US6064216A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for testing semiconductor wafers
Assignee: Micron Technology Inc
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Filing: 1999-02-01
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Granted: 2000-05-16
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Expires: 2019-02-01
Abstract
Abstract A method, apparatus and system for testing semiconductor wafers are provided. The method includes providing a wafer carrier to provide an electrical path for receiving and transmitting test signals to the wafer. The wafer carrier includes a base for retaining the wafer, and an interconnect having contact members configured to establish electrical communication with contact locations on the wafer. The wafer carrier can include one or more compressible spring members configured to bias the wafer and interconnect together in the assembled carrier. The wafer carrier can be assembled, with the wafer in alignment with the interconnect, using optical alignment techniques, and an assembly tool similar to aligner bonder tools used for flip chip bonding semiconductor dice. A system for use with the carrier can include a testing apparatus configured to apply test signals through the carrier to the wafer while the wafer is subjected to temperature cycling.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 David R. Hembree
- 👤 James M. Wark
- 👤 John O. Jacobson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:57
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0491; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
116 words
An apparatus for testing a semiconductor wafer comprising: a base configured to retain the wafer; an electrical connector on the base configured for electrical communication with external circuitry; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a raised portion of the substrate and a conductive layer at least partially covering the raised portion; a tape on the substrate comprising a dielectric layer and a trace layer on the dielectric layer having a via therethrough proximate to the contact member; and a conductive material within the via electrically connecting the conductive layer to the trace layer.
Claim 2
Independent Claim
116 words
An apparatus for testing a semiconductor wafer comprising: a base configured to retain the wafer; an electrical connector on the base configured for electrical communication with external circuitry; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a raised portion of the substrate and a conductive layer at least partially covering the raised portion; a tape on the substrate comprising a dielectric layer and a trace layer on the dielectric layer having a via therethrough proximate to the contact member; and a conductive material within the via electrically connecting the conductive layer to the trace layer.
Claim 3
Dependent Claim
18 words
The apparatus of claim 1 wherein the contact member comprises a projection configured to penetrate the contact location.
Claim 4
Dependent Claim
21 words
The apparatus of claim 1 further comprising a ground layer on the tape for adjusting an impedance of the trace layer.
Claim 5
Dependent Claim
11 words
The apparatus of claim 1 wherein the dielectric layer comprises polyimide.
Claim 6
Dependent Claim
20 words
The apparatus of claim 1 wherein a thickness of the tape is less than a height of the contact member.
Claim 7
Independent Claim
152 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer and having a height, the contact member comprising at least one projection configured to penetrate the contact location and a conductive layer at least partially covering the projection; a tape on the substrate having a thickness, the tape comprising a dielectric layer and a trace layer on the dielectric layer having a via therethrough proximate to the contact member, with the thickness of the tape less than the height of the contact member such that the projection is exposed for penetrating the contact location; and a conductive material within the via electrically connecting the conductive layer to the trace layer.
Claim 8
Independent Claim
152 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer and having a height, the contact member comprising at least one projection configured to penetrate the contact location and a conductive layer at least partially covering the projection; a tape on the substrate having a thickness, the tape comprising a dielectric layer and a trace layer on the dielectric layer having a via therethrough proximate to the contact member, with the thickness of the tape less than the height of the contact member such that the projection is exposed for penetrating the contact location; and a conductive material within the via electrically connecting the conductive layer to the trace layer.
Claim 9
Dependent Claim
13 words
The apparatus of claim 6 wherein the conductive material comprises a conductive adhesive.
Claim 10
Dependent Claim
21 words
The apparatus of claim 6 wherein the substrate comprises silicon and the contact member comprises an etched portion of the substrate.
Claim 11
Dependent Claim
12 words
The apparatus of claim 6 wherein the contact location comprises a pad.
Claim 12
Dependent Claim
12 words
The apparatus of claim 6 wherein the contact location comprises a bump.
Claim 13
Independent Claim
100 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a portion of the substrate and a conductive layer at least partially covering the portion; and a tape on the substrate comprising a polyimide layer and a trace layer on the polyimide layer in electrical communication with the conductive layer on the contact member.
Claim 14
Independent Claim
100 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a portion of the substrate and a conductive layer at least partially covering the portion; and a tape on the substrate comprising a polyimide layer and a trace layer on the polyimide layer in electrical communication with the conductive layer on the contact member.
Claim 15
Independent Claim
24 words
The apparatus of claim further comprising a first elastomeric spring between the wafer and the cover for biasing the wafer against the interconnect together.
Claim 16
Dependent Claim
24 words
The apparatus of claim 11 further comprising a second elastomeric spring between the interconnect and the base for biasing the interconnect against the wafer.
Claim 17
Dependent Claim
21 words
The apparatus of claim 11 further comprising a ground layer on the tape for adjusting an impedance of the trace layer.
Claim 18
Dependent Claim
23 words
The apparatus of claim 11 wherein the contact member comprises a projection configured to penetrate the contact location to a limited penetration depth.
Claim 19
Independent Claim
146 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an electrical connector on the base configured for electrical communication with external circuitry; a spring member between the cover and the base configured to bias the wafer against the interconnect; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a portion of the substrate and a conductive layer at least partially covering the portion; and a tape on the substrate comprising a dielectric layer, a trace layer on the dielectric layer in electrical communication with the conductive layer and with the electrical connector, and a ground layer on the dielectric layer for adjusting an impedance of the trace layer.
Claim 20
Independent Claim
146 words
An apparatus for testing a semiconductor wafer comprising: a base; a cover attached to the base, the cover and the base configured to retain the wafer therebetween; an electrical connector on the base configured for electrical communication with external circuitry; a spring member between the cover and the base configured to bias the wafer against the interconnect; an interconnect on the base comprising a substrate and a contact member on the substrate configured to electrically contact a contact location on the wafer, the contact member comprising a portion of the substrate and a conductive layer at least partially covering the portion; and a tape on the substrate comprising a dielectric layer, a trace layer on the dielectric layer in electrical communication with the conductive layer and with the electrical connector, and a ground layer on the dielectric layer for adjusting an impedance of the trace layer.
Claim 21
Dependent Claim
17 words
The apparatus of claim 16 wherein the base comprises a first cavity wherein the interconnect is mounted.
Claim 22
Dependent Claim
20 words
The apparatus of claim 16 wherein the spring member comprises a first elastomeric pad between the cover and the wafer.
Claim 23
Dependent Claim
20 words
The apparatus of claim 16 wherein the spring member comprises a second elastomeric pad between the wafer and the base.
Claim 24
Dependent Claim
19 words
The apparatus of claim 16 wherein the portion comprises a raised portion and the contact location comprises a pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-16 | 2003-11-15 | 2004-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-16 | 2007-11-15 | 2008-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-16 | 2011-11-15 | 2012-05-16 | $7700.00 | Window Closed / Lapsed |