US6362637B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for testing semiconductor wafers including base with contact members and terminal contacts
Assignee: Micron Technology Inc
•
Filing: 1999-02-01
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Granted: 2002-03-26
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Expires: 2019-02-01
Abstract
Abstract A method, apparatus and system for testing semiconductor wafers are provided. The method includes providing a wafer carrier to provide an electrical path for receiving and transmitting test signals to the wafer. The wafer carrier includes a base for retaining the wafer, and an interconnect having contact members configured to establish electrical communication with contact locations on the wafer. The wafer carrier can include one or more compressible spring members configured to bias the wafer and interconnect together in the assembled carrier. The wafer carrier can be assembled, with the wafer in alignment with the interconnect, using optical alignment techniques, and an assembly tool similar to aligner bonder tools used for flip chip bonding semiconductor dice. A system for use with the carrier can include a testing apparatus configured to apply test signals through the carrier to the wafer while the wafer is subjected to temperature cycling.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 David R. Hembree
- 👤 James M. Wark
- 👤 John O. Jacobson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:31
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0491; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
105 words
An apparatus for testing a semiconductor wafer having a plurality of bumped contact locations comprising: a base configured to retain the wafer, the base comprising a first surface and an opposing second surface; a plurality of contact members on the first surface comprising metallized indentations configured to electrically engage the bumped contact locations; a plurality of terminal contacts onthe second surface in electrical communication with the contact members configured to electrically connect the contact members to a testing circuit; and an electrical connector on the base in electrical communication with the contact members and configured to electrically connect the contact members to the testing circuit.
Claim 2
Independent Claim
105 words
An apparatus for testing a semiconductor wafer having a plurality of bumped contact locations comprising: a base configured to retain the wafer, the base comprising a first surface and an opposing second surface; a plurality of contact members on the first surface comprising metallized indentations configured to electrically engage the bumped contact locations; a plurality of terminal contacts onthe second surface in electrical communication with the contact members configured to electrically connect the contact members to a testing circuit; and an electrical connector on the base in electrical communication with the contact members and configured to electrically connect the contact members to the testing circuit.
Claim 3
Dependent Claim
11 words
The apparatus of claim 1 wherein the base comprises a ceramic.
Claim 4
Dependent Claim
12 words
The apparatus of claim 1 wherein the base comprises a photosensitive ceramic.
Claim 5
Dependent Claim
24 words
The apparatus of claim 1 further comprising a plurality of conductive vias in the base electrically connecting the contact members to the terminal contacts.
Claim 6
Dependent Claim
26 words
The apparatus of claim 1 further comprising a plurality of multi level conductors on the first surface electrically connecting the contact members to the electrical connector.
Claim 7
Dependent Claim
17 words
The apparatus of claim 1 wherein the terminal contacts comprise ball contacts in a ball grid array.
Claim 8
Dependent Claim
18 words
The apparatus of claim 1 wherein the electrical connector comprises a female electrical connector on the first surface.
Claim 9
Dependent Claim
35 words
The apparatus of claim 1 further comprising a force applying mechanism for biasing the wafer against the base comprising a cover on the base and a bladder in contact with the cover and the wafer.
Claim 10
Independent Claim
115 words
An apparatus for testing a semiconductor wafer having a plurality of contact locations comprising: a base comprising a first surface for mounting the wafer and an opposing second surface; a plurality of contact members on the first surface configured to electrically engage the contact locations; a plurality of terminal contacts on the second surface comprising balls in a grid array in electrical communication with the contact members; a plurality of conductive vias in the base electrically connecting the contact members to the terminal contacts; an electrical edge connector on the base in electrical communication with the contact members; and a plurality of conductors on the base electrically connecting the contact members to the electrical connector.
Claim 11
Independent Claim
115 words
An apparatus for testing a semiconductor wafer having a plurality of contact locations comprising: a base comprising a first surface for mounting the wafer and an opposing second surface; a plurality of contact members on the first surface configured to electrically engage the contact locations; a plurality of terminal contacts on the second surface comprising balls in a grid array in electrical communication with the contact members; a plurality of conductive vias in the base electrically connecting the contact members to the terminal contacts; an electrical edge connector on the base in electrical communication with the contact members; and a plurality of conductors on the base electrically connecting the contact members to the electrical connector.
