Patent US5828125A successfully refreshed from Google Patents.
US5828125A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ultra-high density warp-resistant memory module
Assignee: Tamiras Per Pte Ltd LLC
•
Filing: 1996-12-02
•
Granted: 1998-10-27
•
Expires: 2016-12-02
Abstract
Abstract An ultra high-density integrated circuit module which includes a plurality of individual high-density integrated circuit packages. A plurality of the ultra high-density integrated circuit memory modules may be combined to form an ultra high-density memory bank for use in computers, or other applications requiring high-density on-board memory. The high-density integrated circuit packages which form the modules each have an internal lead frame and optional internal member which overlie an integrated circuit die. A thin, warp-resistant metal layer and an external heat conductor element are mounted to the exterior of the package. Heat is dissipated from the package while structural forces are selectively balanced.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:25
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/60; H10W90/20; H10W90/288; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
151 words
An ultra-high density memory module of the type having in-line leads, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a thin, substantially planar external thermally conductive element mounted to a major exterior surface of said package; wherein at least one of said packages includes a thin, warp resistant layer mounted to a major exterior surface of said package opposite said external thermally conductive element; wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 2
Dependent Claim
151 words
An ultra-high density memory module of the type having in-line leads, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a thin, substantially planar external thermally conductive element mounted to a major exterior surface of said package; wherein at least one of said packages includes a thin, warp resistant layer mounted to a major exterior surface of said package opposite said external thermally conductive element; wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 3
Dependent Claim
36 words
The module of claim 1, wherein at least one of said packages includes a substantially planar thermally conductive internal element within said casing which overlays and is in thermal contact with a portion of said die.
Claim 4
Dependent Claim
96 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; and a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die.
Claim 5
Dependent Claim
96 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; and a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die.
Claim 6
Dependent Claim
126 words
The ultra-high density memory module of claim 3, further comprising: a substantially planar external thermally conductive element mounted to an exterior major surface of said casing; wherein said thermally conductive internal element is attached to said die with a two-sided polyimide tape; wherein said thin, warp-resistant metal layer is attached to said casing with a thin layer of epoxy; wherein said external thermally conductive element is attached to said casing with a thin layer of epoxy; wherein a thin, warp-resistant metal layer is mounted to an exterior major surface of said casing of at least one of said packages, said metal layer being mounted opposite said external thermally conductive element; and wherein said packages are vertically oriented and mounted to one another to form said module.
References Cited (Backward Citations)
US3436604A
Cited
US3713893A
Cited
US3614546A
Cited
US3739462A
Cited
US4030080A
Cited
US4103318A
Cited
US4158745A
Cited
US4241493A
Cited
US4321418A
Cited
US4288841A
Cited
JPS5731166A
Cited
US4437235A
Cited
US4451973A
Cited
US4525921A
Cited
JPS5896756A
Cited
JPS58112348A
Cited
US4530152A
Cited
US4633573A
Cited
US4521828A
Cited
US4630172A
Cited
JPS60180150A
Cited
US4722060A
Cited
US4884237A
Cited
US4680617A
Cited
US4733461A
Cited
JPS61163652A
Cited
US4862245A
Cited
US4821148A
Cited
US5049527A
Cited
US4823234A
Cited
US4684975A
Cited
US4706166A
Cited
US4763188A
Cited
JPS6353959A
Cited
US4878106A
Cited
JPS63153849A
Cited
US4839717A
Cited
US4764846A
Cited
US4829403A
Cited
US4855868A
Cited
US4953005A
Cited
US4862249A
Cited
US4796078A
Cited
US4771366A
Cited
US5016138A
Cited
US4983533A
Cited
US4833568A
Cited
US4891789A
Cited
US4994411A
Cited
US5147822A
Cited
US5108553A
Cited
US5157478A
Cited
US4953060A
Cited
US5057906A
Cited
US5104820A
Cited
US5089876A
Cited
US4948645A
Cited
US5155068A
Cited
US5223739A
Cited
JPH03125440A
Cited
US5134463A
Cited
US5014113A
Cited
US4997517A
Cited
US5041015A
Cited
US5216283A
Cited
US5139969A
Cited
US5065277A
Cited
US5367766A
Cited
JPH04207061A
Cited
US5138434A
Cited
US5235672A
Cited
US5099393A
Cited
US5086018A
Cited
US5151559A
Cited
US5138430A
Cited
US5214845A
Cited
US5279991A
Cited
US5313097A
Cited
US5347428A
Cited
US5644161A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-26 | 2002-04-27 | 2002-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-26 | 2006-04-27 | 2006-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-26 | 2010-04-27 | 2010-10-27 | $7700.00 | Window Closed / Lapsed |