US3857683A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board material incorporating binary alloys
Assignee: OHMEGA TECHNOLOGIES Inc A CA CORP
•
Filing: 1973-07-27
•
Granted: 1974-12-31
•
Expires: 1993-07-27
Abstract
Abstract A novel printed circuit board material in the form of a layered stock comprising an insulating support, at least one layer of electrical resistance material adhering to said support, and a layer of a highly conductive material adhering to the resistance material and in intimate contact therewith, said layer of electrical resistance material being selected from the group consisting of chromium-antimony, chromium-manganese, chromiumphosphorus, chromium-selenium, chromium-tellurium, cobaltantimony, cobalt-boron, cobalt-germanium, cobalt-indium, cobaltmolybdenum, cobalt-phosphorus, cobalt-rhenium, cobalt-ruthenium, cobalt-tungsten, cobalt-vanadium, iron-vanadium, nickel-antimony, nickel-boron, nickel-chromium, nickel-germanium, nickel-indium, nickel-molybdenum, nickel-phosphorus, nickel-rhenium, nickelvanadium and palladium-molybdenum.
Inventors
- 👤 R Castonguay
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 06:23
CPC Classifications
H; H01; H01C; H01C7/00; H01C7/006; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/00; H05K3/02; H05K3/022; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12444; Y10T428/12493; Y10T428/12535; Y10T428/12542; Y10T428/12549; Y10T428/12556; Y10T428/12569; Y10T428/12674; Y10T428/12681; Y10T428/12736; Y10T428/12743; Y10T428/1275; Y10T428/12771; Y10T428/12778
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
272 words
A NOVEL PRINTED CIRCUIT BOARD MATERIAL IN THE FORM OF A LAYERED STOCK COMPRISING A INSULATING SUPPORT, AT LEAST ONE LAYER OF ELECTRICAL RESISTANCE MATERIAL ADHERING TO SAID SUPPORT AND A LAYER OF A HIGHLY CONDUCTIVE MATERIAL ADHERING TO THE RESISTANCE MATERIAL AND IN INTIMATE CONTACT THEREWITH, SAID LAYER OF ELECTRICAL RESISTANCE MATERIAL BEING SELECTED FROM THE GROUP CONSISTING OF CHROMIUM-ANTIMONY, CHROMIUM-MANGANESE ABOUT 13 - 74% BY WEIGHT ANTIMONY, CHROMIUN-MANGANESE CONTAINING FROM ABOUT 10-80% BY WEIGHT MANGANESE, CHROMIUM-PHOSHORUS CONTAINING FROM ABOUT 6-52% BY WEIGHT PHOSPHORUS, CHROMIUM-SELENIUM CONTAINING FROM ABOUT 14-65% BY WEIGHT SELENIUM, CHROMIUN-TELLURIUM CONTAINING FROM ABOUT 21-75% BY WEIGHT TELLURIUM, COBALT-ANTIMONY CONTAINING FROM ABOUT 18-72% BY WEIGHT ANTIMONY, COBALT-BORON CONTAINING FROM ABOUT 2-36% BY WEIGHT BORON, COBALTGERMANIUM CONTAINING FROM ABOUT FROM ABOUT 6-60% GERMANIUM, COBAL INDIUM CONTAINING FROM ABOUT 18-71% BY WEIGHT INDIUM, COBALT-MOLYBENUM, CONTAINING FROM ABOUT 10-65% BY WEIGHT MOLYBDENUM, COBALT-PHOSPHORUS CONTAINING FROM ABOUT 6-25% BY WEIGHT PHOSPHORUS, COBALT-RHENIUM CONTAINING FROM ABOUT 25-95% BY WEIGHT RHEMIUN, COBALT-RUTHENIUM CONTAINING FROM ABOUT 16-94% BY WEIGHT RUTHENIUM CONTAING TUNGSTEN CONTAINING FROM ABOUT 15-72% BY WEIGHT TUNGSTEN, COBALT-VANADIUM CONTAINING FROM ABOUT 9-70% BY WEIGHT VANADIUM, IRON-VANADIUM, NICONTAINING FROM ABOUT 9-65% BY WEIGHT VANADIUM NICKEL-ANTIMONY CONTAINING FROM ABOUT 15-74% BY WEIGHT ANTIMONY, NICKEL-BORON CONTAINING FROM ABOUT 2-36% BY WEIGHT BORON, NICKEL-CHROMIUM CONTAINING FROM ABOUT 9-40% BY WEIGHT CHROMIUM, NICKEL-GERMANIUM CONTAINING FROM ABOUT 6-60% BY WEIGHT GERMANIUM, NICKELINDIUM CONTAINING FROM ABOUT 18-71% BY WEIGHT INDIUM, NICKEL-MOLYBDENUM CONTAINING FROM ABOUT 10-65% BY WEIGHT MOLYBDENUM, NICKEL-PHOSPHORUS CONTAINING FROM ABOUT 5-50% BY WEIGHT PHOPHORUS, NICKEL-RHENIUM CONTAINING FROM ABOUT 75-95% BY WEIGHT RHENIUM, NICKEL-VANADIUM CONTAINING FROM ABOUT 9-72% BY WEIGHT VANADIUM, AND PALLADIUMMOLYNDENUM CONTAINING FROM ABOUT 9-40% BY WEIGHT MOLYBDENUM.
