Patent US2475299A successfully refreshed from Google Patents.
US6525943B2
Expired / Lapsed
US
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Heat sink with alignment and retaining features
Assignee: Micron Technology Inc
•
Filing: 2001-08-29
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Granted: 2003-02-25
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Expires: 2021-08-29
Abstract
Abstract An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
Inventors
- 👤 Walter L. Moden
- 👤 David J. Corisis
- 👤 Larry D. Kinsman
- 👤 Leonard E. Mess
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:43
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W70/00; H10W70/60; H10W90/20; H10W90/288; H10W90/291; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24298
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
317 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; at least one first connector extending between a circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer device.
Claim 2
Dependent Claim
317 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; at least one first connector extending between a circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer device.
Claim 3
Dependent Claim
64 words
The semiconductor device assembly of claim 1 , further comprising: a second heat transfer device in contact with a first surface of the second semiconductor device, the second heat transfer device having at least one aperture therein, the at least one alignment pin of the second substrate having another portion thereof extending into the at least one aperture in the second heat transfer device.
Claim 4
Dependent Claim
46 words
The semiconductor device assembly of claim 2 , further comprising: a third heat transfer device, the third heat transfer device in contact with a portion of the second surface of the third substrate and a portion of a first surface of the first heat transfer device.
Claim 5
Dependent Claim
184 words
The semiconductor device assembly of claim 1 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device connected to the fourth substrate, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; at least one third connector extending between a circuit on the first surface of the third substrate and a circuit on the second surface of the fourth substrate, the at least one third connector extending through the at least one slot in the second heat transfer device; and a third heat transfer device located on the at least one alignment pin of the second substrate, the third heat transfer device located between the first heat transfer device and the second heat transfer device.
Claim 6
Dependent Claim
17 words
The semiconductor device assembly of claim 2 , wherein the second heat transfer device includes fins thereon.
Claim 7
Dependent Claim
301 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, said first heat transfer device extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one first connector connected to a circuit of the at least one circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector extending between a circuit of the at least one circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer device; and a second heat transfer device in contact with a portion of the second semiconductor device.
Claim 8
Dependent Claim
301 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, said first heat transfer device extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one first connector connected to a circuit of the at least one circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector extending between a circuit of the at least one circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer device; and a second heat transfer device in contact with a portion of the second semiconductor device.
Claim 9
Dependent Claim
47 words
The semiconductor device assembly of claim 6 , wherein the second heat transfer device includes a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device.
Claim 10
Dependent Claim
26 words
The semiconductor device assembly of claim 6 , wherein the first heat transfer device includes at least one T-shaped portion and at least one L-shaped portion.
Claim 11
Dependent Claim
32 words
The semiconductor device assembly of claim 8 , wherein a portion of the at least one T-shaped portion of the first heat transfer device retains a portion of the first substrate therein.
Claim 12
Dependent Claim
32 words
The semiconductor device assembly of claim 9 , wherein a portion of the at least one L-shaped portion of the first heat transfer device retains another portion of the first substrate therein.
Claim 13
Dependent Claim
233 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface; a first semiconductor device located directly on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one first connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 14
Dependent Claim
233 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface; a first semiconductor device located directly on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one first connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 15
Dependent Claim
21 words
The semiconductor device assembly of claim 11 , further comprising: at least one fin connected to another portion of the enclosure.
Claim 16
Dependent Claim
318 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; and at least one first connector extending between a circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 17
Dependent Claim
318 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer member; and at least one first connector extending between a circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one second connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 18
Dependent Claim
64 words
The semiconductor device assembly of claim 13 , further comprising: a second heat transfer member in contact with a first surface of the second semiconductor device, the second heat transfer member having at least one aperture therein, the at least one alignment pin of the second substrate having another portion thereof extending into the at least one aperture in the second heat transfer member.
Claim 19
Dependent Claim
46 words
The semiconductor device assembly of claim 14 , further comprising: a third heat transfer member, the third heat transfer member in contact with a portion of the second surface of the third substrate and a portion of said first surface of the first heat transfer member.
Claim 20
Dependent Claim
184 words
The semiconductor device assembly of claim 13 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; a second heat transfer member having at least one aperture therein and at least one slot therein, the second heat transfer member connected to the fourth substrate, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer member; at least one third connector extending between a circuit on the first surface of the third substrate and a circuit on the second surface of the fourth substrate, the at least one third connector extending through the at least one slot in the second heat transfer member; and a third heat transfer member located on the at least one alignment pin of the second substrate, the third heat transfer member located between the first heat transfer member and the second heat transfer member.
Claim 21
Dependent Claim
17 words
The semiconductor device assembly of claim 14 , wherein the second heat transfer member includes fins thereon.
