US4855869A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip carrier
Assignee: NEC Corp
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Filing: 1987-09-18
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Granted: 1989-08-08
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Expires: 2007-09-18
Abstract
Abstract A chip carrier including a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect the pads. The chip carrier also includes an integrated circuit chip having a plurality of leads connected to corresponding ones of the pads. A first metal frame is included which is soldered to the upper surface of the substrate so as to surround the integrated circuit chip. The chip carrier also includes a second metal frame which is seam-welded to the upper end of the first metal frame so as to surround the integrated circuit chip and a plate is soldered to the upper end of the second metal frame so as to cover the integrated circuit chip.
Inventors
- 👤 Mutsuo Tsuji
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 06:04
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W70/65; H10W70/654; H10W70/655; H10W70/656; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/20; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
141 words
A chip carrier comprising: a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect said pads; an integrated circuit chip having a plurality of leads connected to corresponding ones of said pads on said upper surface of said substrate; a first metal frame soldered to the upper surface of said substrate so as to surround said integrated circuit chip; a second metal frame having an upper end and a lower end, said lower end of said second metal frame seam-welded to the upper end of said first metal frame so as to surround said integrated circuit chip; and a plate having a bottom surface, said plate soldered only at a portion of said bottom surface to the upper end of said second metal frame so as to cover said integrated circuit chip.
Claim 2
Dependent Claim
141 words
A chip carrier comprising: a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect said pads; an integrated circuit chip having a plurality of leads connected to corresponding ones of said pads on said upper surface of said substrate; a first metal frame soldered to the upper surface of said substrate so as to surround said integrated circuit chip; a second metal frame having an upper end and a lower end, said lower end of said second metal frame seam-welded to the upper end of said first metal frame so as to surround said integrated circuit chip; and a plate having a bottom surface, said plate soldered only at a portion of said bottom surface to the upper end of said second metal frame so as to cover said integrated circuit chip.
Claim 3
Dependent Claim
26 words
The chip carrier as set forth in claim 1, further comprising: a spacer inserted between said integrated circuit chip and the upper surface of said substrate.
Claim 4
Dependent Claim
32 words
A chip carrier as set forth in claim 1, wherein said first metal frame is made of material suitable for seam-welding, and wherein said plate is made of a thermally conductive material.
Claim 5
Dependent Claim
24 words
The chip carrier as set forth in claim 1, wherein said first metal frame is made from a material including iron, nickel and cobalt.
Claim 6
Dependent Claim
26 words
The chip carrier as set forth in claim 1, wherein said plate is made of a material including at least one of copper, tungsten and BeO.
Claim 7
Dependent Claim
30 words
The chip carrier as set forth in claim 1, wherein said upper end of said second metal frame is soldered to peripheral portions of said bottom surface of said plate.
Claim 8
Dependent Claim
51 words
The chip carrier as set forth in claim 1, wherein said first metal frame is soldered to the upper surface of said substrate with silver solder, and wherein said upper end of said second metal frame is soldered to peripheral portions of said bottom surface of said plate with silver solder.
Claim 9
Dependent Claim
47 words
The chip carrier as set forth in claim 1, wherein said plate is adhesively secured to said integrated circuit chip by an adhesive that is thermally conductive, and wherein said plurality of leads of said integrated circuit chip are connected to said corresponding pads by thermocompression bonding.
Claim 10
Dependent Claim
27 words
The chip carrier as set forth in claim 8, wherein said plate is adhesively secured to said integrated circuit chip by an adhesive of the epoxy group.
Claim 11
Dependent Claim
33 words
The chip carrier as set forth in claim 9, wherein said first metal frame is made of a material suitable for seam-welding, and wherein said plate is made of a thermally conductive material.
Claim 12
Dependent Claim
19 words
The chip carrier as set forth in claim 10, wherein said adhesive of the epoxy group includes silver powder.
Claim 13
Dependent Claim
18 words
The chip carrier as set forth in claim 2, wherein said spacer is made of a silicone rubber.
