Semi-conductor assembly

Claim 1

A semi-conductor assembly, comprising: (a) first, second and third electrically conductive members; (b) a semi-conductor diode positioned between said first and second conductive members, wherein the anode region of the diode is electrically connected to one of said first and second conductive members and the cathode region is electrically connected to the other of said first and second conductive members; (c) a semi-conductor thyristor positioned between said second and third conductive members, wherein one of said semi-conductor thyristor anode and cathode terminal regions is connected to the second conductive member and the other of the anode and cathode terminal regions is connected to the third conductive member, and wherein said third and first electrically conductive members are electrically interconnected, and the terminal region of the semi-conductor diode which is electrically connected to the second conductive member is of opposite polarity to the thyristor terminal region which is also electrically connected to the second conductive member, (d) means for making an electrical connection to a gate terminal region of the thyristor; and (e) heat sink means including said second conductive member for accepting heat from said diode and thyristor, wherein said heat sink means includes thermally conductive block means having first and second opposed recesses, wherein said second conductive member forms a boundary wall separating said first and second recesses, said first recess houses said diode, said second recess houses said thyristor, and said first and third conductive members are resiliently biased towards one another so that said diode and said thyristor are loaded against said second conductive member, wherein said block means is of two part construction and said second conductive member is integral with one of the two parts, and wherein said first conductive member is housed in said first recess and said third conductive member is housed in said second recess.