US6433277B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic integrated circuit package and method and leadframe for making the package
Assignee: Amkor Technology Singapore Holding Pte Ltd
•
Filing: 2000-07-13
•
Granted: 2002-08-13
•
Expires: 2020-07-13
Abstract
Abstract Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant. A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrically connected to the tabs. An encapsulant is applied to the upper and side surfaces of the leadframe. Finally, the leadframe is cut in situ so that the die pad and tabs are severed from the frame, the sides of the package are formed, and the package is severed from the leadframe.
Inventors
- 👤 Thomas P. Glenn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/01; H10W70/04; H10W70/048; H10W70/421; H10W70/424; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49146; Y10T29/49155; Y10T29/49169; Y10T29/49171; Y10T428/00; Y10T428/24; Y10T428/2419; Y10T428/24207
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
148 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, and each said contact has a first end facing the die pad, a second end opposite the first end, a first surface, a second surface opposite the first surface, and a lip at the first surface of the contact fully around a circumference of the contact except at the second end an integrated circuit die on the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, said encapsulant material covering the die and underfilling the lip of the contacts, wherein the second surface of each said contact is exposed at a horizontal first exterior surface of the package body.
Claim 2
Dependent Claim
148 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, and each said contact has a first end facing the die pad, a second end opposite the first end, a first surface, a second surface opposite the first surface, and a lip at the first surface of the contact fully around a circumference of the contact except at the second end an integrated circuit die on the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, said encapsulant material covering the die and underfilling the lip of the contacts, wherein the second surface of each said contact is exposed at a horizontal first exterior surface of the package body.
Claim 3
Dependent Claim
35 words
The package of claim 1 , wherein the die pad includes a first surface upon which the die is mounted and a lip at the first surface fully around a circumference of the die pad.
Claim 4
Dependent Claim
37 words
The package of claim 2 , wherein the die pad includes a second surface opposite the first surface, and the second surface of the die pad is exposed at the first exterior surface of the package body.
Claim 5
Dependent Claim
26 words
The package of claim 2 , wherein the first surface of the die pad is in a horizontal plane with the first surface of the contacts.
Claim 6
Dependent Claim
21 words
The package of claim 1 , wherein the second surface of the die pad is fully covered with the encapsulant material.
Claim 7
Dependent Claim
20 words
The package of claim 1 , further comprising asperities on said lip, said asperities being covered by the encapsulant material.
Claim 8
Dependent Claim
49 words
The package of claim 1 , wherein the package body includes orthogonal exterior side surfaces adjacent to the first exterior surface of the package body, and the second end of each contact is exposed in a common plane with one of the exterior side surfaces of the package body.
Claim 9
Dependent Claim
238 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, said side surface including a central depression fully around the circumference of the die pad, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a planar first surface, a second surface opposite the first surface, and opposing side surfaces between the first and second ends and the first and second surfaces, the first surface of the contact is in a horizontal plane with the first surface of the die pad, and the first end and the opposing side surfaces of the contact include a central depression; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, wherein the encapsulant material covers the die and fills the central depression of the side surface of the die pad and the central depression of the first end and side surfaces of the contacts, and the second surface of the contacts is exposed at a first exterior surface of the package body.
Claim 10
Dependent Claim
238 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, said side surface including a central depression fully around the circumference of the die pad, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a planar first surface, a second surface opposite the first surface, and opposing side surfaces between the first and second ends and the first and second surfaces, the first surface of the contact is in a horizontal plane with the first surface of the die pad, and the first end and the opposing side surfaces of the contact include a central depression; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, wherein the encapsulant material covers the die and fills the central depression of the side surface of the die pad and the central depression of the first end and side surfaces of the contacts, and the second surface of the contacts is exposed at a first exterior surface of the package body.
Claim 11
Dependent Claim
36 words
The package of claim 8 , wherein the side surfaces of the die pad and the side surfaces and first end of the contacts further include numerous asperities, said asperities being covered with the encapsulant material.
Claim 12
Dependent Claim
49 words
The package of claim 8 , wherein the package body includes orthogonal exterior side surfaces adjacent to the first exterior surface of the package body, and the second end of each contact is exposed in the common plane with one of the exterior side surfaces of the package body.
Claim 13
Dependent Claim
219 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, said side surface including a protruding central peak fully around a circumference of the die pad, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a first surface, a second surface opposite the first surface, and opposing side surfaces between the first and second ends and the first and second surfaces, and the first end and the opposing side surfaces of the contact include a protruding central peak; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of one of the contacts; and a package body of an encapsulant material, wherein the encapsulant material covers the die, and the protruding central peak of the side surface of the die pad and of the first end and side surfaces of the contacts extends into the encapsulant material, and the second surface of the contacts is exposed at a first exterior surface of the package body.
Claim 14
Dependent Claim
219 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, said side surface including a protruding central peak fully around a circumference of the die pad, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a first surface, a second surface opposite the first surface, and opposing side surfaces between the first and second ends and the first and second surfaces, and the first end and the opposing side surfaces of the contact include a protruding central peak; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of one of the contacts; and a package body of an encapsulant material, wherein the encapsulant material covers the die, and the protruding central peak of the side surface of the die pad and of the first end and side surfaces of the contacts extends into the encapsulant material, and the second surface of the contacts is exposed at a first exterior surface of the package body.