Claim 14
Dependent Claim
38 words
The chip carrier as set forth in claim 12, wherein said spacer is adhesively secured to said upper surface of said substrate, and wherein said integrated circuit chip is adhesively secured to the upper surface of said spacer.
Claim 15
Dependent Claim
44 words
The chip carrier as set forth in claim 13, wherein said spacer is adhesively secured to said upper surface of said substrate and the upper surface of said spacer is adhesively secured to said integrated circuit chip by an adhesive of the silicone group.
Claim 16
Dependent Claim
104 words
The chip carrier as set forth in claim 2, wherein said first metal frame is made of material suitable for seam-welding, wherein said plate is made of a thermally conductive material, wherein said plate is adhesively secured to said integrated circuit chip by an adhesive that is thermally conductive, wherein said plurality of leads of said integrated circuit chip are connected to corresponding said pads on said upper surface of said substrate by thermocompression bonding, and wherein said spacer is adhesively secured to the upper surface of said substrate and said integrated circuit chip is adhesively secured to the upper surface of said spacer.
Claim 17
Dependent Claim
51 words
The chip carrier as set forth in claim 2, wherein said first metal frame is soldered to the upper surface of said substrate with silver solder, and wherein said upper end of said second metal frame is soldered to peripheral portions of said bottom surface of said plate with silver solder.
Claim 18
Independent Claim
159 words
A method of forming a chip carrier comprising the steps of: providing a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect said pads; providing an integrated circuit chip having a plurality of leads; connecting said plurality of leads of said integrated circuit chip to corresponding ones of said pads on said upper surface of said substrate; surrounding said integrated circuit chip with a first metal frame soldered to said upper surface of said substrate; surrounding said integrated circuit chip with a second metal frame, said second metal frame having an upper end and a lower end, said lower end of said second metal frame seam-welded to the upper end of said first metal frame; and covering said integrated circuit chip with a plate, said plate having a bottom surface, said plate soldered only at a portion of said bottom surface to the upper end of said second metal frame.
Claim 19
Independent Claim
159 words
A method of forming a chip carrier comprising the steps of: providing a substrate having a plurality of pads formed on the upper and lower surfaces thereof and wirings to connect said pads; providing an integrated circuit chip having a plurality of leads; connecting said plurality of leads of said integrated circuit chip to corresponding ones of said pads on said upper surface of said substrate; surrounding said integrated circuit chip with a first metal frame soldered to said upper surface of said substrate; surrounding said integrated circuit chip with a second metal frame, said second metal frame having an upper end and a lower end, said lower end of said second metal frame seam-welded to the upper end of said first metal frame; and covering said integrated circuit chip with a plate, said plate having a bottom surface, said plate soldered only at a portion of said bottom surface to the upper end of said second metal frame.
Claim 20
Dependent Claim
33 words
The method of forming a chip carrier as set forth in claim 17, further comprising the step of: inserting a spacer between said integrated circuit chip and said upper surface of said substrate.
Claim 21
Dependent Claim
85 words
The method of forming a chip carrier as set forth in claim 18, further comprising the steps of: adhesively securing said plate to said integrated circuit chip by an adhesive that is thermally conductive; adhesively securing said spacer to said upper surface of said substrate; adhesively securing said integrated circuit chip to the upper surface of said spacer; and wherein said plurality of leads of said integrated circuit chip are connected to corresponding said pads on said upper surface of said substrate by thermocompression bonding.
Claim 22
Dependent Claim
102 words
The method of forming a chip carrier as set forth in claim 19, wherein said spacer is adhesively secured to said upper surface of said substrate and is adhesively secured to said integrated circuit chip by an adhesive of the silicone group, wherein said first metal frame is soldered to the upper surface of said substrate with silver solder, wherein said upper end of said second metal frame is soldered to peripheral portions of said bottom surface of said plate with silver solder, and wherein said plate is adhesively secured to said integrated cicuit chip by an adhesive of the epoxy group.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-08-07 | 1993-02-06 | 1993-08-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-08-07 | 1997-02-06 | 1997-08-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-08-07 | 2001-02-06 | 2001-08-08 | $7700.00 | Window Closed / Lapsed |