US5898575A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Support assembly for mounting an integrated circuit package on a surface
Assignee: LSI Corp
•
Filing: 1996-09-19
•
Granted: 1999-04-27
•
Expires: 2016-09-19
Abstract
Abstract A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board. The arrangement enables transfer of force applied to the heat spreader directly to the circuit board, thereby isolating the die, thin substrate and its fragile free leads from forces applied to the die and/or the heat spreader.
Inventors
- 👤 Emily Hawthorne
- 👤 John McCormick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H05K3/303; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/60; H10W40/611; H10W70/00; H10W70/40; H10W70/453; H10W76/00; H10W76/40; H10W78/00; H10W90/00; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10681; H10W40/231; H10W40/233; H10W70/60; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/20; H10W90/288; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 37
Claim 1
Independent Claim
85 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface; and an aperture washer at a base of each of said spacers for securing to a top of the surface.
Claim 2
Dependent Claim
85 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface; and an aperture washer at a base of each of said spacers for securing to a top of the surface.
Claim 3
Dependent Claim
27 words
The support assembly of claim 1 wherein each said washer is made of a resilient material to provide greater resistance to sudden forces and to facilitate mounting.
Claim 4
Dependent Claim
18 words
The support assembly of claim 1 wherein each said washer is securable by adhesive to the surface top.
Claim 5
Dependent Claim
36 words
The support assembly of claim 1 wherein each said washer is coated with an adhesive for bonding to the top of the surface at the same time as the package is surface mounted to the surface.
Claim 6
Dependent Claim
34 words
The support assembly of claim 1 wherein each said washer is plated with a solder for bonding to the top of the surface at the same time as the package is surface mounted thereto.
Claim 7
Dependent Claim
80 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface; the a shoe at an end of each of said spacers for engaging the surface.
Claim 8
Dependent Claim
80 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface; the a shoe at an end of each of said spacers for engaging the surface.
Claim 9
Dependent Claim
39 words
The support assembly of claim 6 wherein each said shoe includes a base portion and a boss upstanding from said base portion, said boss having a blind aperture which receives therein a free end of a respective said spacer.
Claim 10
Dependent Claim
16 words
The support assembly of claim 6 wherein each said shoe is made of a resilient material.
Claim 11
Dependent Claim
21 words
The support assembly of claim 6 wherein each said shoe is affixed to a top of the surface with an adhesive.
Claim 12
Dependent Claim
20 words
The support assembly of claim 6 wherein each said shoe is affixed to a top of the surface with solder.
Claim 13
Dependent Claim
28 words
The support assembly of claim 6 wherein each said shoe contacts sides of a respective said spacer to resist lateral motion of said base relative to the surface.
Claim 14
Dependent Claim
20 words
The support assembly of claim 6 further comprising a heat sink mounted with epoxy to a top of said base.
Claim 15
Dependent Claim
33 words
The support assembly of claim 6 wherein each said shoe is coated with adhesive for bonding to the top of the surface at the same time as the package is surface mounted thereto.
Claim 16
Dependent Claim
33 words
The support assembly of claim 6 wherein each said shoe is plated with solder for bonding to the top of the surface at the same time as the package is surface mounted thereto.
Claim 17
Dependent Claim
90 words
A support assembly for mounting an integrated circuit package, on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said spacers and said base forming a heat spreader member; and a housing engageable with said heat spreader for protecting outer ends of the leads.
Claim 18
Dependent Claim
90 words
A support assembly for mounting an integrated circuit package, on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid spacers extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said spacers and said base forming a heat spreader member; and a housing engageable with said heat spreader for protecting outer ends of the leads.
Claim 19
Dependent Claim
22 words
The support assembly of claim 15 wherein said housing is securable to the surface at a location spaced outwardly from the package.
Claim 20
Dependent Claim
15 words
The support assembly of claim 15 wherein said housing engages into recesses in said spacers.
Claim 21
Dependent Claim
108 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a housing for protecting outer ends of the leads and including one portion engageable in at least one of said hollow recesses and another portion securable to the surface.
Claim 22
Dependent Claim
108 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a housing for protecting outer ends of the leads and including one portion engageable in at least one of said hollow recesses and another portion securable to the surface.
Claim 23
Dependent Claim
30 words
The support assembly of claim 18 further comprising a securement member for securing the package to the surface, said securement member engaging in at least one of said hollow recesses.
Claim 24
Dependent Claim
102 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; and a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof, wherein said hollow recesses are adapted to receive therein front ends of standoff pins of another said support assembly for stack storage thereof.
Claim 25
Dependent Claim
102 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; and a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof, wherein said hollow recesses are adapted to receive therein front ends of standoff pins of another said support assembly for stack storage thereof.
Claim 26
Dependent Claim
101 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a securement member for securing the package to the surface, said securement member engaging in at least one of said hollow recesses.
Claim 27
Dependent Claim
101 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a securement member for securing the package to the surface, said securement member engaging in at least one of said hollow recesses.
Claim 28
Dependent Claim
27 words
The support assembly of claim 21 wherein said securement member is formed with a leg aligned with and received in at least one of said hollow recesses.
Claim 29
Dependent Claim
30 words
The support assembly of claim 21 wherein said securement member comprises a housing having side portions and laterally outwardly projecting perimetral flanges, wherein said flanges are secured to the surface.
Claim 30
Dependent Claim
15 words
The support assembly of claim 23 wherein said housing covers outer ends of said leads.
Claim 31
Dependent Claim
90 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a tray engaging in at least one of said hollow recesses.
Claim 32
Dependent Claim
90 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said base for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a tray engaging in at least one of said hollow recesses.
Claim 33
Dependent Claim
17 words
The support assembly of claim 25 wherein said tray includes legs which engage into said hollow recesses.
Claim 34
Dependent Claim
18 words
The support assembly of claim 25 further comprising a second tray formed with recesses to receive said pins.
Claim 35
Dependent Claim
38 words
The support assembly of claim 27 wherein said tray comprises downwardly projecting wall portions positioned outwardly of the perimeter said leads, and said second tray comprises upwardly projecting wall portions which cooperate with said downwardly projecting wall portions.
Claim 36
Dependent Claim
88 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a tray engaging in at least one of said pins.
Claim 37
Dependent Claim
88 words
A support assembly for mounting an integrated circuit package on a surface, the package including an integrated circuit die and a substrate having a plurality of leads extending outwardly therefrom, said support assembly comprising: a base for supporting the package; a plurality of rigid standoff pins extending from said for abutment against the surface to provide a predetermined spacing between the substrate and the surface, said pins each having a hollow recess at a rear end thereof; and a tray engaging in at least one of said pins.
References Cited (Backward Citations)
US3628105A
Cited
US4066839A
Cited
US4215360A
Cited
US4593342A
Cited
US4658331A
Cited
US4658330A
Cited
US4855869A
Cited
US4841355A
Cited
US5072283A
Cited
US4849856A
Cited
US4953060A
Cited
US5045914A
Cited
US5162975A
Cited
US5471097A
Cited
US5257162A
Cited
US5410451A
Cited
US5673479A
Cited
US5734555A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-26 | 2002-10-26 | 2003-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-26 | 2006-10-26 | 2007-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-26 | 2010-10-26 | 2011-04-27 | $7700.00 | Window Closed / Lapsed |