US3743893A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fluid cooled compression bonded semiconductor device structure
Assignee: Mitsubishi Electric Corp
•
Filing: 1971-05-27
•
Granted: 1973-07-03
•
Expires: 1991-05-27
Abstract
Abstract This disclosure relates to a semiconductor device structure in which a plurality of semiconductor devices are held in a compressive relationship by resilient plates.
Inventors
- 👤 I Yamomoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:18
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/40; H10W40/47; H10W72/00
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
126 words
A semiconductor device structure comprising: 1. at least two semiconductor element; 2. at least two liquid cooled radiator members, each of said semiconductor element being disposed between and in physical contact with a first side of said radiator members; 3. a pressure contact resilient plate in physical contact with a second side of each radiator member; 4. said first and second sides of said radiator members being essentially parallel; 5. said pressure contact resilient plate being cruciform in shape, the central portion of the cruciform being in the form of a segment of a sphere and said sphere segment presenting a convex surface in a pressure contacting direction with said radiator member, 6. said pressure contact resilient plate increasing in curvature in its pressure contacting state.
Claim 2
Dependent Claim
126 words
A semiconductor device structure comprising: 1. at least two semiconductor element; 2. at least two liquid cooled radiator members, each of said semiconductor element being disposed between and in physical contact with a first side of said radiator members; 3. a pressure contact resilient plate in physical contact with a second side of each radiator member; 4. said first and second sides of said radiator members being essentially parallel; 5. said pressure contact resilient plate being cruciform in shape, the central portion of the cruciform being in the form of a segment of a sphere and said sphere segment presenting a convex surface in a pressure contacting direction with said radiator member, 6. said pressure contact resilient plate increasing in curvature in its pressure contacting state.
Claim 3
Dependent Claim
27 words
at least two liquid cooled radiator members, each of said semiconductor element being disposed between and in physical contact with a first side of said radiator members;
Claim 4
Dependent Claim
27 words
at least two liquid cooled radiator members, each of said semiconductor element being disposed between and in physical contact with a first side of said radiator members;
Claim 5
Dependent Claim
29 words
The structure of claim 1 in which pressure is applied to the contacting resilient plates through bolt members which pass through the cruciform protrusions in the resilient contact plate.
Claim 6
Dependent Claim
34 words
The structure of claim 2 in which a liquid cooled radiator member is disposed on each side of each semiconductor element and transmits the compressive force from the resilient plate to the semiconductor device.
Claim 7
Dependent Claim
16 words
a pressure contact resilient plate in physical contact with a second side of each radiator member;
Claim 8
Dependent Claim
16 words
a pressure contact resilient plate in physical contact with a second side of each radiator member;
Claim 9
Dependent Claim
12 words
said first and second sides of said radiator members being essentially parallel;
Claim 10
Dependent Claim
12 words
said first and second sides of said radiator members being essentially parallel;
Claim 11
Dependent Claim
14 words
The structure of claim 3 in which electrical terminals project from the radiator members.
Claim 12
Dependent Claim
42 words
said pressure contact resilient plate being cruciform in shape, the central portion of the cruciform being in the form of a segment of a sphere and said sphere segment presenting a convex surface in a pressure contacting direction with said radiator member,
Claim 13
Dependent Claim
42 words
said pressure contact resilient plate being cruciform in shape, the central portion of the cruciform being in the form of a segment of a sphere and said sphere segment presenting a convex surface in a pressure contacting direction with said radiator member,
Claim 14
Dependent Claim
13 words
said pressure contact resilient plate increasing in curvature in its pressure contacting state.
Claim 15
Dependent Claim
13 words
said pressure contact resilient plate increasing in curvature in its pressure contacting state.
References Cited (Backward Citations)
US2745044A
Cited
US2956214A
Cited
GB853876A
Cited
GB1011171A
Cited
US3413532A
Cited
NL6605519A
Cited
US3436603A
Cited
US3443168A
Cited
US3474306A
Cited
US3523215A
Cited
US3551758A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-02 | 1977-01-01 | 1977-07-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-02 | 1981-01-01 | 1981-07-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-02 | 1985-01-01 | 1985-07-03 | $7700.00 | Window Closed / Lapsed |