Claim 22
Dependent Claim
288 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, said first heat transfer member extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one first connector connected to a circuit of the at least two circuits on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one second connector is connected to a circuit of the at least two circuits on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 23
Dependent Claim
288 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on at least one of the first surface and the second surface, at least two circuits located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, said first heat transfer member extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one first connector connected to a circuit of the at least two circuits on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one second connector is connected to a circuit of the at least two circuits on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one second connector extending through the at least one slot in the first heat transfer member.
Claim 24
Dependent Claim
42 words
The semiconductor device assembly of claim 18 , further comprising: a second heat transfer member having at least one aperture therein and at least one slot therein, the second heat transfer member in contact with a portion of the second semiconductor device.
Claim 25
Dependent Claim
26 words
The semiconductor device assembly of claim 18 , wherein the first heat transfer member includes at least one T-shaped portion and at least one L-shaped portion.
Claim 26
Dependent Claim
32 words
The semiconductor device assembly of claim 20 , wherein a portion of the at least one T-shaped portion of the first heat transfer member retains a portion of the first substrate therein.
Claim 27
Dependent Claim
32 words
The semiconductor device assembly of claim 21 , wherein a portion of the at least one L-shaped portion of the first heat transfer member retains another portion of the first substrate therein.
Claim 28
Dependent Claim
23 words
The semiconductor device assembly of claim 18 , wherein the first heat transfer member includes at least one circular shaped heat transfer member.
Claim 29
Dependent Claim
23 words
The semiconductor device assembly of claim 18 , wherein the first heat transfer member includes at least one elliptical shaped heat transfer member.
Claim 30
Dependent Claim
235 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device directly contacting the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one first connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 31
Dependent Claim
235 words
A semiconductor device assembly having a plurality of substrates comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device directly contacting the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one first connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 32
Dependent Claim
21 words
The semiconductor device assembly of claim 25 , further comprising: at least one fin connected to another portion of the enclosure.
Claim 33
Dependent Claim
387 words
A semiconductor device assembly having a plurality of semiconductor devices comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one first connector extending between a circuit of the at least one circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one second connector extending between a circuit on the second surface of the third substrate and a circuit of the at least one circuit on the first surface of the first substrate.
Claim 34
Dependent Claim
387 words
A semiconductor device assembly having a plurality of semiconductor devices comprising: a first substrate having a first surface, a second surface, a plurality of circuits located on one of the first surface and the second surface, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one first connector extending between a circuit of the at least one circuit on the second surface of the first substrate and a circuit of the at least one circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one second connector extending between a circuit on the second surface of the third substrate and a circuit of the at least one circuit on the first surface of the first substrate.
Claim 35
Dependent Claim
112 words
The semiconductor device assembly of claim 27 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and on the second surface; a third semiconductor device located on the first surface of the fourth substrate; and at least one third connector extending between a circuit of the at least one circuit on the first surface of the third substrate and a circuit of the at least one circuit on the second surface of the fourth substrate, the at least one third connector extending through the at least one slot in the second heat transfer device.
Claim 36
Dependent Claim
70 words
The semiconductor device assembly of claim 28 , further comprising: a third heat transfer device in contact with a first surface of the third semiconductor device, the third heat transfer device having at least one aperture therein and at least one slot therein, the at least one alignment pin of the second substrate having another portion thereof extending into the at least one aperture in the third heat transfer device.
Claim 37
Dependent Claim
42 words
The semiconductor device assembly of claim 29 , further comprising: a fourth heat transfer device, the fourth heat transfer device in contact with a portion of the second surface of the fourth substrate and a portion of the first heat transfer device.
Claim 38
Dependent Claim
200 words
The semiconductor device assembly of claim 30 , further comprising: a fifth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a fourth semiconductor device located on the first surface of the fifth substrate; another first heat transfer device having at least one aperture therein and at least one slot therein, the another first heat transfer device connected to the fourth semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the another first heat transfer device; at least one fourth connector extending between a circuit of the at least one circuit on the first surface of the fourth substrate and a circuit of the at least one circuit on the second surface of the fifth substrate, the at least one fourth connector extending through the at least one slot in the third heat transfer device; and a fourth heat transfer device located on the at least one alignment pin of the second substrate, the fourth heat transfer device located between the first heat transfer device and the another first heat transfer device.
Claim 39
Dependent Claim
18 words
The semiconductor device assembly of claim 31 , wherein the another first heat transfer device includes fins thereon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-24 | 2006-08-26 | 2007-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-24 | 2010-08-26 | 2011-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-24 | 2014-08-26 | 2015-02-25 | $7700.00 | Window Closed / Lapsed |