US6760224B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink with alignment and retaining features
Assignee: Micron Technology Inc
•
Filing: 2003-02-25
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Granted: 2004-07-06
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Expires: 2023-02-25
Abstract
Abstract An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
Inventors
- 👤 Walter L. Moden
- 👤 David J. Corisis
- 👤 Larry D. Kinsman
- 👤 Leonard E. Mess
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:23
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W70/00; H10W70/60; H10W90/20; H10W90/288; H10W90/291; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24298
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
300 words
A semiconductor device assembly comprising: a first substrate having a first surface, and a second surface, a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the first heat transfer device extending substantially parallel and outwardly beyond a periphery of the first substrate; at least one first connector connected to a circuit of the plurality of circuits located on the second surface of the first substrate; a second substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector extending between a circuit of the plurality of circuits on the first surface of the first substrate and the at least one circuit located on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer device; and a second heat transfer device, having at least one aperture therein, in contact with a portion of the second semiconductor device.
Claim 2
Dependent Claim
300 words
A semiconductor device assembly comprising: a first substrate having a first surface, and a second surface, a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the first heat transfer device extending substantially parallel and outwardly beyond a periphery of the first substrate; at least one first connector connected to a circuit of the plurality of circuits located on the second surface of the first substrate; a second substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector extending between a circuit of the plurality of circuits on the first surface of the first substrate and the at least one circuit located on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer device; and a second heat transfer device, having at least one aperture therein, in contact with a portion of the second semiconductor device.
Claim 3
Dependent Claim
26 words
The semiconductor device assembly of claim 1 , wherein the second heat transfer device includes a second heat transfer device having at least one slot therein.
Claim 4
Dependent Claim
26 words
The semiconductor device assembly of claim 2 , wherein the first heat transfer device includes at least one T-shaped portion and at least one L-shaped portion.
Claim 5
Dependent Claim
35 words
The semiconductor device assembly of claim 1 , further comprising: an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 6
Dependent Claim
21 words
The semiconductor device assembly of claim 4 , further comprising: at least one fin connected to another portion of the enclosure.
Claim 7
Dependent Claim
315 words
An assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, and a plurality of circuits located on at least one of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; at least one first connector extending between a circuit of the plurality on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit of the plurality on the first surface of the first substrate and a circuit of the plurality on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 8
Dependent Claim
315 words
An assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, and a plurality of circuits located on at least one of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; at least one first connector extending between a circuit of the plurality on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit of the plurality on the first surface of the first substrate and a circuit of the plurality on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 9
Dependent Claim
86 words
The assembly of claim 6 , further comprising: a second heat transfer member in contact with a first surface of the second semiconductor device, the second heat transfer member having at least one aperture therein, the at least one alignment pin of the second substrate having another portion thereof extending into the at least one aperture in the second heat transfer member; and a third heat transfer member, the third heat transfer member in contact with a portion of the second surface of the third substrate.
Claim 10
Dependent Claim
191 words
The assembly of claim 6 , further comprising: a fourth substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; a second heat transfer member having at least one aperture therein and at least one slot therein, the second heat transfer member connected to the fourth substrate, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer member; at least one third connector extending between a circuit of the plurality on the first surface of the third substrate and a circuit of the plurality on the second surface of the fourth substrate, the at least one third connector extending through the at least one slot in the second heat transfer member; and a third heat transfer member located on the at least one alignment pin of the second substrate, the third heat transfer member located between the first heat transfer member and the second heat transfer member.
Claim 11
Dependent Claim
15 words
The assembly of claim 8 , wherein the second heat transfer member includes fins thereon.
Claim 12
Dependent Claim
277 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, and a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the first heat transfer member extending substantially parallel and outwardly beyond a periphery of the first substrate; at least one first connector connected to a circuit of the plurality of circuits on the second surface of the first substrate; a second substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one second connector connected to a circuit of the plurality of circuits on the first surface of the first substrate and a circuit of the plurality on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 13
Dependent Claim
277 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, and a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the first heat transfer member extending substantially parallel and outwardly beyond a periphery of the first substrate; at least one first connector connected to a circuit of the plurality of circuits on the second surface of the first substrate; a second substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one second connector connected to a circuit of the plurality of circuits on the first surface of the first substrate and a circuit of the plurality on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 14
Dependent Claim
42 words
The semiconductor device assembly of claim 10 , further comprising: a second heat transfer member having at least one aperture therein and at least one slot therein, the second heat transfer member in contact with a portion of the second semiconductor device.
Claim 15
Dependent Claim
26 words
The semiconductor device assembly of claim 10 , wherein the first heat transfer member includes at least one of a T-shaped portion and an L-shaped portion.
