US5079618A — Semiconductor device structures cooled by Peltier…

Claim 1

Independent Claim 96 words

An electrical interconnect and packaging assembly useful for cooling a wide variety of semiconductor devices including, in combination: a. a metal support member, b. a P-type or N-type semiconductor layer disposed on said metal support member and forming therewith a Peltier heating junction, c. a metal layer disposed on said semiconductor layer and forming therewith a Peltier cooling junction, d. an electronic device or device package disposed on said metal layer, and e. means for passing current through said cooling and heating Peltier junctions in a direction to provide heat absorption at said Peltier cooling junction.

Claim 2

Dependent Claim 96 words

An electrical interconnect and packaging assembly useful for cooling a wide variety of semiconductor devices including, in combination: a. a metal support member, b. a P-type or N-type semiconductor layer disposed on said metal support member and forming therewith a Peltier heating junction, c. a metal layer disposed on said semiconductor layer and forming therewith a Peltier cooling junction, d. an electronic device or device package disposed on said metal layer, and e. means for passing current through said cooling and heating Peltier junctions in a direction to provide heat absorption at said Peltier cooling junction.

Claim 3

Dependent Claim 62 words

The assembly defined in claim 1 wherein said means for passing current through said Peltier junctions further includes means for serially passing current to said electronic device and to said Peltier junctions from a single power supply, whereby said metal support member is multi-functional in that it provides mechanical support, electrical bias and electronic cooling and heat sinking for said electronic device.

Claim 4

Dependent Claim 102 words

An electrical interconnect and package assembly including, in combination: a. a semiconductor device, b. first and second metal frame members supporting said semiconductor device, c. first and second power leads positioned adjacent said first and second metal frame members, respectively, for providing power to said semiconductor device, and d. first and second Peltier semiconductor materials connected, respectively, between said first power lead and said first metal frame member and said second power lead and said second metal frame member for providing Peltier cooling junctions at the surfaces of said first and second metal frame members for cooling said semiconductor device mounted thereon.

Claim 5

Dependent Claim 102 words

An electrical interconnect and package assembly including, in combination: a. a semiconductor device, b. first and second metal frame members supporting said semiconductor device, c. first and second power leads positioned adjacent said first and second metal frame members, respectively, for providing power to said semiconductor device, and d. first and second Peltier semiconductor materials connected, respectively, between said first power lead and said first metal frame member and said second power lead and said second metal frame member for providing Peltier cooling junctions at the surfaces of said first and second metal frame members for cooling said semiconductor device mounted thereon.

Claim 6

Dependent Claim 49 words

The assembly defined in claim 3 wherein said first and second metal frame members and said first and second power leads are substantially co-planar for receiving said first and second Peltier semiconductor materials in a common support plane thereon and providing a compact packaging assembly for said semiconductor device.

Claim 7

Dependent Claim 106 words

An electrical interconnect and packaging assembly including, in combination: a. a semiconductor device, b. a metal substrate supporting said semiconductor device, c. a P-type Peltier semiconductor material extending from one location on an undersurface of said metal substrate, d. an N-type Peltier semiconductor material extending from another location on said underneath of said metal substrate, whereby said N-type and P-type semiconductor materials form first and second Peltier junctions at locations on the undersurface of said metal substrate, and e. means for passing current through said first and second Peltier junctions to provide heat absorption and a cooling effect thereat on the underside of said metal substrate.

Claim 8

Dependent Claim 106 words

An electrical interconnect and packaging assembly including, in combination: a. a semiconductor device, b. a metal substrate supporting said semiconductor device, c. a P-type Peltier semiconductor material extending from one location on an undersurface of said metal substrate, d. an N-type Peltier semiconductor material extending from another location on said underneath of said metal substrate, whereby said N-type and P-type semiconductor materials form first and second Peltier junctions at locations on the undersurface of said metal substrate, and e. means for passing current through said first and second Peltier junctions to provide heat absorption and a cooling effect thereat on the underside of said metal substrate.

Claim 9

Dependent Claim 44 words

The assembly defined in claim 5 wherein said current passing means includes first and second power leads mounted adjacent to said semiconductor device, and means connected between said power leads and said Peltier semiconductor materials for providing operating current to said Peltier semiconductor materials.

Claim 10

Dependent Claim 77 words

The assembly defined in claim 6 wherein said means for passing current through said Peltier junctions includes first and second wires extending from said first and second power leads, respectively, into electrical connection with said first and second Peltier junctions, whereby separate leads may be extended from said first and second power leads to both said Peltier junctions and to said semiconductor device to independently provide electrical bias and power thereto in the operation of said assembly.

Claim 11

Dependent Claim 56 words

An electronic cooling arrangement for a semiconductor substrate which includes positive and negative voltage supply conductors disposed on said substrate, and series-connected semiconductor and metal layers disposed in a layered configuration on or adjacent to a surface of said substrate to form one or more Peltier junctions connected between said positive and negative voltage supply conductors.

Claim 12

Dependent Claim 56 words

An electronic cooling arrangement for a semiconductor substrate which includes positive and negative voltage supply conductors disposed on said substrate, and series-connected semiconductor and metal layers disposed in a layered configuration on or adjacent to a surface of said substrate to form one or more Peltier junctions connected between said positive and negative voltage supply conductors.