Claim 15
Dependent Claim
28 words
The package of claim 11 , wherein the second surface of the die pad is exposed in the plane of the first exterior surface of the package body.
Claim 16
Dependent Claim
21 words
The package of claim 11 , wherein the second surface of the die pad is fully covered with the encapsulant material.
Claim 17
Dependent Claim
33 words
The package of claim 11 , wherein the side surface of the die pad and the side surfaces and first end of the contacts further include numerous asperities on said protruding central peak.
Claim 18
Dependent Claim
49 words
The package of claim 11 , wherein the package body includes orthogonal exterior side surfaces adjacent to the first exterior surface of the package body, and the second end of each contact is exposed in a common plane with one of the exterior side surfaces of the package body.
Claim 19
Dependent Claim
26 words
The package of claim 11 , wherein the first surface of the die pad is in a horizontal plane with the first surface of the contacts.
Claim 20
Dependent Claim
231 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface opposite the first surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a first surface in a horizontal plane with the first surface of the die pad, a second surface opposite the first surface of the contact, and opposing side surfaces between the first and second end surfaces ends and the first and second surfaces of the contact; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of one of the contacts; and a body formed of an encapsulant material, wherein the encapsulant material covers the die and the second surface of the contacts is exposed at an exterior surface of the package body, and wherein the side surface of the die pad includes a means around the circumference of the die pad for vertically locking the die pad to the encapsulant material, and the side surfaces and first end of the contacts include a means for vertically locking the contact to the encapsulant material.
Claim 21
Dependent Claim
231 words
A package for an integrated circuit die comprising: a metal die pad and a plurality of metal contacts, wherein said die pad has a first surface, a second surface opposite the first surface, and a peripheral side surface around a circumference of the die pad between the first and second surfaces, and wherein each said contact has a first end facing the die pad, a second end opposite the first end, a first surface in a horizontal plane with the first surface of the die pad, a second surface opposite the first surface of the contact, and opposing side surfaces between the first and second end surfaces ends and the first and second surfaces of the contact; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of one of the contacts; and a body formed of an encapsulant material, wherein the encapsulant material covers the die and the second surface of the contacts is exposed at an exterior surface of the package body, and wherein the side surface of the die pad includes a means around the circumference of the die pad for vertically locking the die pad to the encapsulant material, and the side surfaces and first end of the contacts include a means for vertically locking the contact to the encapsulant material.
Claim 22
Dependent Claim
28 words
The package of claim 17 , wherein the second surface of the die pad is exposed in the plane of the first exterior surface of the package body.
Claim 23
Dependent Claim
35 words
The package of claim 17 , wherein the side surfaces of the die pad and the side surfaces and first end of the contacts further include numerous asperities that are covered with the encapsulant material.
Claim 24
Dependent Claim
49 words
The package of claim 17 , wherein the package body includes orthogonal exterior side surfaces adjacent to the first exterior surface of the package body, and the second end of each contact is exposed in a common plane with one of the exterior side surfaces of the package body.
Claim 25
Dependent Claim
156 words
A package for an integrated circuit die comprising: a planar metal die pad and a plurality of horizontal metal contacts, wherein said die pad has a first surface, a second surface opposite the first surface, a peripheral side surface around the die pad between the first surface and the second surface, and a lip at the first surface of the die pad fully around the die pad, and the contacts each have a first surface and an opposite second surface; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, said encapsulant material covering the die and underfilling the lip of the die pad, wherein the second surface of each said contact is exposed at a horizontal first exterior surface of the package body.
Claim 26
Dependent Claim
156 words
A package for an integrated circuit die comprising: a planar metal die pad and a plurality of horizontal metal contacts, wherein said die pad has a first surface, a second surface opposite the first surface, a peripheral side surface around the die pad between the first surface and the second surface, and a lip at the first surface of the die pad fully around the die pad, and the contacts each have a first surface and an opposite second surface; an integrated circuit die on the first surface of the die pad; a plurality of conductors each electrically connected between the die and the first surface of a respective one of the contacts; and a package body formed of an encapsulant material, said encapsulant material covering the die and underfilling the lip of the die pad, wherein the second surface of each said contact is exposed at a horizontal first exterior surface of the package body.
Claim 27
Dependent Claim
25 words
The package of claim 21 , wherein the second surface of the die pad is exposed at the first exterior surface of the package body.
Claim 28
Dependent Claim
26 words
The package of claim 21 , wherein the first surface of the die pad is in a horizontal plane with the first surface of the contacts.
Claim 29
Dependent Claim
21 words
The package of claim 21 , wherein the second surface of the die pad is fully covered with the encapsulant material.
Claim 30
Dependent Claim
49 words
The package of claim 11 , wherein the package body includes orthogonal exterior side surfaces adjacent to the first exterior surface of the package body, and a distal end of each contact is exposed in a common plane with one of the exterior side surfaces of the package body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-12 | 2006-02-11 | 2006-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-12 | 2010-02-11 | 2010-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-12 | 2014-02-11 | 2014-08-13 | $7700.00 | Window Closed / Lapsed |