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JPS6052050A Expired / Lapsed JP ⏱️ 0.0 years remaining

Manufacture of lead frame

Assignee: Dai Nippon Printing Co Ltd
•
Filing: 1983-08-31
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Granted: —
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Expires: 2003-08-31
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Abstract

Abstract PURPOSE:To contrive simplification of the forming process of protrusion to be used for outer terminal by a method wherein an etching is performed on a metal plate based on the negative plate arranged on one surface of the metal plate, and a half etching is performed on the metal plate based on the negative plate arranged on the other surface of the metal plate. CONSTITUTION:After photosensitive resin 2 has been applied on both sides of the metal plate 1 to be used for construction of a lead frame, a negative plate 3 having lead-frame-shaped pattern 3 is arranged on one surface, and a negative pattern 4 having a protrusion to be used for outer terminal is arranged on the other surface. Then, after the patterns on the negative plates 3 and 4 have been printed, a developing process is performed, and resist patterns 5a and 5b are obtained. Subsequently, an aperture part 6 is formed by performing an etching through the intermediary of resist pattern 5a and, at the same time, a half etching is performed through the intermediary of the resist pattern 5b, and a protruded part 8 to be used for outer terminal is formed.

Inventors

  • 👤 Tomihiro Nakada
  • 👤 中田 富紘
  • 👤 Koji Ishida
  • 👤 晃司 石田

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-04 23:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/042; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/726

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS5025466B2 Cited
JPS525988A Cited
JPS53128275A Cited

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