Claim 13

Dependent Claim 18 words

The arrangement defined in claim 8 wherein metal layer is copper and said semiconductor layer is bismuth telluride.

Claim 14

Dependent Claim 50 words

The arrangement defined in claim 8 wherein series connected layers of copper, bismuth telluride and copper are disposed atop said surface of said substrate between said positive and negative voltage supply conductors and define Peltier junctions which terminate in a planar fashion at a surface passivation layer on said substrate.

Claim 15

Dependent Claim 142 words

An electrical interconnect and packaging assembly useful for cooling a wide variety of electronic devices including, in combination: a. a metal support member such as a transistor header or an integrated circuit lead frame, b. a P-type or N-type Peltier semiconductor layer mounted on said metal support member and forming a Peltier heating junction at the interface of said semiconductor layer and said metal support member, c. a thin metal layer disposed on the surface of said P-type or N-type Peltier semiconductor layer and forming thereat a Peltier cooling junction therewith, d. an electronic device disposed on the surface of said metal layer, and e. means for passing current through said Peltier cooling and heating junctions to provide Peltier cooling and heat absorption at the interface of said semiconductor layer and said thin metal layer and closely adjacent to said electronic device.

Claim 16

Dependent Claim 142 words

An electrical interconnect and packaging assembly useful for cooling a wide variety of electronic devices including, in combination: a. a metal support member such as a transistor header or an integrated circuit lead frame, b. a P-type or N-type Peltier semiconductor layer mounted on said metal support member and forming a Peltier heating junction at the interface of said semiconductor layer and said metal support member, c. a thin metal layer disposed on the surface of said P-type or N-type Peltier semiconductor layer and forming thereat a Peltier cooling junction therewith, d. an electronic device disposed on the surface of said metal layer, and e. means for passing current through said Peltier cooling and heating junctions to provide Peltier cooling and heat absorption at the interface of said semiconductor layer and said thin metal layer and closely adjacent to said electronic device.

Claim 17

Dependent Claim 88 words

The assembly defined in claim 11 wherein means for passing current includes first and second power leads located adjacent to said metal support member and connectable to positive and negative power supply terminals, whereby electrical conductors may be connected between said power leads and said electronic device and said metal support member, respectively, and between said electronic device and said thin metal layer to thereby complete a series electrical circuit through said Peltier cooling and heating junctions while simultaneously providing a DC operating bias for said electronic package.

Claim 18

Dependent Claim 144 words

A single series electrical circuit for cooling an electronic device while simultaneously providing series electrical current through said device to provide operating power thereto, said series electrical circuit including, in combination: a. a first power supply terminal, b. an electronic device connected to said power supply terminal, c. a Peltier cooling junction connected to one side of said electronic device, d. a Peltier heating junction connected to one side of said Peltier cooling junction, e. a heat sink connected to said Peltier heating junction, and f. a second power supply terminal connected to said heat sink, whereby increases or decreases in operating current through said electronic device causes proportional increases or decreases in Peltier current through said Peltier junctions and thus provides proportional increased or decreased cooling of said electronic device with variations in operating power and corresponding heat dissipation of said electronic device.

Claim 19

Dependent Claim 144 words

A single series electrical circuit for cooling an electronic device while simultaneously providing series electrical current through said device to provide operating power thereto, said series electrical circuit including, in combination: a. a first power supply terminal, b. an electronic device connected to said power supply terminal, c. a Peltier cooling junction connected to one side of said electronic device, d. a Peltier heating junction connected to one side of said Peltier cooling junction, e. a heat sink connected to said Peltier heating junction, and f. a second power supply terminal connected to said heat sink, whereby increases or decreases in operating current through said electronic device causes proportional increases or decreases in Peltier current through said Peltier junctions and thus provides proportional increased or decreased cooling of said electronic device with variations in operating power and corresponding heat dissipation of said electronic device.

Claim 20

Independent Claim 93 words

A system for cooling an electronic device which includes, in combination: a. means for passing current in series between two power supply terminals, and b. means serially connecting said device, a Peltier cooling junction, a Peltier heating junction and a heat sink in series between said two power supply terminals so that said series current passes through said electronic device, said Peltier cooling and heating junctions and said heat sink and thereby provides Peltier cooling of said electronic device which is proportional to the current and heat dissipation demands of said electronic device.

Claim 21

Independent Claim 93 words

A system for cooling an electronic device which includes, in combination: a. means for passing current in series between two power supply terminals, and b. means serially connecting said device, a Peltier cooling junction, a Peltier heating junction and a heat sink in series between said two power supply terminals so that said series current passes through said electronic device, said Peltier cooling and heating junctions and said heat sink and thereby provides Peltier cooling of said electronic device which is proportional to the current and heat dissipation demands of said electronic device.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1995-01-06	1995-07-08	1996-01-07	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1999-01-06	1999-07-08	2000-01-07	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2003-01-06	2003-07-08	2004-01-07	$7700.00	Window Closed / Lapsed

Semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies

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