US3579056A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor circuit having active devices embedded in flexible sheet
Assignee: US Philips Corp
•
Filing: 1968-10-10
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Granted: 1971-05-18
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Expires: 1988-10-10
Abstract
Abstract A semiconductor device is described comprising a flexible sheet assembly of separate semiconductor components embedded in an electrically insulating flexible sheet. The contact surfaces of the semiconductor components are exposed. Interconnections may be made between the components by providing metal strips on one or both outer surfaces of the flexible sheet assembly, the connections lying on the outer surface of the intervening sheet material.
Inventors
- 👤 Ties Siebolt Tevelde
- 👤 Albert Schmitz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:59
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; H05; H05B; H05B33/00; H10P; H10P95/00; H10W70/00; H10W70/099; H10W70/60; H10W70/611; H10W70/614; H10W74/00; H10W74/10; H10W74/131; H10W90/00; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W72/90; H10W72/941; H10W72/9413; H10W72/944; H10W74/01; H10W74/019; H10W90/10
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
68 words
A device as set forth in claim 1 wherein the surface opposite to said one surface of part of the components also has exposed contacts which are free from the binder, and the interconnections include metal strips on the opposite outer surface of the sheet assembly which extend to and between exposed contacts of separate components and on and over the outer surface of the intervening binder material.
Claim 2
Dependent Claim
38 words
A device as set forth in claim 1 wherein the components are arranged in plural layers in the plane of the sheet, interconnections on one layer of components being in contact with interconnections on another layer of components.
Claim 3
Dependent Claim
25 words
A device as set forth in claim 1 wherein at least one component is a semiconductor body containing at least one planar semiconductor circuit element.
Claim 4
Dependent Claim
17 words
A device as set forth in claim 4 wherein said one component comprises a planer integrated circuit.
Claim 5
Dependent Claim
23 words
A device as set forth in claim 4 wherein said one component has a surface coinciding substantially with the surface of the binder.
Claim 6
Dependent Claim
13 words
A device as set forth in claim 1 wherein the binder is polyurethane.
Claim 7
Dependent Claim
18 words
A device as set forth in claim 1 wherein at least one of the components contains semiconductive grains.
References Cited (Backward Citations)
US3040416A
Cited
US3121177A
Cited
US3466741A
Cited
US3411050A
Cited
US3402331A
Cited
US3483038A
Cited
US3433677A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-05-17 | 1974-11-16 | 1975-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-05-17 | 1978-11-16 | 1979-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-05-17 | 1982-11-16 | 1983-05-18 | $7700.00 | Window Closed / Lapsed |