Claim 12
Dependent Claim
19 words
The apparatus of claim 9 further comprising a plurality of insulating layers on the base electrically insulating the conductors.
Claim 13
Dependent Claim
21 words
The apparatus of claim 9 wherein the contact members comprise indentations in the first surface and conductive layers on the indentations.
Claim 14
Dependent Claim
19 words
The apparatus of claim 9 wherein the contact members comprise raised members and conductive layers on the raised members.
Claim 15
Dependent Claim
12 words
The apparatus of claim 9 wherein the base comprises a photosensitive ceramic.
Claim 16
Independent Claim
132 words
A method for testing a semiconductor wafer having a plurality of contact locations comprising: providing a base having a first surface for mounting the wafer and an opposing second surface, the base comprising: a plurality of contact members on the first surface configured to electrically engage the contact locations; a plurality of terminal contacts on the second surface in electrical communication with the contact members configured to electrically connect the contact members to a testing circuit; an electrical connector on the base in electrical communication with the contact members configured to electrically connect the contact members to the testing circuit; testing the wafer by applying first test signals through the terminal contacts to the wafer; and burn-in testing the wafer by applying second test signals through the electrical connector to the wafer.
Claim 17
Independent Claim
132 words
A method for testing a semiconductor wafer having a plurality of contact locations comprising: providing a base having a first surface for mounting the wafer and an opposing second surface, the base comprising: a plurality of contact members on the first surface configured to electrically engage the contact locations; a plurality of terminal contacts on the second surface in electrical communication with the contact members configured to electrically connect the contact members to a testing circuit; an electrical connector on the base in electrical communication with the contact members configured to electrically connect the contact members to the testing circuit; testing the wafer by applying first test signals through the terminal contacts to the wafer; and burn-in testing the wafer by applying second test signals through the electrical connector to the wafer.
Claim 18
Dependent Claim
12 words
The method of claim 14 wherein the contact members comprise metallized indentations.
Claim 19
Dependent Claim
10 words
The method of claim 14 wherein the base comprises ceramic.
Claim 20
Dependent Claim
15 words
The method of claim 14 wherein the terminal contacts comprise balls in a grid array.
Claim 21
Dependent Claim
18 words
The method of claim 14 wherein the electrical connector comprises a female electrical connector on the first surface.
Claim 22
Independent Claim
121 words
A method for testing a semiconductor wafer having a plurality of bumped contact locations comprising: providing a base having a first surface for mounting the wafer and an opposing second surface, the base comprising: a plurality of contact members comprising metallized indentations on the first surface configured to electrically engage the bumped contact locations; a plurality of terminal contacts on the second surface comprising balls in a grid array in electrical communication with the contact members; and an edge connector in electrical communication with the contact members; placing the contact members and the bumped contact locations in electrical communication; applying test signals through the terminal contacts to the wafer; and applying burn-in test signals through the edge connector to the wafer.
Claim 23
Independent Claim
121 words
A method for testing a semiconductor wafer having a plurality of bumped contact locations comprising: providing a base having a first surface for mounting the wafer and an opposing second surface, the base comprising: a plurality of contact members comprising metallized indentations on the first surface configured to electrically engage the bumped contact locations; a plurality of terminal contacts on the second surface comprising balls in a grid array in electrical communication with the contact members; and an edge connector in electrical communication with the contact members; placing the contact members and the bumped contact locations in electrical communication; applying test signals through the terminal contacts to the wafer; and applying burn-in test signals through the edge connector to the wafer.
Claim 24
Dependent Claim
13 words
The method of claim 19 wherein the edge connector comprises a female connector.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-03-25 | 2005-09-24 | 2006-03-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-03-25 | 2009-09-24 | 2010-03-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-03-25 | 2013-09-24 | 2014-03-26 | $7700.00 | Window Closed / Lapsed |