US6424034B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance packaging for microprocessors and DRAM chips which minimizes timing skews
Assignee: Round Rock Research LLC
•
Filing: 1998-08-31
•
Granted: 2002-07-23
•
Expires: 2018-08-31
Abstract
Abstract A method and apparatus for packaging microprocessors and memory devices on a single silicon substrate is described. Microprocessors and memory devices are placed on both sides of the silicon substrate. Through holes are formed in the substrate to connect the microprocessor and memory devices together. By packaging the microprocessor and memory element this way, the propagation length between the memory and the microprocessors is shortened, and timing skews are minimized, and data transmission speed is increased. In addition, additional active and passive circuits and/or components can also be fabricated in one or both sides of the silicon substrate.
Inventors
- 👤 Kie Y. Ahn
- 👤 Leonard Forbes
- 👤 Paul Farrar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:30
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/90; H10W72/941; H10W72/9415; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
57 words
A chip carrier comprising: a silicon substrate having a thickness less than 0.125 centimeters and with at least one circuit device formed within it, said at least one circuit device comprising at least one passive circuit; and at least one integrated circuit chip attached to the substrate and electrically connected to said at least one circuit device.
Claim 2
Dependent Claim
57 words
A chip carrier comprising: a silicon substrate having a thickness less than 0.125 centimeters and with at least one circuit device formed within it, said at least one circuit device comprising at least one passive circuit; and at least one integrated circuit chip attached to the substrate and electrically connected to said at least one circuit device.
Claim 3
Dependent Claim
22 words
The chip carrier of claim 1 , wherein said at least one circuit device further comprises at least one active circuit device.
Claim 4
Dependent Claim
22 words
The chip carrier of claim 1 , wherein said at least one integrated circuit chip is attached to the substrate by soldering.
Claim 5
Dependent Claim
42 words
The chip carrier of claim 1 , wherein said silicon substrate has a first face and a second face which are opposite each other, conductive regions on said first and second faces being connected through the silicon substrate by conductive through holes.
Claim 6
Dependent Claim
24 words
The chip carrier of claim 1 , wherein said at least one passive device comprises at least one of a resistor and a capacitor.
Claim 7
Dependent Claim
35 words
The chip carrier of claim 1 , wherein said at least one integrated circuit chip comprises at least one logic chip attached to the substrate and at least one memory chip attached to the substrate.
Claim 8
Dependent Claim
28 words
The chip carrier of claim 1 , wherein a bonding agent is located in the area between the said at least one integrated circuit chip and the substrate.
Claim 9
Dependent Claim
13 words
The chip carrier of claim 1 , wherein said chip carrier is encapsulated.
Claim 10
Dependent Claim
21 words
The chip carrier of claim 2 , wherein said at least one active circuit device comprises a phase locked loop circuit.
Claim 11
Dependent Claim
39 words
The chip carrier of claim 6 , wherein said at least one logic chip is attached to a first face of the substrate and said at least one memory chip is attached to a second face of said substrate.
Claim 12
Dependent Claim
14 words
The chip carrier of claim 3 , where the soldering comprises micro bump bonding.
Claim 13
Dependent Claim
24 words
The chip carrier of claim 4 , wherein said at least one circuit device is an active circuit device formed in said first face.
Claim 14
Dependent Claim
17 words
The chip carrier of claim 6 , wherein said at least one logic chip is a microprocessor.
Claim 15
Dependent Claim
20 words
The chip carrier of claim 12 , wherein at least one passive circuit device is formed in said second face.
Claim 16
Dependent Claim
13 words
The chip carrier of claim 7 , wherein said bonding agent is epoxy.
Claim 17
Dependent Claim
61 words
A processing system comprising: a silicon substrate having a thickness less than 0.125 centimeters and having at least one circuit device formed therein; a logic device attached to one side of the substrate; and at least one memory device attached to an opposite side of the substrate and connected to said logic device through conductive through holes formed in said substrate.
Claim 18
Dependent Claim
61 words
A processing system comprising: a silicon substrate having a thickness less than 0.125 centimeters and having at least one circuit device formed therein; a logic device attached to one side of the substrate; and at least one memory device attached to an opposite side of the substrate and connected to said logic device through conductive through holes formed in said substrate.
