Patent US2279781A successfully refreshed from Google Patents.
EP0794572A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic component, method for making the same, and lead frame and mold assembly for use therein
Assignee: Panasonic Holdings Corp
•
Filing: 1997-03-06
•
Granted: —
•
Expires: 2017-03-06
Abstract
Abstract A lead has a thick part having a thickness of 0. 2 mm and a thin part having a thickness of 0. 1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part's lateral surface is located at a lower end area of the resin's lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0. 03 mm to 0. 05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.
Inventors
- 👤 Hirofumi Takata
- 👤 Tadashi Tanida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 10:14
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/481; H10W74/10; H10W74/111; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/0198; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W74/127; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
99 words
An electronic component of a resin molded package type, said electronic component comprising: (a) an electronic element; (b) a lead which is electrically connected with said electronic element; and (c) a resin which encapsulates said electronic element and said lead; wherein a lateral surface of said lead and a lateral surface of said resin are simultaneously formed by a single cut such that said lateral surface of said lead is located at a lower end area of said lateral surface of said resin and said lateral surfaces of said lead and said resin are exposed forming the same plane.
Claim 2
Dependent Claim
18 words
The electronic component of claim 1, wherein said lead is formed of a soft material which cuts easily.
Claim 3
Dependent Claim
16 words
The electronic component of claim 1, wherein said exposed lateral surface of said lead is plated.
Claim 4
Dependent Claim
27 words
The electronic component of claim 1, wherein at least a portion of a bottom surface of said lead is exposed at a bottom surface of said resin.
Claim 5
Dependent Claim
19 words
The electronic component of claim 4, wherein plating is applied only to said exposed bottom surface of said lead.
Claim 6
Dependent Claim
24 words
The electronic component of claim 4, wherein said exposed bottom surface of said lead is continuous with said exposed lateral surface of said lead.
Claim 7
Dependent Claim
20 words
The electronic component of claim 6, wherein said exposed bottom surface and exposed lateral surface of said lead are plated.
Claim 8
Dependent Claim
23 words
The electronic component of claim 4, wherein said exposed bottom surface of said lead slightly projects from said bottom surface of said resin.
Claim 9
Dependent Claim
25 words
The electronic component of claim 4, wherein said bottom surface of said resin has, around said exposed bottom surface of said lead, portions defining grooves.
Claim 10
Dependent Claim
26 words
The electronic component of claim 1, wherein said resin has a top surface the periphery of which is provided with either a chamfer or a step.
Claim 11
Dependent Claim
24 words
The electronic component of claim 1, wherein at least a portion of each of four lateral surfaces of said resin is formed by cutting.
Claim 12
Dependent Claim
38 words
The electronic component of claim 1, wherein said lateral surface of said resin has a cut surface formed at the time of cutting said lead and a non-cut surface formed at the time of performing said encapsulation process.
Claim 13
Dependent Claim
40 words
The electronic component of claim 12, wherein said cut surface of said resin's lateral surface is perpendicular to said resin's bottom surface and wherein said non-cut surface of said resin's lateral surface tilts with respect to said resin's bottom surface.
Claim 14
Dependent Claim
36 words
The electronic component of claim 12, wherein said cut surface of said resin's lateral surface is formed, being perpendicular with respect to said resin's bottom surface at a lower end area of said resin's lateral surface.
Claim 15
Dependent Claim
34 words
The electronic component of claim 12, wherein each of lower end areas of four lateral surfaces of said resin is formed by cutting, being perpendicular with respect to said bottom surface of said resin.
Claim 16
Dependent Claim
131 words
The electronic component of claim 1, wherein: (a) said lead includes: a thin part which is electrically connected with said electronic element; and a thick part which is formed having a greater thickness than said thin part so as to provide a step on the side of said lead's bottom surface; (b) a lateral surface of said thick part and said lateral surface of said resin are simultaneously formed by a single cut so that said lateral surface of said thick part is located at a lower end area of said lateral surface of said resin and said lateral surfaces of said thick part and said resin are exposed forming the same plane; and (c) a bottom surface of said thick part is exposed at a bottom surface of said resin.
Claim 17
Dependent Claim
40 words
The electronic component of claim 16, wherein said exposed bottom surface of said thick part projects, from said bottom surface of said resin, by a length less than a difference in thickness between said thin part and said thick part.
Claim 18
Dependent Claim
20 words
The electronic component of claim 16, wherein said thin part is greater in top surface width than said thick part.
Claim 19
Dependent Claim
36 words
The electronic component of claim 16, wherein said thin part has a top surface whose area is greater than the area of said electronic element and wherein said electronic element is fixed onto said thin part.
Claim 20
Dependent Claim
31 words
The electronic component of claim 16, wherein said thin part is provided with a notch, said notch acting as a prevention means for preventing said lead from slipping from said resin.