Claim 16
Dependent Claim
32 words
The semiconductor device assembly of claim 10 , wherein the first heat transfer member includes at least one of a circular shaped heat transfer member and an elliptically shaped heat transfer member.
Claim 17
Dependent Claim
372 words
A semiconductor device assembly having a plurality of semiconductor devices comprising: a first substrate having a first surface, and a second surface, a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one first connector extending between a circuit of the plurality on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, and a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one second connector extending between a circuit on the second surface of the third substrate and a circuit of the plurality of circuits on the first surface of the first substrate.
Claim 18
Dependent Claim
372 words
A semiconductor device assembly having a plurality of semiconductor devices comprising: a first substrate having a first surface, and a second surface, a plurality of circuits located on each of the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one first connector extending between a circuit of the plurality on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, and a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one second connector extending between a circuit on the second surface of the third substrate and a circuit of the plurality of circuits on the first surface of the first substrate.
Claim 19
Dependent Claim
114 words
The semiconductor device assembly of claim 14 , further comprising: a fourth substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; and at least one third connector extending between a circuit of the at least one circuit on the first surface of the third substrate and a circuit of the at least one circuit on the second surface of the fourth substrate, the at least one third connector extending through the at least one slot in the second heat transfer device.
Claim 20
Dependent Claim
70 words
The semiconductor device assembly of claim 15 , further comprising: a third heat transfer device in contact with a first surface of the third semiconductor device, the third heat transfer device having at least one aperture therein and at least one slot therein, the at least one alignment pin of the second substrate having another portion thereof extending into the at least one aperture in the third heat transfer device.
Claim 21
Dependent Claim
42 words
The semiconductor device assembly of claim 15 , further comprising: a fourth heat transfer device, the fourth heat transfer device in contact with a portion of the second surface of the fourth substrate and a portion of the first heat transfer device.
Claim 22
Dependent Claim
201 words
The semiconductor device assembly of claim 16 , further comprising: a fifth substrate having a first surface, a second surface, and a plurality of circuits thereon, at least one circuit located on each of the first surface and the second surface; a fourth semiconductor device located on the first surface of the fifth substrate; another first heat transfer device having at least one aperture therein and at least one slot therein, the another first heat transfer device connected to the fourth semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the another first heat transfer device; at least one fourth connector extending between a circuit of the plurality of circuits on the first surface of the fourth substrate and a circuit of the plurality of circuits on the second surface of the fifth substrate, the at least one fourth connector extending through the at least one slot in the third heat transfer device; and a fourth heat transfer device located on the at least one alignment pin of the second substrate, the fourth heat transfer device located between the first heat transfer device and the another first heat transfer device.
Claim 23
Dependent Claim
18 words
The semiconductor device assembly of claim 18 , wherein the another first heat transfer device includes fins thereon.
References Cited (Backward Citations)
US3648113A
Cited
US3999105A
Cited
JPS5277684A
Cited
US4143456A
Cited
US4300153A
Cited
US4264917A
Cited
US4323914A
Cited
JPS55128835A
Cited
JPS564241A
Cited
US4338652A
Cited
US4507675A
Cited
US4358552A
Cited
US4642671A
Cited
US4984059A
Cited
JPS6094744A
Cited
JPS60178651A
Cited
US4603344A
Cited
US4801998A
Cited
US4862245A
Cited
JPS62109326A
Cited
JPS62115834A
Cited
JPS62261133A
Cited
US4931852A
Cited
US5184208A
Cited
US5016138A
Cited
US5057971A
Cited
US5108955A
Cited
US4961107A
Cited
JPH02306639A
Cited
US5051275A
Cited
US5311060A
Cited
US5101465A
Cited
JPH04157758A
Cited
US5304842A
Cited
US5218759A
Cited
US5144747A
Cited
US5173764A
Cited
US5291064A
Cited
US5488254A
Cited
US5194930A
Cited
US5252853A
Cited
US5241454A
Cited
US5222014A
Cited
US5652461A
Cited
US5598034A
Cited
US5489538A
Cited
US5394303A
Cited
US5461255A
Cited
US5344795A
Cited
US5305185A
Cited
US5450283A
Cited
US5440169A
Cited
US5286679A
Cited
US5396403A
Cited
US5379186A
Cited
US5641997A
Cited
US5441684A
Cited
US5489801A
Cited
US5898575A
Cited
US5552635A
Cited
US5434105A
Cited
US5656857A
Cited
US5604376A
Cited
US5436203A
Cited
US5659952A
Cited
US5861666A
Cited
US5754401A
Cited
US5866953A
Cited
US6404044B2
Cited
US6297960B1
Cited
US6525943B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-07-06 | 2008-01-05 | 2008-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-07-06 | 2012-01-05 | 2012-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-07-06 | 2016-01-05 | 2016-07-06 | $7700.00 | Window Closed / Lapsed |