Cooling equipment for an integrated circuit chip

Claim 1

Cooling apparatus for heat generating electronic components mounted on a substrate, said apparatus comprising: a hat assembly adapted to be fixed to said substrate, said hat assembly having therein a plurality of cavities adapted to slidably receive pistons therein, each of said cavities located opposite one of each of said electronic components; pistons adapted to be slidably received in said cavities of said hat assembly and which when placed in said cavities have one surface which is generally parallel to the surface of said components; means for adjusting the distance between said surfaces of the pistons and the components to a desired distance for heat transfer between the pistons and the components; each piston having a longitudinal slot through the center thereof, a threaded hole at the center of said piston and a screw adapted to be driven into said hole such that the slit is expanded to cause frictional engagement at the outer surface of the piston with the walls of the cavity in which the piston is placed, thereby fixing the piston in a desired position in said cavity corresponding to said desired distance; and cooling means attached to said hat assembly for removing heat therefrom.