US5108955A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making a resin encapsulated pin grid array with integral heatsink
Assignee: Amkor Technology Inc
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Filing: 1991-02-06
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Granted: 1992-04-28
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Expires: 2011-02-06
Abstract
Abstract A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.
Inventors
- 👤 Yoshihiro Ishida
- 👤 Katsuji Komatsu
- 👤 Seiichi Mimura
- 👤 Kikuo Takenouchi
- 👤 Isao Yabe
- 👤 Shingo Ichikawa
- 👤 Yoshihiro Shimada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:52
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S264/00; Y10S264/76; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
145 words
A method of manufacturing a semiconductor device with a heat radiating member in which an IC chip is mounted on a resin substrate having a plurality of contact pins on a lower surface thereof and being resin-encapsulated by injection molding with a mold having a lower half and an upper half, the heat radiating member being integrally insert-molded on an upper surface of the encapsulating resin formed by injection molding, the method comprising the steps of holding the substrate with a substrate-holding portion of the lower half of the mold, holding the heat radiating member with a heat radiating member holding portion of the upper half of the mold, and injecting a molding resin into a gap formed between the heat radiating member being held by the upper half of the mold and the resin substrate being held by the lower half of the mold.
Claim 2
Independent Claim
145 words
A method of manufacturing a semiconductor device with a heat radiating member in which an IC chip is mounted on a resin substrate having a plurality of contact pins on a lower surface thereof and being resin-encapsulated by injection molding with a mold having a lower half and an upper half, the heat radiating member being integrally insert-molded on an upper surface of the encapsulating resin formed by injection molding, the method comprising the steps of holding the substrate with a substrate-holding portion of the lower half of the mold, holding the heat radiating member with a heat radiating member holding portion of the upper half of the mold, and injecting a molding resin into a gap formed between the heat radiating member being held by the upper half of the mold and the resin substrate being held by the lower half of the mold.
Claim 3
Dependent Claim
27 words
A method according to claim 1, wherein said heat radiating member is held against said heat radiating member holding portion of said upper half by vacuum suction.
Claim 4
Dependent Claim
102 words
A method of manufacturing a semiconductor device with a heat radiating member according to claim 1, the member having a lower surface facing towards the substrate and an upper surface facing away from the substrate when the member is held by the holding portion of the upper mold, and further including the steps of severing the member from a metal plate to thereby provide the member with a peripheral edge, forming a rounded transition between the peripheral edge and the lower surface of the member, and forming a substantially sharp corner between the peripheral edge and the upper surface of the member.
Claim 5
Independent Claim
200 words
A method of manufacturing a semiconductor device including a resin substrate, an IC chip mounted to an upper side of the substrate, a resin layer encapsulating the chip, and a heat radiating member overlying the chip, spaced therefrom by the resin layer and in firm, direct contact with the layer, the method comprising the steps of providing a mold having a lower half and an upper half, holding the resin substrate with a substrate holding portion of the lower half of the mold so that the IC chip faces towards the upper half of the mold, holding the heat radiating member with a heat radiating member holding portion of the upper mold so that the heat radiating member is relatively closely adjacent to and spaced from the IC chip by a gap formed between them when the upper and lower mold halves are brought together, and injecting a molding resin into the gap between the heat radiating member and the substrate to thereby encapsulate the IC chip with the molding resin and firmly secure the heat radiating member to the molding resin in a position closely adjacent and spaced from the IC chip by the molding resin in the gap.
Claim 6
Independent Claim
200 words
A method of manufacturing a semiconductor device including a resin substrate, an IC chip mounted to an upper side of the substrate, a resin layer encapsulating the chip, and a heat radiating member overlying the chip, spaced therefrom by the resin layer and in firm, direct contact with the layer, the method comprising the steps of providing a mold having a lower half and an upper half, holding the resin substrate with a substrate holding portion of the lower half of the mold so that the IC chip faces towards the upper half of the mold, holding the heat radiating member with a heat radiating member holding portion of the upper mold so that the heat radiating member is relatively closely adjacent to and spaced from the IC chip by a gap formed between them when the upper and lower mold halves are brought together, and injecting a molding resin into the gap between the heat radiating member and the substrate to thereby encapsulate the IC chip with the molding resin and firmly secure the heat radiating member to the molding resin in a position closely adjacent and spaced from the IC chip by the molding resin in the gap.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-28 | 1995-10-28 | 1996-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-28 | 1999-10-28 | 2000-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-28 | 2003-10-28 | 2004-04-28 | $7700.00 | Window Closed / Lapsed |