US5929647A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for testing semiconductor dice
Assignee: Micron Technology Inc
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Filing: 1996-07-02
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Granted: 1999-07-27
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Expires: 2016-07-02
Abstract
Abstract A method and carrier for testing semiconductor dice such as bare dice or chip scale packages are provided. The carrier includes a base for retaining a single die, an interconnect for establishing temporary electrical communication with the die, and a force applying mechanism for biasing the die and interconnect together. In an illustrative embodiment the base includes conductors arranged in a universal pattern adapted to electrically connect to different sized interconnects. Interconnects are thus interchangeable on a base for testing different types of dice using the same base. The conductors on the base can be formed on a planar active surface of the base or on a stepped active surface having different sized cavities for mounting different sized interconnects. In an alternate embodiment the carrier includes an interposer. In a first interposer embodiment, the interposer connects directly to external test circuitry and can be changed to accommodate different sized interconnects. In a second interposer embodiment, the interposer connects to conductors on the base and adapts the base for use with different sized interconnects.
Inventors
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 David R. Hembree
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 05:44
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; G01R1/0433; G01R1/0483; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
93 words
An apparatus for testing a semiconductor die comprising: a base; an interposer on the base comprising a plurality of conductors, and a plurality of external contacts in electrical communication with the conductors and configured for electrical connection to test circuitry; an interconnect on the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; the interposer and interconnect electrically configuring the base for testing the die; the base configured for use with different interposers and interconnects for testing different types of dice.
Claim 2
Independent Claim
93 words
An apparatus for testing a semiconductor die comprising: a base; an interposer on the base comprising a plurality of conductors, and a plurality of external contacts in electrical communication with the conductors and configured for electrical connection to test circuitry; an interconnect on the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; the interposer and interconnect electrically configuring the base for testing the die; the base configured for use with different interposers and interconnects for testing different types of dice.
Claim 3
Dependent Claim
30 words
The apparatus of claim 1 further comprising a force applying mechanism attached to the base for securing the die to the base and pressing the die and the interconnect together.
Claim 4
Dependent Claim
23 words
The apparatus of claim 1 wherein the die comprises an element selected from the group consisting of chip scale packages and bare dice.
Claim 5
Independent Claim
124 words
An apparatus for testing a semiconductor die comprising: a base; an interposer mounted to the base comprising a plurality of conductors, and a plurality of external contacts in electrical communication with the conductors configured for electrical connection to test circuitry; an interconnect mounted to the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; a force applying mechanism attachable to the base for securing the die to the base and for pressing the die and the interconnect together; the interposer and interconnect electrically configuring the base and force applying mechanism for testing the die; the base configured for use with a second interposer and a second interconnect for testing a second die.
Claim 6
Independent Claim
124 words
An apparatus for testing a semiconductor die comprising: a base; an interposer mounted to the base comprising a plurality of conductors, and a plurality of external contacts in electrical communication with the conductors configured for electrical connection to test circuitry; an interconnect mounted to the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; a force applying mechanism attachable to the base for securing the die to the base and for pressing the die and the interconnect together; the interposer and interconnect electrically configuring the base and force applying mechanism for testing the die; the base configured for use with a second interposer and a second interconnect for testing a second die.
Claim 7
Dependent Claim
21 words
The apparatus of claim 4 wherein the contact members comprise penetrating projections for penetrating the contacts to a limited penetration depth.
Claim 8
Dependent Claim
20 words
The apparatus of claim 4 wherein the contact members comprise microbumps mounted on a plastic film attached to a substrate.
Claim 9
Dependent Claim
27 words
The apparatus of claim 4 wherein the interconnect comprises silicon and the base comprises a material selected from the group consisting of plastic, ceramic, and polymer resins.
Claim 10
Dependent Claim
22 words
The apparatus of claim 4 wherein the interposer comprises a material selected from the group consisting of ceramic, FR-4, silicon, and polymers.
