 90° C. for said tantalum and said tungsten and approximately 110° C. for said titanium tungsten alloy, said temperatures being sufficient for desorbing interfacial oxides and surface impurities and for providing adhesion between said refractory layer and GaAs; sealing said refractory layer by depositing a layer of platinum at a substrate temperature in the range of appproximately 90° C. to 175° C. for the tantalum and the tungsten and approximately 90° C. for the titanium tungsten alloy, said temperature being sufficient for doping said refractory layer with the platinum, causing said platinum to migrate to the refractory grain boundaries and seal said boundaries, and preventing grain boundary migration of said GaAs and gold; and sealing said layer of platinum from said gold by depositing a layer of tantalum at a substrate temperature in the range of approximately 50° C. to 90° C. if said refractory layer is tantalum, or by depositing a layer of tungsten at a substrate temperature in the range of approximately 50° C. to 90° C. if said refractory layer is tungsten, said temperature being sufficient for interdiffusing said tantalum or said tungsten into said platinum and preventing interdiffusion between the platinum and the gold, said steps providing controlled heat in the range of about 50° C. to 175° C. to the substrate for individual depositions of said layers and providing thermal stabilization of the Schottky barrier and forming the entire refractory systems within a vacuum and without annealing the refractory systems, said systems forming a barrier layer of tantalum, tungsten, and titanium tungsten alloy doped with platinum at the tantalum, tungsten, and titanium tungsten alloy grain boundaries for preventing migration of said GaAs and gold across said grain boundaries.