US6297960B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink with alignment and retaining features
Assignee: Micron Technology Inc
•
Filing: 1999-06-30
•
Granted: 2001-10-02
•
Expires: 2019-06-30
Abstract
Abstract An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
Inventors
- 👤 Walter L. Moden
- 👤 David J. Corisis
- 👤 Larry D. Kinsman
- 👤 Leonard E. Mess
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:10
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W90/00; H10W70/00; H10W70/60; H10W90/20; H10W90/288; H10W90/291; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24298
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
201 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; and at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
Claim 2
Dependent Claim
201 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; and at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
Claim 3
Dependent Claim
92 words
The assembly of claim 1 , further comprising: a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the connector extending through the at least one slot in the first heat transfer device.
Claim 4
Dependent Claim
62 words
The assembly of claim 2 , further comprising: a second heat transfer device in contact with the first surface of the second semiconductor device, the second heat transfer device having at least one aperture therein, the at least one alignment pin of the second substrate having a portion thereof extending into the at least one aperture in the second heat transfer device.
Claim 5
Dependent Claim
44 words
The assembly of claim 2 , further comprising: a third heat transfer device, the third heat transfer device in contact with a portion of the second surface of the third substrate and a portion of the first surface of the first heat transfer device.
Claim 6
Dependent Claim
180 words
The assembly of claim 2 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; another first heat transfer device having at least one aperture therein and at least one slot therein, the another first heat transfer device connected to the fourth substrate, the at least one alignment pin of the second substrate extending through the at least one aperture in the another first heat transfer device; at least one connector extending between a circuit on the first surface of the third substrate and a circuit on the second surface of the fourth substrate, the connector extending through the at least one slot in the another first heat transfer device; and a fourth heat transfer device located on the at least one alignment pin of the second substrate, the fourth heat transfer device located between the first heat transfer device and the another heat transfer device.
Claim 7
Dependent Claim
15 words
The assembly of claim 3 , wherein the second heat transfer device includes fins thereon.
Claim 8
Dependent Claim
257 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, said first heat transfer device extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one first connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector extending through the at least one slot in the first heat transfer device.
Claim 9
Dependent Claim
257 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, said first heat transfer device extending substantially parallel and outwardly beyond a periphery of said first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; and at least one first connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector extending through the at least one slot in the first heat transfer device.
Claim 10
Dependent Claim
40 words
The assembly of claim 7 , further comprising: a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device.
Claim 11
Dependent Claim
24 words
The assembly of claim 7 , wherein the first heat transfer device includes at least one T-shaped portion and at least one L-shaped portion.
Claim 12
Dependent Claim
30 words
The assembly of claim 9 , wherein a portion of the at least one T-shaped portion of the first heat transfer device retains a portion of the first substrate therein.
Claim 13
Dependent Claim
30 words
The assembly of claim 10 , wherein a portion of the at least one L-shaped portion of the first heat transfer device retains a portion of the first substrate therein.
Claim 14
Dependent Claim
233 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located directly on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one first connector connected to a circuit on the second surface of the first substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 15
Dependent Claim
233 words
An assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located directly on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one first connector connected to a circuit on the second surface of the first substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure containing the first substrate and the second substrate therein, the enclosure having a portion thereof sealingly engaging a portion of the first substrate.
Claim 16
Dependent Claim
19 words
The assembly of claim 12 , further comprising: at least one fin connected to a portion of the enclosure.
Claim 17
Dependent Claim
206 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate configured to extend through the at least one aperture in the first heat transfer member; and at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
Claim 18
Dependent Claim
206 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate configured to extend through the at least one aperture in the first heat transfer member; and at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate.
Claim 19
Dependent Claim
97 words
The semiconductor device assembly of claim 14 , further comprising: a third substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the third substrate; and at least one connector extending between a circuit on the first surface of the first substrate and a circuit on the second surface of the third substrate, the at least one connector extending through the at least one slot in the first heat transfer member.
Claim 20
Dependent Claim
64 words
The semiconductor device assembly of claim 15 , further comprising: a second heat transfer member in contact with the first surface of the second semiconductor member, the second heat transfer device having at least one aperture therein, the at least one alignment pin of the second substrate having a portion thereof extending into the at least one aperture in the second heat transfer member.
