Patent US5644161A successfully refreshed from Google Patents.
US5644161A
Expired / Lapsed
US
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Ultra-high density warp-resistant memory module
Assignee: Entorian Technologies Inc
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Filing: 1995-06-07
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Granted: 1997-07-01
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Expires: 2015-06-07
Abstract
Abstract An ultra high-density integrated circuit module which includes a plurality of individual high-density integrated circuit packages. A plurality of the ultra high-density integrated circuit memory modules may be combined to form an ultra high-density memory bank for use in computers, or other applications requiring high-density on-board memory. The high-density integrated circuit packages which form the modules each have an internal lead frame and optional internal member which overlie an integrated circuit die. A thin, warp-resistant metal layer and an external heat conductor element are mounted to the exterior of the package. Heat is dissipated from the package while structural forces are selectively balanced.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:36
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W70/60; H10W90/20; H10W90/288; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
205 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die; and a substantially planar external thermally conductive element mounted to an exterior major surface of said casing, wherein an edge portion of said thermally conductive internal element extends through a second edge of said casing opposite said first casing edge; wherein a thin, warp-resistant metal layer is mounted to an exterior major surface of said casing of at least one of said packages, said metal layer being mounted to a major surface of said casing opposite said external thermally conductive element; and wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 2
Dependent Claim
205 words
An ultra-high density memory module, comprising: a plurality of high density memory integrated circuit packages, wherein each package comprises: an integrated circuit die; a substantially planar internal lead frame mounted to at least a portion of said die, said internal lead frame having a plurality of electrical conductors electrically connected to said die; a protective casing covering said die and said internal lead frame, wherein a plurality of said conductors extend from said internal lead frame, as leads, through a first edge of said casing; a substantially planar thermally conductive internal element within said casing which is in thermal contact with at least a portion of said die; and a substantially planar external thermally conductive element mounted to an exterior major surface of said casing, wherein an edge portion of said thermally conductive internal element extends through a second edge of said casing opposite said first casing edge; wherein a thin, warp-resistant metal layer is mounted to an exterior major surface of said casing of at least one of said packages, said metal layer being mounted to a major surface of said casing opposite said external thermally conductive element; and wherein said packages are vertically oriented and mounted to one another to form said module.
Claim 3
Dependent Claim
26 words
The module of claim 1, wherein said thin, warp-resistant metal layer comprises is an iron-nickel based alloy consisting essentially of about 63% iron and 46% nickel.
Claim 4
Dependent Claim
35 words
The module of claim 1, further comprising a thin layer of reworkable adhesive mounted to a major surface of said thin, warp-resistant metal layer or to a major surface of said external thermally conductive element.
Claim 5
Dependent Claim
35 words
The module of claim 1, wherein said thermally conductive internal element is attached to said die with a two-sided polyimide film having a thin layer of high temperature epoxy on both sides of said film.
Claim 6
Dependent Claim
34 words
The module of claim 1, wherein said internal lead frame is attached to said die with a two-sided polyimide film having a thin layer of high temperature epoxy on both sides of said film.
Claim 7
Dependent Claim
22 words
The module of claim 1, wherein said thin, warp-resistant metal layer is attached to said casing with a thin layer of epoxy.
Claim 8
Dependent Claim
14 words
The module of claim 1, wherein said internal lead frame comprises nickel and iron.
Claim 9
Dependent Claim
22 words
The module of claim 1, wherein said external thermally conductive element is attached to said casing with a thin layer of epoxy.
Claim 10
Dependent Claim
13 words
The module of claim 1, wherein said external thermally conductive element comprises copper.
Claim 11
Dependent Claim
50 words
The module of claim 1, wherein said thin, warp-resistant metal layer, said thermally conductive internal element and said external thermally conductive element of each package each have an end portion which extends outward from said second edge of said casing and wherein said end portions form a thermally conductive platform.
Claim 12
Dependent Claim
28 words
The module of claim 10, further comprising a heat conduction cap which is in thermal contact with said thermally conductive platform of each said package comprising said module.
Claim 13
Dependent Claim
12 words
The module of claim 11, wherein said cap is comprised of metal.
Claim 14
Dependent Claim
21 words
The module of claim 1, wherein a plurality of said internal lead frame electrical conductors include a relief portion formed therein.
Claim 15
Dependent Claim
35 words
The module of claim 13, wherein said relief portion comprises an "S" shaped portion formed in at least one said internal lead frame conductor between said conductor distal end and said conductor die bond end.
Claim 16
Dependent Claim
22 words
The module of claim 1, further comprising a mounting header, wherein said leads of said packages are electrically connected to said header.
Claim 17
Dependent Claim
32 words
The module of claim 1, wherein said external thermally conductive element and said thin, warp-resistant metal layer of adjacent packages in said module are mounted to one another with a reworkable adhesive.
Claim 18
Dependent Claim
47 words
The module of claim 10, wherein said packages are mounted to one another such that said external thermally conductive element end portion and said thin metal layer end portion of adjacent packages in said module at least partially overlap and are in thermal contact with each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-06-30 | 2000-12-30 | 2001-07-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-06-30 | 2004-12-30 | 2005-07-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-06-30 | 2008-12-30 | 2009-07-01 | $7700.00 | Window Closed / Lapsed |