Claim 19
Dependent Claim
21 words
The processing system of claim 16 , wherein said at least one circuit device comprises at least one active circuit device.
Claim 20
Dependent Claim
21 words
The processing system of claim 16 , wherein said at least one circuit device comprises at least one passive circuit device.
Claim 21
Dependent Claim
14 words
The processing system of claim 16 , wherein said logic device is a microprocessor.
Claim 22
Dependent Claim
81 words
A chip carrier comprising: a silicon substrate having at least one circuit device formed therein; at least one integrated circuit chip attached to a first side of the substrate and electrically connected to said at least one circuit device; and, a microprocessor attached to a second side of the substrate, opposite to said first side, and electrically connected to said at least one integrated circuit chip and said at least one circuit device through at least one opening in said substrate.
Claim 23
Dependent Claim
81 words
A chip carrier comprising: a silicon substrate having at least one circuit device formed therein; at least one integrated circuit chip attached to a first side of the substrate and electrically connected to said at least one circuit device; and, a microprocessor attached to a second side of the substrate, opposite to said first side, and electrically connected to said at least one integrated circuit chip and said at least one circuit device through at least one opening in said substrate.
Claim 24
Dependent Claim
43 words
A chip carrier comprising: a silicon substrate; at least one integrated circuit chip attached to each of a first and a second opposing sides of the substrate, wherein said integrated circuit chips are electrically connected through at least one opening in said substrate.
Claim 25
Dependent Claim
43 words
A chip carrier comprising: a silicon substrate; at least one integrated circuit chip attached to each of a first and a second opposing sides of the substrate, wherein said integrated circuit chips are electrically connected through at least one opening in said substrate.
Claim 26
Dependent Claim
24 words
The chip carrier of claim 21 , wherein each of the at least one integrated circuit chips are attached to the substrate by soldering.
Claim 27
Dependent Claim
51 words
The chip carrier of claim 21 , wherein the at least one integrated circuit chip attached to the first side of the substrate comprises at least one logic chip, and the at least one integrated circuit chip attached to the second side of the substrate comprises at least one memory chip.
Claim 28
Dependent Claim
53 words
The chip carrier of claim 21 , wherein the at least one integrated circuit chip attached to the first side of the substrate is attached with a first material which is different from a second material used to attach the at least one integrated circuit chip to the second side of the substrate.
Claim 29
Dependent Claim
19 words
The chip carrier of claim 21 , further comprising at least one circuit device formed within the silicon substrate.
Claim 30
Dependent Claim
29 words
The chip carrier of claim 21 , wherein conductive regions on said first and second opposing sides of the substrate are connected through the substrate by conductive through holes.
Claim 31
Dependent Claim
28 words
The chip carrier of claim 21 , wherein a bonding agent is located in the area between the said at least one integrated circuit chips and the substrate.
Claim 32
Dependent Claim
14 words
The chip carrier of claim 22 , where the soldering comprises micro bump bonding.
Claim 33
Dependent Claim
16 words
The chip carrier of claim 23 , wherein the at least one logic chip is microprocessor.
Claim 34
Dependent Claim
19 words
The chip carrier of claim 24 , wherein the first and second materials are solders having different thermal characteristics.
Claim 35
Dependent Claim
21 words
The chip carrier of claim 25 , wherein the at least one circuit device comprises at least one active circuit device.
Claim 36
Dependent Claim
21 words
The chip carrier of claim 25 , wherein said at least one circuit device comprises at least one passive circuit device.
Claim 37
Dependent Claim
22 words
The chip carrier of claim 25 , wherein at least one circuit device is active circuit device formed in said first face.
Claim 38
Dependent Claim
20 words
The chip carrier of claim 25 , wherein at least one passive circuit device is formed in said second face.
Claim 39
Dependent Claim
21 words
The chip carrier of claim 31 , wherein said at least one active circuit device comprises a phase locked loop circuit.
Claim 40
Dependent Claim
24 words
The chip carrier of claim 32 , wherein said at least one passive device comprises at least one of a resistor and a capacitor.
Claim 41
Dependent Claim
13 words
The chip carrier of claim 27 , wherein said bonding agent is epoxy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-07-22 | 2006-01-21 | 2006-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-22 | 2010-01-21 | 2010-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-22 | 2014-01-21 | 2014-07-23 | $7700.00 | Window Closed / Lapsed |