Claim 21
Dependent Claim
46 words
The semiconductor device assembly of claim 15 , further comprising: a third heat transfer member, the third heat transfer member in contact with a portion of the second surface of the third substrate and a portion of the first surface of the first heat transfer member.
Claim 22
Dependent Claim
185 words
The semiconductor device assembly of claim 15 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; another first heat transfer member having at least one aperture therein and at least one slot therein, the another first heat transfer member connected to the fourth substrate, the at least one alignment pin of the second substrate extending through the at least one aperture in the another first heat transfer member; at least one connector extending between a circuit on the first surface of the third substrate and a circuit on the second surface of the fourth substrate, the at least one connector extending through the at least one slot in the another first heat transfer member; and a fourth heat transfer member located on the at least one alignment pin of the second substrate, the fourth heat transfer member located between the first heat transfer member and the another heat transfer member.
Claim 23
Dependent Claim
17 words
The semiconductor device assembly of claim 16 , wherein the second heat transfer member includes fins thereon.
Claim 24
Dependent Claim
263 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, said first heat transfer member configured to extend substantially parallel and outwardly beyond a periphery of said first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the second substrate; and at least one first connector is connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector configured to extend through the at least one slot in the first heat transfer member.
Claim 25
Dependent Claim
263 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the first substrate; a first heat transfer member having at least one aperture therein and at least one slot therein, the first heat transfer member in contact with a portion of the first semiconductor device, said first heat transfer member configured to extend substantially parallel and outwardly beyond a periphery of said first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the semiconductor device connected to the first surface of the second substrate; and at least one first connector is connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate, the at least one connector configured to extend through the at least one slot in the first heat transfer member.
Claim 26
Dependent Claim
42 words
The semiconductor device assembly of claim 20 , further comprising: a second heat transfer member having at least one aperture therein and at least one slot therein, the second heat transfer member in contact with a portion of the second semiconductor device.
Claim 27
Dependent Claim
26 words
The semiconductor device assembly of claim 20 , wherein the first heat transfer member includes at least one T-shaped portion and at least one L-shaped portion.
Claim 28
Dependent Claim
32 words
The semiconductor device assembly of claim 22 , wherein a portion of the at least one T-shaped portion of the first heat transfer member retains a portion of the first substrate therein.
Claim 29
Dependent Claim
32 words
The semiconductor device assembly of claim 23 , wherein a portion of the at least one L-shaped portion of the first heat transfer member retains a portion of the first substrate therein.
Claim 30
Dependent Claim
23 words
The semiconductor device assembly of claim 20 , wherein the first heat transfer member includes at least one circular shaped heat transfer member.
Claim 31
Dependent Claim
23 words
The semiconductor device assembly of claim 20 , wherein the first heat transfer member includes at least one elliptical shaped heat transfer member.
Claim 32
Dependent Claim
239 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device directly contacting the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one first connector connected to a circuit on the second surface of the first substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure configured to contain the first substrate and the second substrate therein, the enclosure having a portion thereof configured to sealingly engage a portion of the first substrate.
Claim 33
Dependent Claim
239 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device directly contacting the first surface of the first substrate, the semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; at least one connector connected to a circuit on the second surface of the first substrate; a second substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; at least one first connector connected to a circuit on the second surface of the first substrate; at least one second connector connected to a circuit on the first surface of the first substrate and a circuit on the second surface of the second substrate; and an enclosure configured to contain the first substrate and the second substrate therein, the enclosure having a portion thereof configured to sealingly engage a portion of the first substrate.
Claim 34
Dependent Claim
21 words
The semiconductor device assembly of claim 27 , further comprising: at least one fin connected to a portion of the enclosure.
Claim 35
Dependent Claim
351 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one connector extending between a circuit on the second surface of the third substrate and a circuit on the first surface of the first substrate.