Claim 11
Dependent Claim
28 words
The apparatus of claim 4 further comprising a seal member mounted to the interposer and surrounding the interconnect to prevent contaminants from entering an interior of the apparatus.
Claim 12
Independent Claim
111 words
An apparatus for testing semiconductor dice comprising: a base; an interposer mounted to the base comprising a plurality of external contacts configured for electrical connection to test circuitry and a plurality of conductors in electrical communication with the external contacts; an interconnect mounted to the interposer, the interconnect comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on a first type of die; the interposer and interconnect electrically configuring the base for testing the first type of die; the base configured for use with a second interposer and a second interconnect for electrically configuring the base for testing a second type of die.
Claim 13
Independent Claim
111 words
An apparatus for testing semiconductor dice comprising: a base; an interposer mounted to the base comprising a plurality of external contacts configured for electrical connection to test circuitry and a plurality of conductors in electrical communication with the external contacts; an interconnect mounted to the interposer, the interconnect comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on a first type of die; the interposer and interconnect electrically configuring the base for testing the first type of die; the base configured for use with a second interposer and a second interconnect for electrically configuring the base for testing a second type of die.
Claim 14
Dependent Claim
21 words
The apparatus of claim 10 wherein electrical communication between the contact members and conductors comprises wire bonding or tape automated bonding.
Claim 15
Dependent Claim
18 words
The apparatus of claim 10 further comprising a seal member mounted to the interposer and surrounding the interconnect.
Claim 16
Dependent Claim
24 words
The apparatus of claim 10 wherein electrical communication between the conductors on the interposer and the contact members on the interconnect comprises wire bonding.
Claim 17
Dependent Claim
25 words
The apparatus of claim 10 wherein electrical communication between the conductors on the interposer and the contact members on the interconnect comprises tape automated bonding.
Claim 18
Independent Claim
118 words
An apparatus for testing a semiconductor die comprising: a base; a force applying mechanism comprising a clamp attached to the base and a spring attached to the clamp for securing the die to the base; an interposer on the base comprising a plurality of external contacts configured for electrical connection to test circuitry and a plurality of conductors in electrical communication with the external contacts; an interconnect on the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; the interposer and interconnect electrically configuring the base for testing the die; the base configured for use with different interposers and interconnects for testing different types of dice.
Claim 19
Independent Claim
118 words
An apparatus for testing a semiconductor die comprising: a base; a force applying mechanism comprising a clamp attached to the base and a spring attached to the clamp for securing the die to the base; an interposer on the base comprising a plurality of external contacts configured for electrical connection to test circuitry and a plurality of conductors in electrical communication with the external contacts; an interconnect on the interposer comprising a plurality of contact members in electrical communication with the conductors configured to electrically engage contacts on the die; the interposer and interconnect electrically configuring the base for testing the die; the base configured for use with different interposers and interconnects for testing different types of dice.
Claim 20
Dependent Claim
16 words
The apparatus of claim 15 further comprising a seal member on the interposer surrounding the interconnect.
References Cited (Backward Citations)
US4169642A
Cited
US4891687A
Cited
US4783719A
Cited
US4899107A
Cited
US4899921A
Cited
US5006792A
Cited
US5073117A
Cited
US4969828A
Cited
US5012323A
Cited
US5272590A
Cited
US5399903A
Cited
US5088190A
Cited
US5140404A
Cited
US5107328A
Cited
US5468992A
Cited
US5155067A
Cited
US5302891A
Cited
US5367253A
Cited
US5408190A
Cited
US5440240A
Cited
US5519332A
Cited
US5495179A
Cited
US5214845A
Cited
US5422435A
Cited
US5180974A
Cited
US5424652A
Cited
US5483174A
Cited
US5283717A
Cited
US5483741A
Cited
US5497031A
Cited
US5498900A
Cited
US5468999A
Cited
US5451165A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-26 | 2003-01-25 | 2003-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-26 | 2007-01-25 | 2007-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-26 | 2011-01-25 | 2011-07-27 | $7700.00 | Window Closed / Lapsed |