Claim 2
Dependent Claim
272 words
A NOVEL PRINTED CIRCUIT BOARD MATERIAL IN THE FORM OF A LAYERED STOCK COMPRISING A INSULATING SUPPORT, AT LEAST ONE LAYER OF ELECTRICAL RESISTANCE MATERIAL ADHERING TO SAID SUPPORT AND A LAYER OF A HIGHLY CONDUCTIVE MATERIAL ADHERING TO THE RESISTANCE MATERIAL AND IN INTIMATE CONTACT THEREWITH, SAID LAYER OF ELECTRICAL RESISTANCE MATERIAL BEING SELECTED FROM THE GROUP CONSISTING OF CHROMIUM-ANTIMONY, CHROMIUM-MANGANESE ABOUT 13 - 74% BY WEIGHT ANTIMONY, CHROMIUN-MANGANESE CONTAINING FROM ABOUT 10-80% BY WEIGHT MANGANESE, CHROMIUM-PHOSHORUS CONTAINING FROM ABOUT 6-52% BY WEIGHT PHOSPHORUS, CHROMIUM-SELENIUM CONTAINING FROM ABOUT 14-65% BY WEIGHT SELENIUM, CHROMIUN-TELLURIUM CONTAINING FROM ABOUT 21-75% BY WEIGHT TELLURIUM, COBALT-ANTIMONY CONTAINING FROM ABOUT 18-72% BY WEIGHT ANTIMONY, COBALT-BORON CONTAINING FROM ABOUT 2-36% BY WEIGHT BORON, COBALTGERMANIUM CONTAINING FROM ABOUT FROM ABOUT 6-60% GERMANIUM, COBAL INDIUM CONTAINING FROM ABOUT 18-71% BY WEIGHT INDIUM, COBALT-MOLYBENUM, CONTAINING FROM ABOUT 10-65% BY WEIGHT MOLYBDENUM, COBALT-PHOSPHORUS CONTAINING FROM ABOUT 6-25% BY WEIGHT PHOSPHORUS, COBALT-RHENIUM CONTAINING FROM ABOUT 25-95% BY WEIGHT RHEMIUN, COBALT-RUTHENIUM CONTAINING FROM ABOUT 16-94% BY WEIGHT RUTHENIUM CONTAING TUNGSTEN CONTAINING FROM ABOUT 15-72% BY WEIGHT TUNGSTEN, COBALT-VANADIUM CONTAINING FROM ABOUT 9-70% BY WEIGHT VANADIUM, IRON-VANADIUM, NICONTAINING FROM ABOUT 9-65% BY WEIGHT VANADIUM NICKEL-ANTIMONY CONTAINING FROM ABOUT 15-74% BY WEIGHT ANTIMONY, NICKEL-BORON CONTAINING FROM ABOUT 2-36% BY WEIGHT BORON, NICKEL-CHROMIUM CONTAINING FROM ABOUT 9-40% BY WEIGHT CHROMIUM, NICKEL-GERMANIUM CONTAINING FROM ABOUT 6-60% BY WEIGHT GERMANIUM, NICKELINDIUM CONTAINING FROM ABOUT 18-71% BY WEIGHT INDIUM, NICKEL-MOLYBDENUM CONTAINING FROM ABOUT 10-65% BY WEIGHT MOLYBDENUM, NICKEL-PHOSPHORUS CONTAINING FROM ABOUT 5-50% BY WEIGHT PHOPHORUS, NICKEL-RHENIUM CONTAINING FROM ABOUT 75-95% BY WEIGHT RHENIUM, NICKEL-VANADIUM CONTAINING FROM ABOUT 9-72% BY WEIGHT VANADIUM, AND PALLADIUMMOLYNDENUM CONTAINING FROM ABOUT 9-40% BY WEIGHT MOLYBDENUM.