Claim 36
Dependent Claim
351 words
A semiconductor device assembly comprising: a first substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a first semiconductor device located on the first surface of the first substrate, the first semiconductor device having a first surface, a second surface, and a periphery, the second surface of the first semiconductor device connected to the first surface of the first substrate; a second substrate having a first surface, a second surface, at least one circuit located on the first surface thereof, at least one aperture therein, and at least one alignment pin having a portion thereof secured in a portion of the at least one aperture; a first heat transfer device having at least one aperture therein and at least one slot therein, the first heat transfer device in contact with a portion of the first semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the first heat transfer device; at least one connector extending between a circuit on the second surface of the first substrate and a circuit on the first surface of the second substrate; a second semiconductor device located on the first surface of the second substrate, the second semiconductor device having a first surface, a second surface, and a periphery, the second surface of the second semiconductor device connected to the first surface of the second substrate; a third substrate having a first surface, a second surface, at least one circuit located on the first surface thereof; a second heat transfer device having at least one aperture therein and at least one slot therein, the second heat transfer device in contact with a portion of the second semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the second heat transfer device; and at least one connector extending between a circuit on the second surface of the third substrate and a circuit on the first surface of the first substrate.
Claim 37
Dependent Claim
97 words
The semiconductor device assembly of claim 29 , further comprising: a fourth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a third semiconductor device located on the first surface of the fourth substrate; and at least one connector extending between a circuit on the first surface of the third substrate and a circuit on the second surface of the fourth substrate, the at least one connector extending through the at least one slot in the second heat transfer device.
Claim 38
Dependent Claim
64 words
The semiconductor device assembly of claim 30 , further comprising: a third heat transfer device in contact with the first surface of the third semiconductor device, the third heat transfer device having at least one aperture therein, the at least one alignment pin of the second substrate having a portion thereof extending into the at least one aperture in the third heat transfer device.
Claim 39
Dependent Claim
42 words
The semiconductor device assembly of claim 31 , further comprising: a fourth heat transfer device, the fourth heat transfer device in contact with a portion of the second surface of the fourth substrate and a portion of the first heat transfer device.
Claim 40
Dependent Claim
186 words
The semiconductor device assembly of claim 31 , further comprising: a fifth substrate having a first surface, a second surface, a plurality of circuits thereon, at least one circuit located on the first surface and the second surface; a fourth semiconductor device located on the first surface of the fifth substrate; another first heat transfer device having at least one aperture therein and at least one slot therein, the another first heat transfer device connected to the fourth semiconductor device, the at least one alignment pin of the second substrate extending through the at least one aperture in the another first heat transfer device; at least one connector extending between a circuit on the first surface of the fourth substrate and a circuit on the second surface of the fifth substrate, the at least one connector extending through the at least one slot in the third heat transfer device; and a fourth heat transfer device located on the at least one alignment pin of the second substrate, the fourth heat transfer device located between the first heat transfer device and the another first heat transfer device.
Claim 41
Dependent Claim
18 words
The semiconductor device assembly of claim 33 , wherein the another first heat transfer device includes fins thereon.
References Cited (Backward Citations)
US3648113A
Cited
US3999105A
Cited
JPS5277684A
Cited
US4143456A
Cited
US4300153A
Cited
US4264917A
Cited
US4323914A
Cited
JPS55128835A
Cited
JPS564241A
Cited
US4338652A
Cited
US4507675A
Cited
US4358552A
Cited
US4642671A
Cited
US4984059A
Cited
JPS6094744A
Cited
JPS60178651A
Cited
US4603344A
Cited
US4801998A
Cited
US4862245A
Cited
JPS62109326A
Cited
JPS62115834A
Cited
JPS62261133A
Cited
US4931852A
Cited
US5184208A
Cited
US5016138A
Cited
US5108955A
Cited
US4961107A
Cited
JPH02306639A
Cited
US5051275A
Cited
US5311060A
Cited
US5101465A
Cited
JPH04157758A
Cited
US5304842A
Cited
US5218759A
Cited
US5144747A
Cited
US5173764A
Cited
US5488254A
Cited
US5194930A
Cited
US5252853A
Cited
US5222014A
Cited
US5652461A
Cited
US5598034A
Cited
US5489538A
Cited
US5394303A
Cited
US5461255A
Cited
US5344795A
Cited
US5305185A
Cited
US5450283A
Cited
US5440169A
Cited
US5286679A
Cited
US5379186A
Cited
US5641997A
Cited
US5441684A
Cited
US5489801A
Cited
US5552635A
Cited
US5434105A
Cited
US5656857A
Cited
US5604376A
Cited
US5436203A
Cited
US5659952A
Cited
US5861666A
Cited
US5866953A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-01 | 2005-04-02 | 2005-10-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-01 | 2009-04-02 | 2009-10-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-01 | 2013-04-02 | 2013-10-02 | $7700.00 | Window Closed / Lapsed |