Claim 21
Independent Claim
102 words
A method for fabricating an electronic component of a resin molded package type, said method comprising: (a) a step of fixing an electronic element on a plate-like lead frame having a lead part; (b) a step of electrically connecting said electronic element with said lead part; (c) a step of integrally encapsulating said electronic element and said lead part with a resin; and (d) a step of cutting said lead frame together with said resin in order that a resin cut surface and a lead cut surface are formed at the same time on a package lateral surface of said electronic component.
Claim 22
Dependent Claim
37 words
The electronic component fabrication method of claim 21, wherein said encapsulation step comprises a step of encapsulating said lead part such that a bottom surface of said lead part exposes at a bottom surface of said resin.
Claim 23
Dependent Claim
29 words
The electronic component fabrication method of claim 22, wherein said encapsulation step comprises a step of inserting between a lower mold element and said lead part an elastic sheet.
Claim 24
Dependent Claim
35 words
The electronic component fabrication method of claim 21 further comprising a step of forming in a top surface of said resin a groove for guiding a cutting blade to be used in said cutting step.
Claim 25
Dependent Claim
35 words
The electronic component fabrication method of claim 21 further comprising a step of forming in a top surface of said resin a ridge for positioning a cutting blade to be used in said cutting step.
Claim 26
Dependent Claim
32 words
The electronic component fabrication method of claim 21 further comprising a step of subjecting said lead cut surface, formed at said package lateral surface of said electronic component, to a plating process.
Claim 27
Independent Claim
225 words
A method of fabricating a plurality of electronic components of a resin molded package type, said method comprising: (a) over a plate-like lead frame comprising a plurality of bridge parts which are formed into a lattice and a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces; (b) a step of electrically connecting each said electronic element with a corresponding set of lead parts of said plurality of sets of lead parts; (c) a step of encapsulating said plurality of electronic elements and said plurality of sets of lead parts with a resin so that said plurality of electronic elements and said plurality of sets of lead parts are continuous with one another through common gates at least in one direction; and (d) a step of cutting said lead frame together with said resin such that said plurality of sets of lead parts of said lead frame are separated from said plurality of bridge parts respectively and resin cut surfaces and lead cut surfaces are formed at the same time on individual package lateral surfaces of said plurality of electronic components.
Claim 28
Dependent Claim
37 words
The electronic component fabrication method of claim 27, wherein said encapsulation step comprises a step of having an upper mold element press said lead part of said lead frame at a position away from said common gate.
Claim 29
Dependent Claim
43 words
The electronic component fabrication method of claim 27, wherein said encapsulation step comprises a step of encapsulating said plurality of sets of lead parts such that a bottom surface of each said lead part is exposed at a bottom surface of said resin.
Claim 30
Dependent Claim
45 words
The electronic component fabrication method of claim 27 further comprising a step of forming a plurality of grooves for guiding a cutting blade to be used in said cutting step in a top surface of said resin along said bridge parts of said lead frame.
Claim 31
Dependent Claim
38 words
The electronic component fabrication method of claim 30, wherein said plurality of grooves are formed at least where said resin cut surfaces and lead cut surfaces of said plurality of electronic components are formed at the same time.
Claim 32
Dependent Claim
27 words
The electronic component fabrication method of claim 30, wherein each said groove is formed at least between two adjacent electronic elements of said plurality of electronic elements.
Claim 33
Dependent Claim
26 words
The electronic component fabrication method of claim 30, wherein said plurality of grooves are formed horizontally and perpendicularly along said bridge parts of said lead frame.
Claim 34
Dependent Claim
29 words
The electronic component fabrication method of claim 30, wherein each said groove has a bottom width and a top width, said top width being greater than said bottom width.
Claim 35
Dependent Claim
25 words
The electronic component fabrication method of claim 30, wherein each said groove is formed of a pair of elongated grooves running parallel with each other.
Claim 36
Dependent Claim
47 words
The electronic component fabrication method of claim 27 further comprising a step of forming a plurality of ridges for use in locating a cutting blade to be used in said cutting step in a top surface of said resin along said bridge parts of said lead frame.
Claim 37
Dependent Claim
26 words
The electronic component fabrication method of claim 36, wherein said plurality of ridges are formed horizontally and perpendicularly along said bridge parts of said lead frame.
Claim 38
Dependent Claim
25 words
The electronic component fabrication method of claim 36, wherein the maximum width of each said ridge is greater than the width of said bridge part.
Claim 39
Dependent Claim
34 words
The electronic component fabrication method of claim 27 further comprising a step of subjecting said lead cut surfaces formed at said package lateral surfaces of said plurality of electronic components to a plating process.
