Patent US6255840B1 successfully refreshed from Google Patents.
US6255840B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package with wire bond protective member
Assignee: Micron Technology Inc
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Filing: 1999-05-04
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Granted: 2001-07-03
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Expires: 2019-05-04
Abstract
Abstract A package, system and method for testing semiconductor dice are provided. The package include a base for retaining the die, and an interconnect having contact members for establishing temporary electrical connections with the die. Electrical paths are formed between terminal contacts on the base, and the contact members on the interconnect, by wires that are wire bonded to conductors on the base and interconnect. The package includes a protective member for protecting the wires and associated wire bonds during assembly, disassembly and handling of the package. The protective member can be formed as a plate mounted to the base and configured to cover the wires and wire bonds. Alternately the protective member can comprise an encapsulating material such as an epoxy resin or silicone elastomer deposited on the wires and wire bonds and then cured.
Inventors
- 👤 David R. Hembree
- 👤 Salman Akram
- 👤 Derek Gochnour
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:25
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
95 words
A package for testing a semiconductor die comprising: a base configured to retain the die comprising a plurality of first conductors; an interconnect on the base configured to establish temporary electrical communication with the die comprising a plurality of second conductors; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an electrically insulating encapsulating material on the interconnect configured to encapsulate and protect at least a portion of the wires.
Claim 2
Dependent Claim
95 words
A package for testing a semiconductor die comprising: a base configured to retain the die comprising a plurality of first conductors; an interconnect on the base configured to establish temporary electrical communication with the die comprising a plurality of second conductors; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an electrically insulating encapsulating material on the interconnect configured to encapsulate and protect at least a portion of the wires.
Claim 3
Dependent Claim
13 words
The package of claim 1 wherein the encapsulating material comprises a glob top.
Claim 4
Dependent Claim
18 words
The package of claim 1 wherein the encapsulating material comprises a silicone based elastomer or an edoxy resin.
Claim 5
Dependent Claim
22 words
The package of claim 1 wherein the encapsulating material encapsulates a plurality of wire bonds on the interconnect associated with the wires.
Claim 6
Independent Claim
83 words
A system for testing a semiconductor die comprising: a package for the die comprising a base for retaining the die, an interconnect for establishing temporary electrical communication with the die, and a plurality of wires bonded to the interconnect and to the base; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an electrically insulating encapsulating material on the interconnect configured to encapsulate and protect at least a portion of the wires.
Claim 7
Independent Claim
83 words
A system for testing a semiconductor die comprising: a package for the die comprising a base for retaining the die, an interconnect for establishing temporary electrical communication with the die, and a plurality of wires bonded to the interconnect and to the base; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an electrically insulating encapsulating material on the interconnect configured to encapsulate and protect at least a portion of the wires.
Claim 8
Dependent Claim
21 words
The system of claim 5 wherein the encapsulating material comprises a material selected from the group consisting of epoxy and silicone.
Claim 9
Independent Claim
112 words
A method for testing a semiconductor die comprising: providing a temporary package for the die comprising a base and a plurality of first conductors on the base; providing an interconnect for establishing temporary electrical communication with the die comprising a plurality of second conductors; bonding wires to the first conductors and to the second conductors to provide conductive paths therebetween; depositing an encapsulating material on at least a portion of the wires; providing a cover and a force applying member on the base configured to bias the die and the interconnect together; placing the die on the interconnect with the encapsulating material protecting the wires; and applying test signals to the die.
Claim 10
Independent Claim
112 words
A method for testing a semiconductor die comprising: providing a temporary package for the die comprising a base and a plurality of first conductors on the base; providing an interconnect for establishing temporary electrical communication with the die comprising a plurality of second conductors; bonding wires to the first conductors and to the second conductors to provide conductive paths therebetween; depositing an encapsulating material on at least a portion of the wires; providing a cover and a force applying member on the base configured to bias the die and the interconnect together; placing the die on the interconnect with the encapsulating material protecting the wires; and applying test signals to the die.
Claim 11
Dependent Claim
21 words
The method of claim 7 wherein the encapsulating material comprises a material selected from the group consisting of epoxy and silicone.
Claim 12
Dependent Claim
13 words
The method of claim 7 wherein the encapsulating material comprises a cured material.
Claim 13
Dependent Claim
21 words
The method of claim 7 wherein the encapsulating material comprises a cured material applied to wire bonds associated with the wires.
Claim 14
Dependent Claim
114 words
A package for testing a semiconductor die having a plurality of contacts comprising: a base comprising a plurality of first conductors; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contacts on the die, and a plurality of second conductors in electrical communication with the contact members; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an encapsulating material on the interconnect configured to encapsulate at least a portion of the wires and to protect the wires during assembly of the package.
Claim 15
Dependent Claim
114 words
A package for testing a semiconductor die having a plurality of contacts comprising: a base comprising a plurality of first conductors; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contacts on the die, and a plurality of second conductors in electrical communication with the contact members; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an encapsulating material on the interconnect configured to encapsulate at least a portion of the wires and to protect the wires during assembly of the package.