Claim 3
Dependent Claim
16 words
The novel printed circuit board material of claim 1 wherein the conductive layer comprises copper foil.
Claim 4
Dependent Claim
16 words
The novel printed circuit board material of claim 1 wherein the conductive layer comprises aluminum foil.
Claim 5
Dependent Claim
17 words
The novel printed circuit board material of claim 1 wherein tHe support comprises a reinforced organic resin.
Claim 6
Dependent Claim
19 words
The novel printed circuit board material of claim 1 wherein the support comprises a fiberglass fabric reinforced epoxy resin.
Claim 7
Dependent Claim
19 words
The novel printed circuit board material of claim 1 wherein the support comprises a fiberglass fabric reinforced polyimide resin.
Claim 8
Dependent Claim
28 words
The novel printed circuit board material of claim 1 wherein the support comprises a reinforced organic resin in which or to which is bonded a thermally conductive layer.
Claim 9
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is chromium-antimony containing from about 13 to 74% by weight antimony.
Claim 10
Dependent Claim
23 words
The novel printed circuit board material of claim 1 wherein the resistive material is chromium-manganese containing from about 10 -80% by weight manganese.
Claim 11
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is chromium-phosphorus containing from about 6 - 52% by weight phosphorus.
Claim 12
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is chromium-selenium containing from about 14 - 65% by weight selenium.
Claim 13
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is chromium-tellurium containing from about 21 - 75% by weight tellurium.
Claim 14
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-antimony containing from about 18 - 72% by weight antimony.
Claim 15
Dependent Claim
23 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-boron containing from about 2 -36% by weight boron.
Claim 16
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-germanium containing from about 6 - 60% by weight germanium.
Claim 17
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-indium containing from about 18 - 71% by weight indium.
Claim 18
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-molybdenum containing from about 10 - 65% by weight molybdenum.
Claim 19
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-phosphorus containing from about 6 - 52% by weight phosphorus.
Claim 20
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-rhenium containing from about 25 - 95% by weight rhenium.
Claim 21
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-ruthenium containing from about 16 - 94% by weight ruthenium.
Claim 22
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-tungsten containing from about 15 - 72% by weight tungsten.
Claim 23
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is cobalt-vanadium containing from about 9 - 70% by weight vanadium.
Claim 24
Dependent Claim
23 words
The novel printed circuit board material of claim 1 wherein the resistive material is iron-vanadium containing from about 9 -65% by weight vanadium.
Claim 25
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-antimony containing from about 15 - 74% by weight antimony.
Claim 26
Dependent Claim
23 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-boron containing from about 2 -36% by weight boron.
Claim 27
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-chromium containing from about 9 - 40% by weight chromium.
Claim 28
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-germanium containing from about 6 - 60% by weight germanium.
Claim 29
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-indium containing from about 18 - 71% by weight indium.
Claim 30
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-molybdenum containing from about 10 - 65% by weight molybdenum.
Claim 31
Dependent Claim
25 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-phosphorus containing from about 5 - 50 % by weight phosphorus.
Claim 32
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-rhenium containing from about 75 - 95% by weight rhenium.
Claim 33
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is nickel-vanadium containing from about 9 - 72% by weight vanadium.
Claim 34
Dependent Claim
24 words
The novel printed circuit board material of claim 1 wherein the resistive material is palladium-molybdenum containing from about 9 - 40% by weight molybdenum.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-30 | 1978-07-01 | 1978-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-30 | 1982-07-01 | 1982-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-30 | 1986-07-01 | 1986-12-31 | $7700.00 | Window Closed / Lapsed |