US5896036A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Carrier for testing semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1996-06-10
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Granted: 1999-04-20
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Expires: 2016-06-10
Abstract
Abstract A carrier for testing an unpackaged semiconductor die is provided. The carrier includes: a base; a temporary interconnect for establishing electrical communication between the die and external test circuitry; a retention mechanism for securing the interconnect to the base; and a force distribution mechanism for biasing the die and interconnect together. The interconnect includes a substrate having raised contact members adapted to penetrate bond pads, or tests pads, on the die to form an electrical connection. Conductive traces are formed on the substrate in electrical communication with the raised contact members and connect to external connectors formed on the base. The interconnect is adapted for testing a particular type of die but is interchangeable with other interconnects to permit testing of different types of dice using a universal carrier.
Inventors
- 👤 Alan G. Wood
- 👤 Warren M. Farnworth
- 👤 David R. Hembree
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:56
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0441; G01R1/0466; G01R1/0483; G01R31/00; G01R31/28; G01R31/2851; G01R31/2893; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10P74/00; H10P74/23; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/67; H10W70/68; H10W90/00; H10W90/701; H10W99/00; G01R3/00; G01R31/2855; G01R31/286; G01R31/2863; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/03; H05K2203/0307; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K3/0058; H05K3/0067; H05K3/42; H05K3/423; H10W70/654; H10W70/655; H10W70/681; H10W72/00; H10W72/071; H10W72/0711; H10W72/075; H10W72/07502; H10W72/07504; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/50; H10W90/20; H10W90/24; H10W90/721; H10W90/722
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
130 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a first contact configured to electrically contact a second contact on the die, and a conductive trace in electrical communication with the first contact; a retention mechanism comprising a spring contact encased in a body removably attached to the base, said retention mechanism configured to electrically contact and retain the interconnect on the surface, said spring contact comprising a section shaped to bias a first portion of the spring contact against the conductive trace, and a second portion electrically connectable to test circuitry; and a force mechanism removably attached to the base for biasing the die against the interconnect.
Claim 2
Dependent Claim
130 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a first contact configured to electrically contact a second contact on the die, and a conductive trace in electrical communication with the first contact; a retention mechanism comprising a spring contact encased in a body removably attached to the base, said retention mechanism configured to electrically contact and retain the interconnect on the surface, said spring contact comprising a section shaped to bias a first portion of the spring contact against the conductive trace, and a second portion electrically connectable to test circuitry; and a force mechanism removably attached to the base for biasing the die against the interconnect.
Claim 3
Dependent Claim
11 words
The carrier of claim 1 wherein the body comprises molded plastic.
Claim 4
Dependent Claim
12 words
The carrier of claim 1 wherein the section has a convex shape.
Claim 5
Dependent Claim
15 words
The carrier of claim 1, wherein the retention mechanism comprises a plurality of spring contacts.
Claim 6
Dependent Claim
18 words
The carrier of claim 1 wherein the base comprises side walls for protecting the interconnect and force mechanism.
Claim 7
Dependent Claim
18 words
The carrier of claim 1 wherein the first contact comprises a projection for penetrating into the second contact.
Claim 8
Dependent Claim
135 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a first contact configured to electrically contact a second contact on the die, said interconnect further comprising a conductive trace having a third contact in electrical communication with the first contact; a retention mechanism comprising a body removably attached to the base and a spring contact embedded in the body configured to secure the interconnect to the surface, said spring contact comprising a spring section configured to bias a first portion of the spring contact against the third contact, and a second portion electrically connectable to test circuitry; and a force mechanism removably attached to the base for biasing the die against the interconnect.
Claim 9
Dependent Claim
135 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a first contact configured to electrically contact a second contact on the die, said interconnect further comprising a conductive trace having a third contact in electrical communication with the first contact; a retention mechanism comprising a body removably attached to the base and a spring contact embedded in the body configured to secure the interconnect to the surface, said spring contact comprising a spring section configured to bias a first portion of the spring contact against the third contact, and a second portion electrically connectable to test circuitry; and a force mechanism removably attached to the base for biasing the die against the interconnect.
Claim 10
Dependent Claim
15 words
The carrier of claim 7 wherein the retention mechanism comprises a plurality of spring contacts.
Claim 11
Dependent Claim
11 words
The carrier of claim 7 wherein the body comprises molded plastic.
Claim 12
Dependent Claim
13 words
The carrier of claim 7 wherein the spring section has a convex shape.
Claim 13
Dependent Claim
20 words
The carrier of claim 7 wherein the first contact comprises a conductive layer in electrical communication with the conductive trace.
Claim 14
Dependent Claim
23 words
The carrier of claim 7 wherein the first contact comprises a projection configured to penetrate the second contact to a limited penetration depth.
Claim 15
Dependent Claim
127 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a plurality of first contacts configured to electrically contact second contacts on the die, and a plurality of electrical traces and third contacts in electrical communication with the first contacts; and a retention mechanism comprising a body removably attached to the base and a plurality of spring contacts embedded in the body, said spring contacts comprising spring sections configured to bias first portions of the spring contacts against the third contacts to establish electrical connections therewith, and to secure the interconnect to the surface, said spring contacts further comprising second portions electrically connectable to test circuitry.
Claim 16
Dependent Claim
127 words
A carrier for testing a semiconductor die, comprising: a base configured to retain the die and having a surface; an interconnect placed on the surface of the base, said interconnect comprising a plurality of first contacts configured to electrically contact second contacts on the die, and a plurality of electrical traces and third contacts in electrical communication with the first contacts; and a retention mechanism comprising a body removably attached to the base and a plurality of spring contacts embedded in the body, said spring contacts comprising spring sections configured to bias first portions of the spring contacts against the third contacts to establish electrical connections therewith, and to secure the interconnect to the surface, said spring contacts further comprising second portions electrically connectable to test circuitry.
Claim 17
Dependent Claim
13 words
The carrier of claim 13 wherein the spring sections have a convex shape.
Claim 18
Dependent Claim
11 words
The carrier of claim 13 wherein the body comprises molded plastic.
Claim 19
Dependent Claim
16 words
The carrier of claim 13 wherein the body is configured to slidably attach to the base.
Claim 20
Dependent Claim
11 words
The carrier of claim 13 wherein the spring contacts comprise tines.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-19 | 2002-10-19 | 2003-04-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-19 | 2006-10-19 | 2007-04-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-19 | 2010-10-19 | 2011-04-20 | $7700.00 | Window Closed / Lapsed |