Claim 16
Dependent Claim
13 words
The package of claim 11 wherein the encapsulating material comprises epoxy or silicone.
Claim 17
Dependent Claim
22 words
The package of claim 11 wherein the encapsulating material comprises a cured elastomer deposited on the interconnect as a plurality of ridges.
Claim 18
Dependent Claim
24 words
The package of claim 11 wherein the first conductors comprise bond pads bonded to the wires and the encapsulating material covers the bond pads.
Claim 19
Dependent Claim
115 words
A package for testing a semiconductor die having a plurality of contacts comprising: a base comprising a plurality of first conductors comprising a plurality of first bond pads; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contacts on the die, and a plurality of second conductors in electrical communication with the contact members comprising a plurality of second bond pads; a plurality of wires bonded to the first bond pads and to the second bond pads; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an encapsulating material on the interconnect configured to protect the wires.
Claim 20
Dependent Claim
115 words
A package for testing a semiconductor die having a plurality of contacts comprising: a base comprising a plurality of first conductors comprising a plurality of first bond pads; an interconnect on the base comprising a plurality of contact members configured to electrically engage the contacts on the die, and a plurality of second conductors in electrical communication with the contact members comprising a plurality of second bond pads; a plurality of wires bonded to the first bond pads and to the second bond pads; a cover and a force applying member on the base configured to bias the die and the interconnect together; and an encapsulating material on the interconnect configured to protect the wires.
Claim 21
Dependent Claim
13 words
The package of claim 15 wherein the encapsulating material comprises a glob top.
Claim 22
Dependent Claim
20 words
The package of claim 15 wherein the encapsulating material comprises ridges oriented substantially perpendicular to an orientation of the wires.
Claim 23
Dependent Claim
14 words
The package of claim 15 wherein the encapsulating material comprises silicone or epoxy ridges.
Claim 24
Dependent Claim
20 words
The package of claim 15 wherein the contact members comprise penetrating projections configured to penetrate the contacts on the die.
Claim 25
Dependent Claim
19 words
The package of claim 15 wherein the contact members comprise depressions configured to retain the contacts on the die.
Claim 26
Dependent Claim
19 words
The package of claim 15 wherein the first bond pads are at least partially covered by the encapsulating material.
Claim 27
Dependent Claim
17 words
The package of claim 15 wherein the encapsulating material covers at least a portion of the base.
Claim 28
Dependent Claim
99 words
A package for testing a semiconductor die comprising: a base comprising a plurality of first conductors; an interconnect on the base comprising a plurality of contact members configured to electrically engage contacts on the die, and a plurality of second conductors in electrical communication with the contact members; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and a plurality of cured elastomeric ridges on the interconnect configured to at least partially encapsulate the wires.
Claim 29
Dependent Claim
99 words
A package for testing a semiconductor die comprising: a base comprising a plurality of first conductors; an interconnect on the base comprising a plurality of contact members configured to electrically engage contacts on the die, and a plurality of second conductors in electrical communication with the contact members; a plurality of wires bonded to the first conductors and to the second conductors; a cover and a force applying member on the base configured to bias the die and the interconnect together; and a plurality of cured elastomeric ridges on the interconnect configured to at least partially encapsulate the wires.
Claim 30
Dependent Claim
18 words
The package of claim 23 wherein the ridges are oriented substantially perpendicular to an orientation of the wires.
Claim 31
Dependent Claim
14 words
The package of claim 23 wherein the cured elastomeric ridges comprise epoxy or silicone.
References Cited (Backward Citations)
US5539324A
Cited
US4992850A
Cited
US5006792A
Cited
US5073117A
Cited
US4969828A
Cited
JPH03146884A
Cited
US5123850A
Cited
US5088190A
Cited
US5844418A
Cited
US5519332A
Cited
US5878485A
Cited
US5367253A
Cited
US5408190A
Cited
US5896036A
Cited
US5440240A
Cited
US6094058A
Cited
US6091251A
Cited
US5815000A
Cited
US5946553A
Cited
US5495179A
Cited
US5691649A
Cited
US5302891A
Cited
US5541525A
Cited
JPH05218153A
Cited
US5289631A
Cited
US5483174A
Cited
US5424652A
Cited
US5322446A
Cited
US5517125A
Cited
US5530376A
Cited
US5543725A
Cited
US5523697A
Cited
US5483741A
Cited
US5581195A
Cited
US5468999A
Cited
US5451165A
Cited
JP3146884B2
Cited
US5929647A
Cited
US5783461A
Cited
US5834945A
Cited
US6060894A
Cited
US6072323A
Cited
US6025731A
Cited
US5962921A
Cited
USD401567S
Cited
US6025728A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-07-02 | 2005-01-01 | 2005-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-07-02 | 2009-01-01 | 2009-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-07-02 | 2013-01-01 | 2013-07-03 | $7700.00 | Window Closed / Lapsed |