US3777220A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit panel and method of construction
Assignee: International Business Machines Corp
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Filing: 1972-06-30
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Granted: 1973-12-04
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Expires: 1992-06-30
Abstract
Abstract A hybrid circuit panel formed of both organic and inorganic materials to provide discrete areas of panel surface having different coefficients of expansion thereby providing mounting sites for semiconductor devices which have a coefficient of expansion approximating the semiconductor device. A construction method is disclosed in which previously formed inorganic substrates are placed in openings of semi-cured organic polymeric material containing inorganic fibers. The composite is compressed under heat and pressure to cause limited flow of the organic material and subsequent curing to thereby grip the inserted inorganic substrates. The organic substrate can be formed of a single layer of curable resin or a plurality of sheets of semicured resin laid up to form a composite panel. Conventional printed circuit techniques of either the subtractive or additive processes are used to form conductors on the surface of the inorganic and organic materials alike to thereby allow direct attachment of the semiconductor devices. This arrangement eliminates one level of packaging frequently used in the past, and provides a stable attachment between the devices and their substrates.
Inventors
- 👤 P Tatusko
- 👤 R Williams
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 02:20
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H01; H01B; H01B3/00; H01B3/002; H01B3/006; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/69; H10W70/695; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
61 words
A support for electrical conductors and components comprising: a first electrically insulative substrate member having a first coefficient of expansion; a second electrically insulative substrate member embedded in said first substrate member and having a smaller coefficient of expansion; and at least one electrical conductor secured along its length to at least one of said members and overlying both said members.
Claim 2
Dependent Claim
61 words
A support for electrical conductors and components comprising: a first electrically insulative substrate member having a first coefficient of expansion; a second electrically insulative substrate member embedded in said first substrate member and having a smaller coefficient of expansion; and at least one electrical conductor secured along its length to at least one of said members and overlying both said members.
Claim 3
Dependent Claim
43 words
A support for electrical conductors and components comprising: a first substrate containing an organic insulative material; and a second substrate of solely inorganic, insulative material embedded in said first substrate and being of a size to support at least one of said components.
Claim 4
Dependent Claim
43 words
A support for electrical conductors and components comprising: a first substrate containing an organic insulative material; and a second substrate of solely inorganic, insulative material embedded in said first substrate and being of a size to support at least one of said components.
Claim 5
Dependent Claim
66 words
A planar support for electrical conductors and components comprising: a first support containing organic and inorganic materials to provide an electrically insulative substrate having a first composite coefficient of expansion; and at least one second support embedded in said first support, and second support being comprised of an inorganic, insulative material and having a second coefficient of expansion less than said first composite coefficient of expansion.
Claim 6
Dependent Claim
66 words
A planar support for electrical conductors and components comprising: a first support containing organic and inorganic materials to provide an electrically insulative substrate having a first composite coefficient of expansion; and at least one second support embedded in said first support, and second support being comprised of an inorganic, insulative material and having a second coefficient of expansion less than said first composite coefficient of expansion.
Claim 7
Dependent Claim
18 words
A support member as described in claim 3 further including an electrical component mounted on said second support.
Claim 8
Dependent Claim
103 words
A support structure for electrical conductors and components comprising: the first substrate of an electrically insulative organic material having at least one planar support surface and having a predetermined coefficient of expansion; a second substrate solely of electrical insulative inorganic material embedded in said first substrate with a major support surface exposed and having a coefficient of expansion less than said first substrate; at least one electrical conductor overlying both said first and second substrates and attached thereto; and a semiconductive circuit component attached to said conductor over said second substrate and having a coefficient of expansion approximating that of said second substrate.
Claim 9
Dependent Claim
103 words
A support structure for electrical conductors and components comprising: the first substrate of an electrically insulative organic material having at least one planar support surface and having a predetermined coefficient of expansion; a second substrate solely of electrical insulative inorganic material embedded in said first substrate with a major support surface exposed and having a coefficient of expansion less than said first substrate; at least one electrical conductor overlying both said first and second substrates and attached thereto; and a semiconductive circuit component attached to said conductor over said second substrate and having a coefficient of expansion approximating that of said second substrate.
Claim 10
Dependent Claim
44 words
A support structure as described in claim 2 wherein said second substrate has two opposed major support surfaces and a peripheral interconnecting surface and said first substrate material contacts sAid second substrate material along said peripheral surface leaving said two opposed major surfaces exposed.
Claim 11
Dependent Claim
25 words
A support structure as descriged in claim 6 wherein one of said major support surfaces of said second substrate is connected to a heat sink.
Claim 12
Dependent Claim
109 words
A support structure for electrical circuits and semiconductor components comprising: a first substrate of electrically insulative organic material having a planar support surface; a second substrate of electrically insulative inorganic material embedded in said first substrate and having at least one exposed planar support surface; a plurality of electrical conductors each overlying both said substrates and the junction therebetween and secured along its entire length to one or the other of said surfaces; and at least one electrical semiconductor component attached to said conductors overlying said second substrate, said attachment being made with a fusable metal having a melting point lower than said component and said second substrate material.
Claim 13
Dependent Claim
109 words
A support structure for electrical circuits and semiconductor components comprising: a first substrate of electrically insulative organic material having a planar support surface; a second substrate of electrically insulative inorganic material embedded in said first substrate and having at least one exposed planar support surface; a plurality of electrical conductors each overlying both said substrates and the junction therebetween and secured along its entire length to one or the other of said surfaces; and at least one electrical semiconductor component attached to said conductors overlying said second substrate, said attachment being made with a fusable metal having a melting point lower than said component and said second substrate material.
Claim 14
Dependent Claim
20 words
A support structure as described in claim 8 wherein said support surfaces of said first and second substrates are co-planar.
Claim 15
Dependent Claim
37 words
A support structure as described in claim 8 wherein each said substrate includes a pair of parallel support surfaces and each support surface on one substrate is substantially co-planar with a support surface on the other substrate.
Claim 16
Dependent Claim
76 words
A support structure as described in claim 8 further including: a plurality of second substrates embedded in said first substrate, with each of said second substrates having a planar support surface; a plurality of electrical conductors, each commonly attached to support surface of said first substrate and a planar support surface of said second substrates; and at least one said semiconductor component mounted overlying each of said plurality of second substrates on the said conductors thereon.
Claim 17
Dependent Claim
27 words
Structure as described in claim 8 wherein said first substrate is comprised of a thermosetting resin and glass fibers and said second substrate is a ceramic composition.
Claim 18
Dependent Claim
16 words
A structure as described in claim 8 wherein said first substrate material is a thermoplastic resin.
Claim 19
Dependent Claim
69 words
A support structure for electrical circuits and components comprising: a first substrate of electrically insulative organic material having a planar support surface; a second substrate of electrically insulative, inorganic material buried within said first substrate; at least one electrical conductor secured to said first substrate material and passing across at least a portion of said second substrate; and an electrical component attached to said conductor overlying said second substrate.
Claim 20
Dependent Claim
69 words
A support structure for electrical circuits and components comprising: a first substrate of electrically insulative organic material having a planar support surface; a second substrate of electrically insulative, inorganic material buried within said first substrate; at least one electrical conductor secured to said first substrate material and passing across at least a portion of said second substrate; and an electrical component attached to said conductor overlying said second substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-03 | 1977-06-04 | 1977-12-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-03 | 1981-06-04 | 1981-12-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-03 | 1985-06-04 | 1985-12-04 | $7700.00 | Window Closed / Lapsed |