US5828125A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ultra-high density warp-resistant memory module
Assignee: Tamiras Per Pte Ltd LLC
•
Filing: 1996-12-02
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Granted: 1998-10-27
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Expires: 2016-12-02
Abstract
Abstract An ultra high-density integrated circuit module which includes a plurality of individual high-density integrated circuit packages. A plurality of the ultra high-density integrated circuit memory modules may be combined to form an ultra high-density memory bank for use in computers, or other applications requiring high-density on-board memory. The high-density integrated circuit packages which form the modules each have an internal lead frame and optional internal member which overlie an integrated circuit die. A thin, warp-resistant metal layer and an external heat conductor element are mounted to the exterior of the package. Heat is dissipated from the package while structural forces are selectively balanced.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:33
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/60; H10W90/20; H10W90/288; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
151 words
An ultra-high density memory module of the type having in-line leads, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a thin, substantially planar external thermally conductive element mounted to a major exterior surface of said package; wherein at least one of said packages includes a thin, warp resistant layer mounted to a major exterior surface of said package opposite said external thermally conductive element; wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 2
Dependent Claim
151 words
An ultra-high density memory module of the type having in-line leads, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a thin, substantially planar external thermally conductive element mounted to a major exterior surface of said package; wherein at least one of said packages includes a thin, warp resistant layer mounted to a major exterior surface of said package opposite said external thermally conductive element; wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 3
Dependent Claim
36 words
The module of claim 1, wherein at least one of said packages includes a substantially planar thermally conductive internal element within said casing which overlays and is in thermal contact with a portion of said die.
Claim 4
Dependent Claim
96 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; and a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die.
Claim 5
Dependent Claim
96 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; and a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die.
Claim 6
Dependent Claim
126 words
The ultra-high density memory module of claim 3, further comprising: a substantially planar external thermally conductive element mounted to an exterior major surface of said casing; wherein said thermally conductive internal element is attached to said die with a two-sided polyimide tape; wherein said thin, warp-resistant metal layer is attached to said casing with a thin layer of epoxy; wherein said external thermally conductive element is attached to said casing with a thin layer of epoxy; wherein a thin, warp-resistant metal layer is mounted to an exterior major surface of said casing of at least one of said packages, said metal layer being mounted opposite said external thermally conductive element; and wherein said packages are vertically oriented and mounted to one another to form said module.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-26 | 2002-04-27 | 2002-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-26 | 2006-04-27 | 2006-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-26 | 2010-04-27 | 2010-10-27 | $7700.00 | Window Closed / Lapsed |