Claim 40
Independent Claim
200 words
A method for fabricating a plurality of electronic components of a resin molded package type, said method comprising: (a) over a plate-like lead frame comprising (i) a rectangular exterior frame, (ii) a plurality of bridge parts which are formed into a lattice to provide bridges between opposite sides of said rectangular exterior frame and between other opposite sides thereof, and (iii) a plurality of sets of lead parts which extend towards a plurality of lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said plurality of bridge parts, a step of fixing each of a plurality of electronic elements in a corresponding lattice open space of said plurality of lattice open spaces; (b) a step of electrically connecting each said electronic element with a corresponding set of lead parts of said plurality of sets of lead parts; (c) a step of encapsulating said plurality of electronic elements and said plurality of sets of lead parts with a resin; and (d) a step of cutting said lead frame together with said resin such that resin cut surfaces and lead cut surfaces are formed at the same time on individual package lateral surfaces of said plurality of electronic components.
Claim 41
Dependent Claim
56 words
The electronic element fabrication method of claim 40, wherein said encapsulation step comprises a step of injecting a resin through common gates into a plurality of cavities which are horizontally and perpendicularly, and two-dimensionally arranged in corresponding manner to said plurality of electronic elements and which are communicated with one another at least in one direction.
Claim 42
Dependent Claim
81 words
The electronic component fabrication method of claim 40, wherein said cutting step comprises a step of cutting said lead frame together with said resin at a width greater than the width of said bridge part of said lead frame in order that resin cut surfaces and lead cut surfaces are formed at the same time on package lateral surfaces of two electronic components of said plurality of electronic components corresponding to two adjacent electronic elements of said plurality of electronic elements.
Claim 43
Dependent Claim
44 words
The electronic component fabrication method of claim 42, wherein said cutting step comprises a step of cutting said lead frame together with said resin with a single cutting blade having a width greater than the width of said bridge part of said lead frame.
Claim 44
Dependent Claim
34 words
The electronic component fabrication method of claim 40 further comprising a step of subjecting said lead cut surfaces, formed on said package lateral surfaces of said plurality of electronic components, to a plating process.
Claim 45
Dependent Claim
93 words
A plate-like lead frame for use in fabrication of an electronic component of a resin molded package type, said lead frame comprising: (a) a rectangular exterior frame; (b) a plurality of bridge parts which are formed into a lattice so as to establish connections between a pair of opposite sides of said rectangular exterior frame as well as between another pair of opposite sides thereof; and (c) a plurality of sets of lead parts which extend towards respective lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said bridge parts.
Claim 46
Dependent Claim
72 words
The lead frame of claim 45, each said lead part comprising: (a) a base end having the same thickness as said exterior frame and said bridge part; and (b) a leading end which is formed, having a width greater than the width of said base end and having a thickness smaller than the thickness of said base end so as to form a step on the side of a bottom surface thereof.
Claim 47
Dependent Claim
42 words
The lead frame of claim 46, wherein a specific lead part of said plurality of sets of lead parts is provided with a leading end whose top surface area is greater than the area of an electronic element that is fixed thereon.
Claim 48
Dependent Claim
40 words
The lead frame of claim 46, wherein a specific lead part of said plurality of sets of lead parts is provided with a notch that is a prevention against lead slipping from a resin after a resin molding is performed.
Claim 49
Dependent Claim
42 words
The lead frame of claim 45, wherein said rectangular exterior frame has at four corners thereof portions defining holes for positioning which are used in performing a resin molding process as well as in cutting said plurality of sets of lead parts.
Claim 50
Dependent Claim
23 words
The lead frame of claim 45, wherein said rectangular exterior frame has at one side thereof portions defining a plurality of feed holes.
Claim 51
Dependent Claim
100 words
A mold assembly for use in fabrication of an electronic component of a resin molded package type, said mold assembly comprising: (a) a lower mold element onto which a lead frame with a plurality of electronic elements which are arranged horizontally and perpendicularly, and two-dimensionally is placed; (b) an upper mold element that defines a plurality of cavities which are horizontally and perpendicularly, and two-dimensionally arranged correspondingly to said plurality of electronic elements and which are communicated with one another at least in one direction; and (c) common gates through which a resin is injected into said plurality of cavities.
Claim 52
Dependent Claim
26 words
The mold assembly of claim 51, wherein said plurality of cavities are communicated with one another via open spaces having the same height as said cavities.
Claim 53
Dependent Claim
33 words
The mold assembly of claim 51, wherein said upper mold element is provided with a plurality of recesses, each of said recesses having a depth capable of forming most of each said cavity.
Claim 54
Dependent Claim
37 words
The mold assembly of claim 51, wherein at least one of said upper and lower mold elements is provided with pins which are inserted into holes for positioning formed in an exterior frame of said lead frame.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.