US5952840A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for testing semiconductor wafers
Assignee: Micron Technology Inc
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Filing: 1996-12-31
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Granted: 1999-09-14
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Expires: 2016-12-31
Abstract
Abstract A method, apparatus and system for testing semiconductor wafers are provided. The method includes providing a wafer carrier to provide an electrical path for receiving and transmitting test signals to the wafer. The wafer carrier includes a base for retaining the wafer, and an interconnect having contact members configured to establish electrical communication with contact locations on the wafer. The wafer carrier can include one or more compressible spring members configured to bias the wafer and interconnect together in the assembled carrier. The wafer carrier can be assembled, with the wafer in alignment with the interconnect, using optical alignment techniques, and an assembly tool similar to aligner bonder tools used for flip chip bonding semiconductor dice. A system for use with the carrier can include a testing apparatus configured to apply test signals through the carrier to the wafer while the wafer is subjected to temperature cycling.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 David R. Hembree
- 👤 James M. Wark
- 👤 John O. Jacobson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:09
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0491; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
79 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attachable to the base; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer; and a force applying member for biasing the wafer against the interconnect, the force applying member comprising a first spring member between the cover and the wafer, and a second spring member between the interconnect and the base.
Claim 2
Independent Claim
79 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attachable to the base; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer; and a force applying member for biasing the wafer against the interconnect, the force applying member comprising a first spring member between the cover and the wafer, and a second spring member between the interconnect and the base.
Claim 3
Dependent Claim
14 words
The apparatus of claim 1 wherein the first spring member comprises an elastomeric material.
Claim 4
Dependent Claim
14 words
The apparatus of claim 1 wherein the second spring member comprises an elastomeric material.
Claim 5
Dependent Claim
13 words
The apparatus of claim 1 wherein the first spring member comprises a bladder.
Claim 6
Dependent Claim
13 words
The apparatus of claim 1 wherein the second spring member comprises a bladder.
Claim 7
Dependent Claim
20 words
The apparatus of claim 1 further comprising a second interconnect interchangeable with the interconnect for electrically contacting a second wafer.
Claim 8
Independent Claim
67 words
An apparatus for testing a semiconductor wafer comprising: a base; an interconnect on the base comprising a substrate and a contact member on the substrate for establishing electrical communication with a contact location on the wafer; a cover attachable to the base; a first compressible spring member placed between the cover and the wafer; and a second compressible spring member placed between the interconnect and the base.
Claim 9
Independent Claim
67 words
An apparatus for testing a semiconductor wafer comprising: a base; an interconnect on the base comprising a substrate and a contact member on the substrate for establishing electrical communication with a contact location on the wafer; a cover attachable to the base; a first compressible spring member placed between the cover and the wafer; and a second compressible spring member placed between the interconnect and the base.
Claim 10
Dependent Claim
21 words
The apparatus of claim 7 wherein the first compressible spring member and the second compressible spring member comprise an elastomeric material.
Claim 11
Dependent Claim
16 words
The apparatus of claim 7 wherein the first compressible spring member comprises a gas filled bladder.
Claim 12
Dependent Claim
16 words
The apparatus of claim 7 wherein the second compressible spring member comprises a gas filled bladder.
Claim 13
Dependent Claim
25 words
The apparatus of claim 7 wherein the contact location comprises a pad and the contact member comprises a projection configured to penetrate the contact location.
Claim 14
Dependent Claim
20 words
The apparatus of claim 7 further comprising a second interconnect interchangeable with the interconnect for electrically contacting a second wafer.
Claim 15
Independent Claim
108 words
An apparatus for testing a semiconductor wafer comprising: a base comprising a conductor and an electrical connector; a cover attachable to the base; an interconnect mounted between the base and the cover comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer; an electrical path formed between the contact member on the interconnect and the conductor on the base; a first compressible spring member placed between the cover and the wafer to press the wafer against the interconnect; and a second compressible spring member placed between the interconnect and the base to press the interconnect against the wafer.
Claim 16
Independent Claim
108 words
An apparatus for testing a semiconductor wafer comprising: a base comprising a conductor and an electrical connector; a cover attachable to the base; an interconnect mounted between the base and the cover comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer; an electrical path formed between the contact member on the interconnect and the conductor on the base; a first compressible spring member placed between the cover and the wafer to press the wafer against the interconnect; and a second compressible spring member placed between the interconnect and the base to press the interconnect against the wafer.
Claim 17
Dependent Claim
12 words
The apparatus of claim 13 wherein the base comprises a FR-4 material.
Claim 18
Dependent Claim
30 words
The apparatus of claim 13 wherein the electrical path comprises an element selected from the group consisting of TAB tapes, impedance matched TAB tapes, bond wires, and mechanical electrical connectors.
Claim 19
Dependent Claim
23 words
The apparatus of claim 13 wherein the substrate comprises silicon and the contact member comprises an etched member covered with a conductive layer.
Claim 20
Dependent Claim
22 words
The apparatus of claim 13 wherein the substrate comprises a material selected from the group consisting of silicon, ceramic and photosensitive glass.
Claim 21
Independent Claim
61 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attachable to the base; an interconnect between the base and the cover comprising a contact member configured to electrically contact a contact location on the wafer; a first elastomeric spring member between the cover and the wafer; and a second elastomeric spring member between the base and the interconnect.
Claim 22
Independent Claim
61 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attachable to the base; an interconnect between the base and the cover comprising a contact member configured to electrically contact a contact location on the wafer; a first elastomeric spring member between the cover and the wafer; and a second elastomeric spring member between the base and the interconnect.
Claim 23
Dependent Claim
25 words
The apparatus of claim 18 wherein the first elastomeric spring member comprises a material selected from the group consisting of silicone, butyl rubber, and fluorosilicone.
Claim 24
Dependent Claim
25 words
The apparatus of claim 18 wherein the second elastomeric spring member comprises a material selected from the group consisting of silicone, butyl rubber, and fluorosilicone.
Claim 25
Dependent Claim
22 words
The apparatus of claim 23 further comprising an impedance matched tape electrically connecting the contact member to a connector on the base.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-13 | 2003-03-15 | 2003-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-13 | 2007-03-15 | 2007-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-13 | 2011-03-15 | 2011-09-14 | $7700.00 | Window Closed / Lapsed |